G02B6/124

Semiconductor device and method of manufacturing

A semiconductor device includes a substrate, a trench in the substrate, the trench having an inclined sidewall, a reflective layer over the inclined sidewall, a grating structure over the substrate, and a waveguide in the trench. The waveguide is configured to guide optical signals between the grating structure and the reflective layer.

Integrated optical assembly apparatus and integrated fabrication method for coupling optical energy
09746608 · 2017-08-29 · ·

A novel optical assembly apparatus for coupling optical energy and a related method for creating the novel optical assembly apparatus are disclosed. In one embodiment, the novel optical assembly apparatus includes a high-index contrast waveguide constructed on a semiconductor die or another base substrate with an aligned optical coupling section, a grating coupler etched onto a surface, a micro mirror with an acute angle relative to the surface, and a waveguide taper that narrows an optical beam width. A light ray entered into the optical coupling section is redirected by the micro mirror to form a perpendicular ray entry angle with the grating coupler. The grating coupler then efficiently couples the light ray with the waveguide taper, which in turn narrows the optical beam width. The light ray may originate from a semiconductor die or from an optical fiber, which is purposefully aligned with the high-index contrast waveguide.

Integrated optical assembly apparatus and integrated fabrication method for coupling optical energy
09746608 · 2017-08-29 · ·

A novel optical assembly apparatus for coupling optical energy and a related method for creating the novel optical assembly apparatus are disclosed. In one embodiment, the novel optical assembly apparatus includes a high-index contrast waveguide constructed on a semiconductor die or another base substrate with an aligned optical coupling section, a grating coupler etched onto a surface, a micro mirror with an acute angle relative to the surface, and a waveguide taper that narrows an optical beam width. A light ray entered into the optical coupling section is redirected by the micro mirror to form a perpendicular ray entry angle with the grating coupler. The grating coupler then efficiently couples the light ray with the waveguide taper, which in turn narrows the optical beam width. The light ray may originate from a semiconductor die or from an optical fiber, which is purposefully aligned with the high-index contrast waveguide.

PHOTONICALLY INTEGRATED CHIP, OPTICAL COMPONENT HAVING A PHOTONICALLY INTEGRATED CHIP, AND METHOD FOR THE PRODUCTION THEREOF

The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).

With respect to the chip, the invention provides for an optical diffraction and refraction structure (100, 100a) to be integrated in a material layer of the chip (2) above or below the optical grating coupler (60) or in a plurality of material layers above or below the optical grating coupler (60) or on the rear side of the substrate (20), which diffraction and refraction structure carries out beam shaping of the radiation before it is coupled into the waveguide or after it has been coupled out of the waveguide.

PHOTONICALLY INTEGRATED CHIP, OPTICAL COMPONENT HAVING A PHOTONICALLY INTEGRATED CHIP, AND METHOD FOR THE PRODUCTION THEREOF

The invention relates, inter alia, to a photonically integrated chip (2) having a substrate (20), a plurality of material layers arranged on a top side (21) of the substrate (20), an optical waveguide which is integrated in one or more wave-guiding material layers of the chip (2), and a grating coupler (60) which is formed in the optical waveguide and causes beam deflection of radiation guided in the waveguide in the direction out of the layer plane of the wave-guiding material layer(s) or causes beam deflection of radiation to be coupled into the waveguide in the direction into the layer plane of the wave-guiding material layer(s).

With respect to the chip, the invention provides for an optical diffraction and refraction structure (100, 100a) to be integrated in a material layer of the chip (2) above or below the optical grating coupler (60) or in a plurality of material layers above or below the optical grating coupler (60) or on the rear side of the substrate (20), which diffraction and refraction structure carries out beam shaping of the radiation before it is coupled into the waveguide or after it has been coupled out of the waveguide.

Photonic devices integrated with reflectors

The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

Bidirectional photonic integrated circuit with suppressed reflection

A photonic integrated circuit is presented that includes a substrate, and a first and second waveguide patterned on the substrate. The first waveguide guides an input beam of radiation. The photonic integrated circuit also includes a coupling region, wherein the first and second waveguides each pass through the coupling region. One or more modulating elements are coupled to each of the first and second waveguides. The first waveguide and the second waveguide have a first facet and a second facet, respectively, and first and second reflections are generated at the first and second facets within the first and second waveguides, respectively. The one or more modulating elements coupled to each of the first and second waveguides are designed to adjust the phase of the first and second reflections before the first and second reflections pass through the coupling region.

Bidirectional photonic integrated circuit with suppressed reflection

A photonic integrated circuit is presented that includes a substrate, and a first and second waveguide patterned on the substrate. The first waveguide guides an input beam of radiation. The photonic integrated circuit also includes a coupling region, wherein the first and second waveguides each pass through the coupling region. One or more modulating elements are coupled to each of the first and second waveguides. The first waveguide and the second waveguide have a first facet and a second facet, respectively, and first and second reflections are generated at the first and second facets within the first and second waveguides, respectively. The one or more modulating elements coupled to each of the first and second waveguides are designed to adjust the phase of the first and second reflections before the first and second reflections pass through the coupling region.

BEAM STEERING AND RECEIVING METHOD BASED ON AN OPTICAL SWITCH ARRAY

An optical apparatus comprising an optical switch array comprising a plurality of optical switches configured to selectively route light through one or more of a plurality of waveguides, a plurality of emitters, wherein at least one emitter of the plurality of emitters is disposed in communication with the one or more of the plurality of waveguides and configured to receive light and cause at least a portion of the light to exit the waveguide, and a lens disposed to receive light exiting the one or more of a plurality of waveguides via the at least one emitter, wherein the lens is configured to direct the received light as an optical output, and wherein the position of the at least one emitter relative to the lens facilitates beam steering of the optical output.

Methods of optical device fabrication using an electron beam apparatus

Aspects of the disclosure relate to apparatus for the fabrication of waveguides. In one example, an angled ion source is utilized to project ions toward a substrate to form a waveguide which includes angled gratings. In another example, an angled electron beam source is utilized to project electrons toward a substrate to form a waveguide which includes angled gratings. Further aspects of the disclosure provide for methods of forming angled gratings on waveguides utilizing an angled ion beam source and an angled electron beam source.