Techniques for forming a photonic integrated circuit having a facet coupler and a surface coupler are described. The photonic integrated circuit may be on a wafer, which may be diced to form an integrated device. The facet coupler may be positioned proximate to an edge of the integrated device, and the surface coupler may be positioned on a surface of the integrated device. The surface coupler may allow for evaluation and assessment of the circuit's performance, which may facilitate wafer-level testing of the circuit and diagnosis of the circuit before and after packaging.

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

The present disclosure relates to semiconductor structures and, more particularly, to photonics chips and methods of manufacture. A structure includes: a photonics chip having a grated optical coupler; an interposer attached to the photonics chip, the interposer having a grated optical coupler; an optical epoxy material provided between the grated optical coupler of the photonics chip and the grated optical coupler of the interposer; and epoxy underfill material provided at interstitial regions between the photonics chip and the interposer which lie outside of an area of the grated optical couplers of the photonics chip and the interposer.

A device includes an optical splitter comprising a plurality of splitter outputs. The splitter outputs are out of phase and include a non-uniform phase front. The device includes a one-dimensional phase compensation array communicating with the optical splitter. The phase compensation array receives the non-uniform phase front and outputs a uniform phase front. The phase compensation array includes a plurality of array outputs. The device includes a tunable linear gradient phase shifter communicating with said phase compensation array to impart a linearly-varying phase shift across said plurality of array outputs, thereby steering a beam along a first angle in a first plane. The device includes a waveguide grating out-coupler communicating with said linear gradient phase shifter, and a uniform phase shifter communicating with the waveguide grating out-coupler. The uniform phase shifter steers the flat phase front along a second angle in a second plane perpendicular to said first plane.

A device includes an optical splitter comprising a plurality of splitter outputs. The splitter outputs are out of phase and include a non-uniform phase front. The device includes a one-dimensional phase compensation array communicating with the optical splitter. The phase compensation array receives the non-uniform phase front and outputs a uniform phase front. The phase compensation array includes a plurality of array outputs. The device includes a tunable linear gradient phase shifter communicating with said phase compensation array to impart a linearly-varying phase shift across said plurality of array outputs, thereby steering a beam along a first angle in a first plane. The device includes a waveguide grating out-coupler communicating with said linear gradient phase shifter, and a uniform phase shifter communicating with the waveguide grating out-coupler. The uniform phase shifter steers the flat phase front along a second angle in a second plane perpendicular to said first plane.

Embodiments described herein relate to methods of forming gratings with different slant angles on a substrate and forming gratings with different slant angles on successive substrates using angled etch systems. The methods include positioning portions of substrates retained on a platen in a path of an ion beam. The substrates have a grating material disposed thereon. The ion beam is configured to contact the grating material at an ion beam angle θ relative to a surface normal of the substrates and form gratings in the grating material. The substrates are rotated about an axis of the platen resulting in rotation angles ϕ between the ion beam and a surface normal of the gratings. The gratings have slant angles θ′ relative to the surface normal of the substrates. The rotation angles ϕ selected by an equation ϕ=cos.sup.−1(tan(θ′)/tan(θ)).

A method of manufacturing an optical engine includes bonding a plurality of laser diodes directly or indirectly to a base substrate and coupling at least one laser diode driver circuit to the laser diodes. In operation the at least one laser diode driver circuit selectively drives current to the laser diodes. The method further includes bonding a plurality of collimation lenses to the base substrate proximate the plurality of laser diodes and bonding a cap including at least one wall and at least one optical window to the base substrate. The method also includes bonding a grating waveguide combiner proximate the optical window of the cap. In operation, the grating waveguide combiner receives a plurality of beams of light at a respective plurality of input grating couplers and combines the plurality of beams of light to provide a collimated aggregated beam of light at an output grating coupler.

A method of manufacturing an optical engine includes bonding a plurality of laser diodes directly or indirectly to a base substrate and coupling at least one laser diode driver circuit to the laser diodes. In operation the at least one laser diode driver circuit selectively drives current to the laser diodes. The method further includes bonding a plurality of collimation lenses to the base substrate proximate the plurality of laser diodes and bonding a cap including at least one wall and at least one optical window to the base substrate. The method also includes bonding a grating waveguide combiner proximate the optical window of the cap. In operation, the grating waveguide combiner receives a plurality of beams of light at a respective plurality of input grating couplers and combines the plurality of beams of light to provide a collimated aggregated beam of light at an output grating coupler.

Techniques relating to an improved optical waveguide are described. The optical waveguide includes an upper and lower waveguide that each comprise a first and second layer, in which photons are transferred from the lower waveguide to the upper waveguide. A structured subwavelength coupling region is included, for example, in the first upper waveguide layer. The fill factor of the subwavelength grating coupling region is increased in the direction of light propagation to increase the index of refraction of the structured subwavelength coupling region and therefore improve photon transfer from the lower waveguide. Additionally, the width of the optical waveguide (at least along the structured subwavelength coupling region) remains constant as the fill factor increases.

Techniques relating to an improved optical waveguide are described. The optical waveguide includes an upper and lower waveguide that each comprise a first and second layer, in which photons are transferred from the lower waveguide to the upper waveguide. A structured subwavelength coupling region is included, for example, in the first upper waveguide layer. The fill factor of the subwavelength grating coupling region is increased in the direction of light propagation to increase the index of refraction of the structured subwavelength coupling region and therefore improve photon transfer from the lower waveguide. Additionally, the width of the optical waveguide (at least along the structured subwavelength coupling region) remains constant as the fill factor increases.