A method of manufacturing an optoelectronic device. The manufactured device includes a photonic component coupled to a waveguide. The method comprising: providing a device coupon, the device coupon including the photonic component; providing a silicon platform, the silicon platform comprising a cavity within which is a bonding surface for the device coupon; transfer printing the device coupon onto the cavity, such that a surface of the device coupon directly abuts the bonding surface and at least one channel is present between the device coupon and a sidewall of the cavity; and filling the at least one channel with a filling material via a spin-coating process, to form a bridge coupling the III-V semiconductor based photonic component to the silicon waveguide.

A method of manufacturing an optoelectronic device. The manufactured device includes a photonic component coupled to a waveguide. The method comprising: providing a device coupon, the device coupon including the photonic component; providing a silicon platform, the silicon platform comprising a cavity within which is a bonding surface for the device coupon; transfer printing the device coupon onto the cavity, such that a surface of the device coupon directly abuts the bonding surface and at least one channel is present between the device coupon and a sidewall of the cavity; and filling the at least one channel with a filling material via a spin-coating process, to form a bridge coupling the III-V semiconductor based photonic component to the silicon waveguide.

A silicon- and optical phased array-based integrated optically adjustable delay line, comprising, an optical phased array transmitting unit, a slab waveguide transmitting unit, and an optical phased array receiving unit that are sequentially arranged. By the optical phase control transmitting unit, the phase difference between channels is regulated and controlled via a phase shifter to change a far-field interference light spot and form a wave beam with directivity to regulate and control an incident angle of an optical signal entering the slab waveguide, thus changing the propagation path length of the optical signal. Finally, the optical signal is received by a corresponding optical phased array receiving unit to obtain different delay amounts. Large adjustable delay amount is realized and the delay line has the advantages of simple structure and control and high integration level with high application value in optical communication and microwave photonic and optical signal processing.

A silicon- and optical phased array-based integrated optically adjustable delay line, comprising, an optical phased array transmitting unit, a slab waveguide transmitting unit, and an optical phased array receiving unit that are sequentially arranged. By the optical phase control transmitting unit, the phase difference between channels is regulated and controlled via a phase shifter to change a far-field interference light spot and form a wave beam with directivity to regulate and control an incident angle of an optical signal entering the slab waveguide, thus changing the propagation path length of the optical signal. Finally, the optical signal is received by a corresponding optical phased array receiving unit to obtain different delay amounts. Large adjustable delay amount is realized and the delay line has the advantages of simple structure and control and high integration level with high application value in optical communication and microwave photonic and optical signal processing.

According to an embodiment, an apparatus includes a first grating and a second grating in a stack with the first grating. The first grating includes a first plurality of scatterers in a first two-dimensional (2D) arrangement. The second grating includes a second plurality of scatterers in a second 2D arrangement. The first grating and the second grating are arranged to redirect a first optical signal and a second optical signal traveling through the stack. The first optical signal enters the stack in a first direction, and the second optical signal enters the stack in a second direction different from the first direction. Each of the second plurality of scatterers is offset from a corresponding scatterer of the first plurality of scatterers in a third direction different from the first and second directions. Other embodiments include a method performed by the apparatus.

The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.

Various embodiments of the present disclosure are directed towards an integrated chip including a protective ring structure overlying a grating coupler structure. A waveguide structure is disposed within a semiconductor substrate and comprises the grating coupler structure. An interconnect structure overlies the semiconductor substrate. The interconnect structure includes a contact etch stop layer (CESL) and a conductive contact over the semiconductor substrate. The conductive contact extends through the CESL. The protective ring structure extends through the CESL and has an upper surface aligned with an upper surface of the conductive contact.

Various embodiments of the present disclosure are directed towards an integrated chip including a protective ring structure overlying a grating coupler structure. A waveguide structure is disposed within a semiconductor substrate and comprises the grating coupler structure. An interconnect structure overlies the semiconductor substrate. The interconnect structure includes a contact etch stop layer (CESL) and a conductive contact over the semiconductor substrate. The conductive contact extends through the CESL. The protective ring structure extends through the CESL and has an upper surface aligned with an upper surface of the conductive contact.

To provide a planar lightwave circuit capable of being optically connected to a semiconductor optical element or an optical wiring component in a simple, precise, and stable manner without an increase in circuit footprint or the number of fabrication steps or a deterioration of characteristics. By arranging a dummy optical waveguide having a mirror function in the vicinity of an input/output waveguide of an optical functional circuit forming the planar lightwave circuit, a semiconductor optical element or an optical wiring component can be easily aligned with and fixed to the optical functional circuit by monitoring the reflection light intensity from the dummy optical waveguide. When the optical functional circuit has a plurality of input/output waveguides to be optically connected, each input/output waveguide can be identified if the dummy optical waveguides having the mirror function have different reflection properties (such as reflectance, width, position, or reflection wavelength).

The systems and methods discussed herein are for the fabrication of diffraction gratings, such as those gratings used in waveguide combiners. The waveguide combiners discussed herein are fabricated using nanoimprint lithography (NIL) of high-index and low-index materials in combination with and directional etching high-index and low-index materials. The waveguide combiners can be additionally or alternatively formed by the directional etching of transparent substrates. The waveguide combiners that include diffraction gratings discussed herein can be formed directly on permanent transparent substrates. In other examples, the diffraction gratings can be formed on temporary substrates and transferred to a permanent, transparent substrate.