Optical coupler structures have an insulator layer on a substrate, a waveguide structure in the insulator layer, and a cladding layer on the waveguide structure and the insulator layer. Optical grating couplers are on the cladding layer and the waveguide structure is connected between the optical grating couplers. The waveguide structure is discontinuous between the optical grating couplers. The insulator layer includes an array at a transmission blocking region between discontinuous sections of the waveguide structure. This array can be a void opening array of openings or can be a blocking element array of disconnected elements in the insulator layer.

Optical coupler structures have an insulator layer on a substrate, a waveguide structure in the insulator layer, and a cladding layer on the waveguide structure and the insulator layer. Optical grating couplers are on the cladding layer and the waveguide structure is connected between the optical grating couplers. The waveguide structure is discontinuous between the optical grating couplers. The insulator layer includes an array at a transmission blocking region between discontinuous sections of the waveguide structure. This array can be a void opening array of openings or can be a blocking element array of disconnected elements in the insulator layer.

A package includes a laser diode includes a bonding layer; a first dielectric layer over the laser diode, wherein the first dielectric layer is directly bonded to the bonding layer of the laser diode; a first silicon nitride waveguide in the first dielectric layer, wherein the first silicon nitride waveguide extends over the laser diode; a second dielectric layer over the first silicon nitride waveguide; a silicon waveguide in the second dielectric layer; an interconnect structure over the silicon waveguide; and conductive features extending through the first dielectric layer and the second dielectric layer to electrically contact the interconnect structure.

A package includes a laser diode includes a bonding layer; a first dielectric layer over the laser diode, wherein the first dielectric layer is directly bonded to the bonding layer of the laser diode; a first silicon nitride waveguide in the first dielectric layer, wherein the first silicon nitride waveguide extends over the laser diode; a second dielectric layer over the first silicon nitride waveguide; a silicon waveguide in the second dielectric layer; an interconnect structure over the silicon waveguide; and conductive features extending through the first dielectric layer and the second dielectric layer to electrically contact the interconnect structure.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

Apparatuses, systems and methods for optical coupling, optical integration, electro-optical coupling, and electro-optical packaging are described herein. Optical couplers may comprise various optical elements (e.g., mirrors as described herein) to relax optical assembly requirements and improve producibility. Optical couplers may improve fiber-to-chip, fiber-to-fiber and chip-to-chip optical connection. Optical couplers and optical components may be used to improve integration of, connection of, and/or packaging of optical systems and/or components with electrical systems and/or components.

A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.

A method of fabricating a photonic device includes in part, forming a multitude of metal and dielectric layers over a semiconductor substrate to form a structure. The metal layers form a continuous metal trace that characterize an etch channel. At least one of the metal layers extends towards an exterior surface of the structure such that when the structure is exposed to a metal etch, the metal etch removes the metal from the exterior surface of the structure and flows through the etch channel to fully etch the metal layers. The metal etch leaves behind a dielectric structure characterizing a photonic device. The photonic device may be a suspended rib waveguide, a suspended channel waveguide, a grating coupler, an interlayer coupler, a photodetector, a phase modulator, an edge coupler, and the like. A photonics system may include one or more of such devices.

Integrated target waveguide devices and optical analytical systems comprising such devices are provided. The target devices include an optical coupler that is optically coupled to an integrated waveguide and that is configured to receive optical input from an optical source through free space, particularly through a low numerical aperture interface. The devices and systems are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices provide for the efficient and reliable coupling of optical excitation energy from an optical source to the optical reactions. Optical signals emitted from the reactions can thus be measured with high sensitivity and discrimination. The devices and systems are well suited for miniaturization and high throughput.

Integrated target waveguide devices and optical analytical systems comprising such devices are provided. The target devices include an optical coupler that is optically coupled to an integrated waveguide and that is configured to receive optical input from an optical source through free space, particularly through a low numerical aperture interface. The devices and systems are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices provide for the efficient and reliable coupling of optical excitation energy from an optical source to the optical reactions. Optical signals emitted from the reactions can thus be measured with high sensitivity and discrimination. The devices and systems are well suited for miniaturization and high throughput.