Embodiments of an optical adhesive are provided. The optical adhesive includes about 20% to about 60% by volume of first monomers. The first monomers have at least two acrylate or methacrylate groups. The optical adhesive also includes about 40% to about 80% by volume of second monomers. The second monomers have at least one fluorine atom and at least one acrylate or methacrylate group. The optical adhesive has a refractive index of from about 1.40 to about 1.55, and in the temperature range of about 10 C. to about 85 C., the refractive index of the optical adhesive has a thermal drift dn/dT of less than about 410.sup.4/ C. Embodiments of a mechanical joint between two optical fiber segments using the optical adhesive and embodiments of a method for joining two optical fiber segments are also provided.

Aspects of the disclosure relate to apparatus for the fabrication of waveguides. In one example, an angled ion source is utilized to project ions toward a substrate to form a waveguide which includes angled gratings. In another example, an angled electron beam source is utilized to project electrons toward a substrate to form a waveguide which includes angled gratings. Further aspects of the disclosure provide for methods of forming angled gratings on waveguides utilizing an angled ion beam source and an angled electron beam source.

We describe a high coupling-efficiency waveguide grating coupler for use in the optical interface between a planar multimode waveguide and a multimode optical fiber in mode division multiplexed optical communication systems. The multimode waveguide grating coupler can launch light from the different modes of the planar waveguide into the different modes of the multimode optical fiber and vice-versa. A silicon based multimode waveguide grating coupler was used to couple two polarizations of a multimode silicon waveguide into the LP01 mode and LP11 mode from a step index multi-mode fiber (MMFs). Simulations of the preliminary design predicted the coupling efficiency to be 4.3 dB for LP01 mode and 5.0 dB for the LP11 mode. Experimental coupling efficiency of 4.9 dB and 6.1 dB were obtained for LP01 and LP11, respectively. The multiplexer can be passive.

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.

In an example embodiment, a system includes a first grating-coupled laser (GCL) that includes a first laser cavity optically coupled to a first transmit grating coupler configured to redirect horizontally-propagating first light, received from the first laser cavity, vertically downward and out of the first GCL. The system also includes a second GCL that includes a second laser cavity optically coupled to a second transmit grating coupler configured to transmit second light vertically downward and out of the second GCL. The system also includes a photonic integrated circuit (PIC) that includes a first receive grating coupler optically coupled to a first waveguide and configured to receive the first light and couple the first light into the first waveguide. The PIC also includes a second receive grating coupler optically coupled to a second waveguide and configured to receive the second light and couple the second light into the second waveguide.

In an example embodiment, a system includes a first grating-coupled laser (GCL) that includes a first laser cavity optically coupled to a first transmit grating coupler configured to redirect horizontally-propagating first light, received from the first laser cavity, vertically downward and out of the first GCL. The system also includes a second GCL that includes a second laser cavity optically coupled to a second transmit grating coupler configured to transmit second light vertically downward and out of the second GCL. The system also includes a photonic integrated circuit (PIC) that includes a first receive grating coupler optically coupled to a first waveguide and configured to receive the first light and couple the first light into the first waveguide. The PIC also includes a second receive grating coupler optically coupled to a second waveguide and configured to receive the second light and couple the second light into the second waveguide.

A laser-written waveguide comprising, an optical substrate having a first refractive index, a plurality of laser-written tracks buried within the optical substrate and having a second refractive index lower than the first refractive index, one or more concentric geometric regions bounding the plurality of laser-written tracks and a waveguide channel delimited by said concentric geometric regions, wherein said waveguide channel is configured to allow formation of an optical mode.

Optical alignment of an optical connector to input/output couplers of a photonic integrated circuit can be achieved by first actively aligning the optical connector successively to two loopback alignment features formed in the photonic chip of the PIC, optically unconnected to the PIC, and then moving the optical connector, based on precise knowledge of the positions of the loopback alignment features relative to the input/output couplers of the PIC, to a position aligned with the input/output couplers of the PIC and locking it in place.

An integrated optical beam steering system is configured in three stages to provide beam steering for image light from an imager (e.g., laser, light emitting diode, or other light source) to downstream elements in a display system such as an exit pupil expander (EPE) in a mixed-reality computing device. The first stage includes a multi-level cascaded array of optical switches that are configurable to spatially route image light over a first dimension of a two-dimensional (2D) field of view (FOV) of the display system. The second waveguiding stage transfers the image light along preformed waveguides to a collimator in the third stage which is configured to collimate the image light along the first dimension of the FOV (e.g., horizontal). The waveguiding and collimating stages may be implemented using lightweight photonic crystal nanostructures.