Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, where the grating coupler has increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be caused by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be caused by a transition of shapes of scatterers in the grating coupler.

Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, where the grating coupler has increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be caused by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be caused by a transition of shapes of scatterers in the grating coupler.

The present disclosure provides a semiconductor device, including a semiconductive substrate, a dielectric stack disposed over the semiconductive substrate to form a wall of a grating coupler opening, and an etch stopper interfacing with two sublayers of the dielectric stack and partially separating the interface of the two sublayers. The etch stopper has a resistance to a fluorine solution that is higher than that of the two sublayers. A method of manufacturing the semiconductor device is also provided.

The present disclosure provides a semiconductor device, including a semiconductive substrate, a dielectric stack disposed over the semiconductive substrate to form a wall of a grating coupler opening, and an etch stopper interfacing with two sublayers of the dielectric stack and partially separating the interface of the two sublayers. The etch stopper has a resistance to a fluorine solution that is higher than that of the two sublayers. A method of manufacturing the semiconductor device is also provided.

Optical waveguides and couplers for delivering light to an array of photonic elements in a photonic integrated device. The photonic integrated device and related instruments and systems may be used to analyze samples in parallel. The photonic integrated device may include a grating coupler configured to receive light from an external light source and optically couple with multiple waveguides configured to optically couple with sample wells of the photonic integrated device.

Optical waveguides and couplers for delivering light to an array of photonic elements in a photonic integrated device. The photonic integrated device and related instruments and systems may be used to analyze samples in parallel. The photonic integrated device may include a grating coupler configured to receive light from an external light source and optically couple with multiple waveguides configured to optically couple with sample wells of the photonic integrated device.

A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.

A photonic integrated circuit package includes a first substrate including a first mirror and an optical coupling device spaced apart from each other, and a second substrate on an upper portion of the first substrate, the second substrate including an electro-optical converter and a second mirror, the electro-optical converter to output an optical signal to the first mirror, and the second mirror to reflect an optical signal reflected by and received from the first mirror to the optical coupling device.

An optical apparatus 20 for evanescently coupling an optical signal across an interface 30 is described. The optical apparatus 20 comprises a first substrate 22 and a second substrate 24. The optical signal is evanescently coupled between a first waveguide 26 formed by laser inscription of the first substrate 22 and a second waveguide 28 of the second substrate 22. The first waveguide 26 comprises a curved section 34 configured to provide evanescent coupling of the optical signal between the first and second waveguides 26, 28 via the interface 30.

A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45 angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.