Patent classifications
G02B6/138
High-throughput manufacturing of photonic integrated circuit (PIC) waveguides using multiple exposures
In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material having a refractive index that decreases by exposure to the radiation and subsequent heating. At least one region of the polymer film that was not previously exposed to the radiation is selectively exposing to a second dosage of radiation. The second dosage of radiation is less than the first dosage of radiation. The polymer film is heated to complete curing of the polymer film.
High-throughput manufacturing of photonic integrated circuit (PIC) waveguides using multiple exposures
In accordance with a method of forming a waveguide in a polymer film disposed on a substrate, a plurality of regions on a polymer film are selectively exposed to a first dosage of radiation. The polymer film is formed from a material having a refractive index that decreases by exposure to the radiation and subsequent heating. At least one region of the polymer film that was not previously exposed to the radiation is selectively exposing to a second dosage of radiation. The second dosage of radiation is less than the first dosage of radiation. The polymer film is heated to complete curing of the polymer film.
Energy absorbing tubes and methods of making the same
An energy absorbing structure configured to buckle in response to an impulsive load includes a facesheet and a micro-truss core coupled to the facesheet. The facesheet and the micro-truss core are wound together into a hollow tube structure. The hollow tube structure may have any shape suitable for the intended application of the energy absorbing structure, including prismatic shapes, non-prismatic shapes, axisymmetric shapes, and non-axisymmetric shapes. In one embodiment, the stiffness of the micro-truss core varies axially, radially, and/or circumferentially along the energy absorbing structure.
Hierarchical branched micro-truss structure and methods of manufacturing the same
Branched hierarchical micro-truss structures may be incorporated into energy-absorbing structures to exhibit a tailored multi-stage buckling response to a range of different compressive loads. Branched hierarchical micro-truss structures may also be configured to function as vascular systems to deliver fluid for thermal load management or altering the aerodynamic properties of a vehicle or structure into which the branched hierarchical micro-truss structure is incorporated. The branched hierarchical micro-truss structure includes a first layer having a series of interconnected struts and a second layer having a series of struts branching outward from an end of each of the struts in the first layer.
OPTICAL MODULATOR
An optical modulator for switching an optical signal of wavelength λ from one waveguide-electrode to another requires that both waveguide-electrodes be made of an electrically conducting material. Also, a non-conducting cross-coupling material fills a slot along a length L between the waveguide-electrodes. Importantly, cross-coupling material in the slot provides a separation distance x.sub.c between the waveguide-electrodes that is less than 0.35 microns. When a switching voltage V.sub.π is selectively applied to the waveguide-electrodes, a strong uniform electric field E is created within the cross-coupling material. Thus, E modulates the cross-coupling length of the optical signal by an increment ±Δ each time it passes back and forth through the cross-coupling material along the length L. Thus, after an N number of cross-coupling length cycles along the length L, when NΔ equals one cross-coupling length, the optical signal is switched from one waveguide-electrode to the other.
Non-Telecentric Light Guide Elements
The present disclosure relates to systems and methods relating to the fabrication of light guide elements. An example system includes an optical component configured to direct light emitted by a light source to illuminate a photoresist material at one or more desired angles so as to expose an angled structure in the photoresist material. The photoresist material overlays at least a portion of a first surface of a substrate. The optical component includes a container containing a light-coupling material that is selected based in part on the one or more desired angles. The system also includes a reflective surface arranged to reflect at least a first portion of the emitted light to illuminate the photoresist material at the one or more desired angles.
CHALCOGENIDE HYBRID ORGANIC/INORGANIC POLYMERS FILMS AND COATINGS AND THE USE THEREOF
The present invention provides certain CHIP films and coatings, as well as the preparation and uses thereof. Chalcogenide hybrid organic/inorganic polymers or CHIPs may be suitable for use in antireflection coatings for use with infrared optics, for example as applied to lenses for infrared cameras. The coatings may be applied with spin coating and have a thickness related to the quarter wavelength of the desired infrared wavelengths.
Singulation of optical waveguide materials
Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.
Singulation of optical waveguide materials
Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.
Optical Connection Component and Optical Connection Structure
Provided is an optical connection component that is constituted of a plate-shaped substrate configured to transmit light to be used, and a resin optical waveguide. The resin optical waveguide is constituted of a resin core formed with a resin through which light to be used passes. For example, the resin core is formed with a light-cured resin. The resin optical waveguide uses air surrounding the resin core as a cladding. The resin core has a folded back structure in which the resin core once separates from the surface of the substrate and then returns to the surface of the substrate, and is connected to each of a first input/output end and a second input/output end of the substrate.