Fabricating light guide elements includes forming a first portion of the light guide element using a replication technique (104), and forming a second portion of the light guide element using a photolithographic technique (106). Use of replication can facilitate formation of more complex-shaped optical elements as part of the light guide element. The replication process sometimes results in the formation of a “yard,” or excess replication material, which may lead to light leakage if not removed or smoothed over. In some instances, at least part of the yard portion is embedded within the second portion of the light guide element, thereby resulting in a smoothing over of the yard portion.

A waveguide includes a segment with a substantially uniform cure profile and related methods and systems for making and using the same. The waveguide is formed by modifying a laser beam used to write the waveguide to provide a substantially uniform cure profile in the waveguide. A marker characteristic of laser writing may be present in the waveguide. A method or system modifies an intensity profile or a shape profile of a laser beam to proactively compensate for exposure convolution based on the characteristics of the laser beam spot profile. A convolution compensator is positioned in the path of the laser beam to modify the beam spot profile during writing to form the one or more segments of the waveguide in a photo-curable layer.

A waveguide includes a segment with a substantially uniform cure profile and related methods and systems for making and using the same. The waveguide is formed by modifying a laser beam used to write the waveguide to provide a substantially uniform cure profile in the waveguide. A marker characteristic of laser writing may be present in the waveguide. A method or system modifies an intensity profile or a shape profile of a laser beam to proactively compensate for exposure convolution based on the characteristics of the laser beam spot profile. A convolution compensator is positioned in the path of the laser beam to modify the beam spot profile during writing to form the one or more segments of the waveguide in a photo-curable layer.

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board (OPCB) includes applying a coupling agent to a bonding surface of a flexible, freestanding polymer waveguide array film having at least one polymer waveguide disposed therein. The waveguide array film is placed onto the first and second photonic chips so that the waveguide array film extends over a gap and/or a step between the first and second photonic chips to thereby form a bonding interface between the bonding surface of the waveguide array film and the first and second photonic chips. The coupling agent is selected such that optical coupling between the first and second photonic chips arises simultaneously with formation of the bonding interface.

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board includes applying a flexible, freestanding film onto the first and second chips so that the film extends over a gap and/or step between the chips. The film includes a photosensitive layer having a refractive index that decreases by exposure to radiation and a backing layer. The film is exposed to a flood exposure having a radiation dosage penetrating the backing layer and only a surface sublayer of the photosensitive layer. After curing the film, the backing layer is removed so that the photosensitive layer remains on the first and second chips. The photosensitive layer is selectively exposed to a second radiation dosage to define waveguide core(s) in unexposed regions of the photosensitive layer below the surface sublayer. The photosensitive layer is heated to cure the selectively exposed portions.

A method of forming an optical interconnect between first and second photonic chips located on an optical printed circuit board includes applying a flexible, freestanding film onto the first and second chips so that the film extends over a gap and/or step between the chips. The film includes a photosensitive layer having a refractive index that decreases by exposure to radiation and a backing layer. The film is exposed to a flood exposure having a radiation dosage penetrating the backing layer and only a surface sublayer of the photosensitive layer. After curing the film, the backing layer is removed so that the photosensitive layer remains on the first and second chips. The photosensitive layer is selectively exposed to a second radiation dosage to define waveguide core(s) in unexposed regions of the photosensitive layer below the surface sublayer. The photosensitive layer is heated to cure the selectively exposed portions.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Methods for singulating an optical waveguide material at a contour include directing a first laser beam onto a first side of the optical waveguide material to generate a first group of perforations in the optical waveguide material. A second laser beam is directed onto a second side of the optical waveguide material to generate a second group of perforations in the optical waveguide material. The second side is opposite the first side. The first group of perforations and the second group of perforations define a perforation zone at the contour. A third laser beam is directed at the perforation zone to singulate the optical waveguide material at the perforation zone.

Disclosed herein is a fully flexible photonic platform based on a high density, flexible array of ultra-compact optical waveguides composed of biocompatible polymers Parylene C and PDMS. The photonic platform features unique embedded input/output micro-mirrors that redirect light from the waveguides perpendicularly to the surface of the array for localized, patterned illumination in tissue. This architecture enables the design of a fully flexible, compact integrated photonic system to realize an implantable, wearable or on-chip photonic platform for application such as in vivo chronic optogenetic stimulation of brain activity.

Provided is an optical waveguide comprising a core surrounded by a cladding, wherein the core is in the shape of a trapezoid with sidewall angles between 60° and 85° and an opto-electronic circuit comprising the optical waveguide. Operational characteristics of the optical waveguide are shown to be superior to those of incumbent devices.