An electrical optical isolation circuit and device characterized by a light source, a light-sensitive sensor, and a variable shield between the light source and the light-sensitive sensor, the variable shield being adjustable after assembly of the electrical circuit, and the variable shield adjustment providing attenuation of the electrical circuit output.

The present disclosure provides a MEMS -based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.

An optical device includes a waveguide configured to guide light, a taper integrated with the waveguide on a substrate configured for optical coupling, and an attenuator to degrade unwanted optical signal from the taper. The attenuator extends along one side of the taper, and includes one of a conductive structure, a doped structure and a refractive structure.

The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.

The present disclosure relates to semiconductor structures and, more particularly, to waveguide attenuators and methods of manufacture. The structure includes: a main bus waveguide structure; a first hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a first geometry of material; and a second hybrid waveguide structure evanescently coupled to the main bus waveguide structure and comprising a second geometry of the material.

A fiber optic probe is provided with a distal sampling end, a proximal end, and light delivery and collection paths therethrough. The probe includes a window disposed at the distal sampling end of the fiber optic probe, the window having a distal end and a proximal end. A lens is disposed near the proximal end of the window, the lens having a distal end, a proximal end, and an aperture. A light delivery optical fiber is provided having a distal end and a proximal end, the light rays being directed through the aperture. A collection optical fiber is provided in optical communication with the lens and the window. The probe may include a lens collection filter disposed between the window and the lens and an optical isolator provided within the aperture to optically isolate the light delivery path and the light collection path.

A fiber optic probe is provided with a distal sampling end, a proximal end, and light delivery and collection paths therethrough. The probe includes a window disposed at the distal sampling end of the fiber optic probe, the window having a distal end and a proximal end. A lens is disposed near the proximal end of the window, the lens having a distal end, a proximal end, and an aperture. A light delivery optical fiber is provided having a distal end and a proximal end, the light rays being directed through the aperture. A collection optical fiber is provided in optical communication with the lens and the window. The probe may include a lens collection filter disposed between the window and the lens and an optical isolator provided within the aperture to optically isolate the light delivery path and the light collection path.

An optical switch incorporated in a photomedical system, and a method of treating tissue using the optical switch for creating pulsed light. A light source generates an optical beam. An aperture element includes a light-transmitting portion and a light-blocking portion. An optical element such as a mirror, prism or lens directs the optical beam to the aperture element, wherein the optical element is movable for translating the optical beam across the light-transmitting and light-blocking portions of the aperture element, or changing its angle of incidence through the aperture to produce one or more pulses of light from the optical beam. A lens focuses the one or more pulses of the optical beam onto target tissue. A controller controls the movement of the optical element to produce the one or more pulses of light.

A modular routing node includes a single input port and a plurality of output ports. The modular routing node is arranged to produce a plurality of different deflections and uses small adjustments to compensate for wavelength differences and alignment tolerances in an optical system. An optical device is arranged to receive a multiplex of many optical signals at different wavelengths, to separate the optical signals into at least two groups, and to process at least one of the groups adaptively.

The present disclosure provides a MEMS-based variable optical attenuator (VOA) array, sequentially including an optical fiber array, a micro-lens array, and a MEMS-based micro-reflector array to form a VOA array having several optical attenuation units. The MEMS-based micro-reflectors can change the propagation direction of a beam, causing a misalignment coupling loss to the beam and thereby achieving optical attenuation, with a broad range of dynamic attenuation, low polarization dependent loss and wavelength dependent loss, good repeatability, short response time (at the millisecond level), etc. Arrayed device elements are used as assembly units of the present disclosure, and the assembly of arrayed elements facilitates tuning in batches. Accordingly, automation levels are improved, and the production costs are reduced.