A MEMs and/or NEMs measurement system includes a resonant assembly comprising: an input and an output, a plurality of N optical resonators Ri indexed i each having a resonance wavelength λr,i, at least one waveguide to which the optical resonators are coupled, at least one element coupled to each resonator Ri, an emission device, a modulation device, an injection device configured to superpose the N light beams to form an input beam and to inject the beam as input to the resonant assembly, at least one detector configured to detect a light beam arising from the beam at the output of the resonant assembly and to generate an output signal, a demodulation device comprising at least N synchronous-detection demodulation modules.

A photonic integrated circuit (PIC) for determining a wavelength of an input signal is disclosed. The PIC comprises: a substrate; a first Mach-Zehnder Interferometer (MZI) disposed over the substrate, comprising first optical waveguides having a first optical path length difference, and configured to receive a first output optical signal from a light source. The PIC also comprises a second Mach-Zehnder Interferometer (MZI) disposed over the substrate, comprising second optical waveguides having a second optical path length difference, which is greater than the first optical path length difference, and configured to receive a second output optical signal from the light source.

An optical filter comprising a first lens, and first and second optical elements. The first lens has an optical axis, configured to focus beams propagating parallel to the optical axis at a focal point. The first optical element has a first semi-reflective surface, the first semi-reflective surface being curved and having a first radius of curvature around a first centre of curvature on the optical axis. The second optical element has a second semi-reflective surface. The first radius of curvature is between 1 and 10,000 times the distance between the first semi reflective surface and the focal point along the optical axis. The first and second semi-reflective surfaces are arranged to form a resonator. The first lens and the first and second semi-reflective surfaces are arranged along the optical axis such that light is transmittable along an optical path through the lens and the resonator. The optical filter further comprises one or more expansion elements located outside of the optical path, and arranged such that expansion of the expansion elements causes relative movement of the first and second semi-reflective surfaces.

In an optical transmitter having an electro-optic modulator with first child MZI and a second child MZI nested to form a parent MZI, and a processor that controls the bias voltages of electro-optic modulator. In the first section of a control loop, the processor simultaneously superimposes different dither signals onto the first bias voltage of the first child MZI and 1.0 the second bias voltage of the second child MZI, and extracts the first phase error information for the first child MZI and the first-round third phase error for the parent MZI from a first monitoring result. In the second section of the control loop, the processor simultaneously superimposes different dither signals onto the first and second bias voltages, and extracts the second phase error information for the second child MZI and the second-round third phase error for the parent MZI from a second monitoring result.

Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.

An optical phase shifter may include a waveguide core that has a top surface, and a semiconductor contact that is laterally displaced relative to the waveguide core and is electrically connected to the waveguide core. A top surface of the semiconductor contact is above the top surface of the waveguide core. The waveguide core may include a p-type core region and an n-type core region. A p-type semiconductor region may be in physical contact with the n-type core region of the waveguide core, and an n-type semiconductor region may be in physical contact with the p-type core region of the waveguide core. A phase shifter region and a light-emitting region may be disposed at different depth levels, and the light-emitting region may emit light from a phase shifter region that is in a position adjacent to the light-emitting region.

This disclosure relates to the layout of optical components included in a photonics integrated circuit (PIC) and the routing of optical traces between the optical components. The optical components can include light sources, a detector array, and a combiner. The optical components can be located in different regions of a substrate of the PIC, where the regions may include one or more types of active optical components, but also may exclude other types of active optical components. The optical traces can include a first plurality of optical traces for routing signals between light sources and a detector array, where the first plurality of optical traces can be located in an outer region of the substrate. The optical traces can also include a second plurality of optical traces for routing signals between the light sources and a combiner, where the second plurality of optical traces can be located in regions between banks of the light sources.

Optical wavelength division multiplexing (WDM) devices include an optical chip having a number of waveguides therein, with a common optical fiber and single wavelength channel optical fibers optically coupled to the waveguides. Wavelength sensitive filters are disposed between the chip and the fibers, or across waveguides within the chip to reflect light at certain wavelengths and to transmit light at other wavelengths. In sonic embodiments, all of the fibers are located at the same end of the chip, in others the common fiber is located at one side of the chip and the single channel fibers located at another side, while in others the common fiber is located at a first side of the chip and the single channel fibers are located either at the first side of the chip or at a second side of the chip.

An optical module capable of suppressing deterioration of an adhesive layer and having a resistance to high-power light even when high-energy light propagates is configured by connecting an optical fiber to a PLC. The optical fiber is provided with an etching face at a recessed area where a cladding region on its side face is partially removed over a length L in a light propagation direction from an input/output end connected to the PLC, and the PLC is also provided with an etching face at a recessed area where a cladding layer is partially removed over the length L in the light propagation direction from an input/output end connected to the optical fiber. The adhesive layer made of a UV cured resin is interposed between the etching faces to bond and fix the etching faces to each other, and a core of the optical fiber and a core layer of the PLC form a directional coupler for linearly dispersing energy density.

Provided is an optical communication device, such as a wavelength locker, a wavelength demultiplexer, an optical coupling system, and an optical switching system, using a small-sized lens element. An optical communication device includes, as a lens element, a liquid crystal diffractive lens element having an optically anisotropic layer that is formed using a composition containing a liquid crystal compound, and has a liquid crystal alignment pattern in which an orientation of an optical axis of the liquid crystal compound changes while continuously rotating toward one direction, in a radial shape from an inside toward an outside, and in the liquid crystal alignment pattern, in a case where a length over which the orientation of the optical axis rotates by 180° in one direction in which the optical axis changes is a single period, a length of the single period gradually decreases from the inside toward the outside.