A method of forming an optical fibre assembly, comprises providing a planar substrate made of a first material; positioning an optical fibre with an outer layer of a first glass material on a surface of the substrate to form a pre-assembly; depositing a further glass material such as silica soot onto the pre-assembly, over at least a part of the optical fibre and adjacent parts of the substrate surface; and heating the pre-assembly to consolidate the further glass material into an amorphous volume in contact with at least parts of the surface of the substrate and the outer layer of the optical fibre, thereby bonding the optical fibre to the substrate to create the optical fibre assembly.

A method includes obtaining a substrate having at least one exposed metal surface. The method also includes electro-depositing metal onto the at least one exposed metal surface of the substrate and around at least a portion of an optical fiber to secure the optical fiber to the substrate. The substrate and the electro-deposited metal are configured to remove heat from the optical fiber. The method could further include electro-depositing metal around a sacrificial material and removing the sacrificial material to form at least one cooling channel through the electro-deposited metal. The optical fiber could include a polymer coating, where a portion of the polymer coating is removed at an end of the optical fiber. The substrate and the electro-deposited metal could be faceted at an input of the optical fiber and at an output of the optical fiber. The optical fiber could have a coiled arrangement on the substrate.

To eliminate such shortcomings in the prior art that a large-scale semiconductor facility is required, large-sized wiring cannot be produced, and wiring for connection between substrates cannot be formed. Also, to eliminate such shortcomings in a method of using optical fibers for wiring that the wiring is unstable, requires a larger space, and gives rise to a difficulty in management regarding how the optical fibers are connected when the number of optical fibers increases. Further, to eliminate such shortcomings in another method of holding and fixing an optical fiber between polymer sheets that wiring cannot be formed on a plate connecting substrates. In an optical fiber wiring method and apparatus, by feeding an optical fiber, preferably a polymer-made optical fiber, to pass through an adhesive ejecting nozzle having an inner diameter larger than an outer diameter of the optical fiber, the optical fiber coated with the adhesive on a fiber surface is obtained and optical wiring is formed on a substrate by using the adhesive-coated optical fiber. The optical wiring is formed on the substrate by moving the substrate and the nozzle relative to each other, for example, by moving the nozzle with the substrate held fixed, or by moving the substrate with the nozzle held fixed. The adhesive is of the type being hardened with irradiation of an ultraviolet ray. The optical wiring is formed on the substrate by irradiating an ultraviolet ray after the optical fiber coated with the adhesive on the fiber surface has been wired on the substrate.

A method and device for interconnecting optical components, such as optical fibers and optical circuits, in a flexible, repeatable, and cost-effective manner. Two or more optical components are interconnected by a flexible optical circuit substrate bearing one or more embedded optical fibers with a lens at each end of each fiber. The flexible optical circuit may be incorporated into a housing bearing apertures for receiving the optical connectors of the optical components that are to be interconnected with the device. The lensed ends of the fibers embedded in the flexible optical circuit are positioned adjacent to the apertures for optically connecting to the fibers within the connectors installed in the apertures without conventional mating connectors disposed inside the housing.

The present invention relates to an optical-fiber-embedding sheet which is a sheet into which an optical fiber for use as a sensor has been incorporated, including a base material, an adhesive layer, and a bonding adhesive layer laminated in this order, at least a part of the optical fiber having been embedded in the bonding adhesive layer, and the adhesive layer having a width larger than that of the bonding adhesive layer.

The present disclosure relates to fiber management systems and methods for facilitating assembling fiber optic devices in an efficient manner by allowing pre-processed and tested optical fibers to be pre-routed on a substrate prior to installation in their corresponding fiber optic devices.

The present disclosure relates to fiber management systems and methods for facilitating assembling fiber optic devices in an efficient manner by allowing pre-processed and tested optical fibers to be pre-routed on a substrate prior to installation in their corresponding fiber optic devices.