A photonic chip includes a connecting means, a substrate, and a waveguide layer. The photonic integrated waveguide and the optical fiber each have a front end portion. The connecting means includes a groove configured to receive the front end portion of the optical fiber. The groove is essentially U-shaped in its cross section, and the groove has a bottom surface and two inner side surfaces. A least one of both inner side surfaces of the U-shaped groove has a coating of an elastic material configured to hold in place the optical fiber after it is inserted into the groove. The invention further relates to an optical device which includes a photonic chip and an optical fiber, as well as a method or production of such a photonic chip.

The present invention provides a semiconductor structure including a substrate, a metal reflective layer, a UV glue layer, and an element. The metal reflective layer is placed on the surface of the substrate, and the UV glue layer is placed on the surface of the metal reflective layer. The element is manufactured by light-transparent material. The UV glue layer adheres the element to the metal reflective layer. By so, in the light-curing process, the curing of the UV glue is accelerated due to the metal reflective layer reflecting an ultraviolet ray.

The micro-optical systems disclosed herein employ a glass tube having a body, a front end, a back end, an outer surface, and a bore that runs through the body between the front and back ends and that has a bore axis. The outer surface has a maximum outer dimension between 0.1 mm and 20 mm and includes at least one flat side. At least one optical element is inserted into and operably disposed and secured within the bore. The micro-optical assemblies are formed by securing one or more micro-optical systems to a substrate at the flat side of the glass tube. The glass tube is formed by a drawing process that allows for the dimensions of the glass tube to be small and formed with relatively high precision. An example of a compact WDM micro-optical assembly that employs micro-collimators is disclosed.

Array connector includes a connector body having a mating side. The connector body includes a plurality of substrate layers that are stacked side-by-side and have respective mating edges that form the mating side. The substrate layers form a plurality of interfaces in which each interface is defined between adjacent substrate layers. The adjacent substrate layers of each interface are shaped to form a plurality of channels. The array connector also includes communication lines that are disposed within corresponding channels of the connector body such that the communication lines extend along the interfaces. The communication lines are at least one of wire conductors or optical fibers. The communication lines have respective mating terminals that are positioned proximate to the mating side and form a terminal array.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

Methods and systems that can be used for aligning and positioning of an optical fiber are provided herein. For example, an optical fiber alignment and positioning system including a vacuum stage may be provided. The vacuum stage may include a vacuum inlet operable to be in fluid communication with a vacuum source and one or more passages extending through the vacuum stage. The vacuum stage may include an optical fiber channel. A plurality of vacuum ports may pass through the optical fiber channel. The optical fiber channel may include a directional friction surface. The directional friction surface may include a first friction factor in a first direction and a second friction factor in a second direction. The directional friction surface may contact a portion of the optical fiber and may allow movement in the second direction but resist movement of the optical fiber in the first direction.

A system includes a vacuum stage having a first end and second end. The vacuum stage includes a vacuum inlet operable to be in fluid communication with a vacuum source; a plurality of passages extending through the vacuum stage; and a plurality of vacuum ports. Each of the plurality of vacuum ports is in fluid communication with one of the plurality of passages. The system also includes an optical fiber channel extending from the first end to the second end of the vacuum stage along a longitudinal axis. The optical fiber channel comprises a first wall and a second wall and the plurality of vacuum ports pass through the optical fiber channel. The system further includes a mechanical immobilizer adjacent the second end of the vacuum stage and including two pads disposed on opposing sides of the longitudinal axis and an image sensor disposed along the longitudinal axis.

A method of preparing a preformed fiber optic circuit for later termination to at least one fiber optic connector includes providing a substrate for supporting a plurality of optical fibers, the substrate including at least one layer of flexible foil, wherein the flexible foil may be formed from polyethylene terephthalate (PET) according to one example and peeling a layer including at least the optical fibers from the at least one layer of flexible foil.

The present invention provides a semiconductor structure including a substrate, a metal reflective layer, a UV glue layer, and an element. The metal reflective layer is placed on the surface of the substrate, and the UV glue layer is placed on the surface of the metal reflective layer. The element is manufactured by light-transparent material. The UV glue layer adheres the element to the metal reflective layer. By so, in the light-curing process, the curing of the UV glue is accelerated due to the metal reflective layer reflecting an ultraviolet ray.

An optical component includes an optical waveguide, a separation groove disposed on both sides of the optical waveguide in an end face of the optical component connected to face an end face of another optical component, wherein the end face inside the separation groove is in a mirror surface state, and at least a part of the end face outside the separation groove has unevenness.