G02B6/4202

Optical-path-bending connector and optical-path-bending connector assembly

An optical fiber is contacted by a first guide part on the inside of a bend. The first guide part is disposed apart from a region of a fixing member from which the optical fiber is drawn out. Specifically, a first non-contact part in which the optical fiber does not contact a guide member is provided between the first guide part and the drawn out part of the optical fiber from the fixing member. The optical fiber also contacts a second guide part on the outside of the bend. The second guide part is disposed apart from the first guide part, and a second non-contact part in which the optical fiber does not contact the guide member is also provided between the first guide part and the second guide part.

Thermal management structures for optoelectronic modules

An example embodiment includes optoelectronic module. The optoelectronic module may include a lens assembly, a module board, heat-generating components, and a thermally conductive plate. The lens assembly may be secured to the module board. The module board may include a printed circuit board (PCB). The heat-generating components may be mounted to the PCB. The thermally conductive plate may be secured to a surface of the module board. The thermally conductive plate may define an opening that receives at least a portion of the lens assembly. The thermally conductive plate may be configured to absorb at least a portion of thermal energy generated during operation of the heat-generating components and to transfer the thermal energy away from the heat-generating components.

Optical Fiber Bundle Structure and Optical Fiber Connection Structure
20170235061 · 2017-08-17 ·

This optical fiber connection structure connects a multicore fiber and a bundle structure bundling a plurality of optical fibers. The multicore fiber has a plurality of cores arranged in a lattice. The bundle structure includes closely packed optical fibers of the same diameter. The bundle structure is configured such that signal light optical fiber groups including signal light optical fibers and a dummy fiber group including dummy optical fibers are stacked in multiple layers. The signal light optical fiber groups are configured with the signal light optical fibers aligned in the mutually contacting direction. The signal light optical fiber groups and the dummy fiber group are stacked orthogonal to the alignment direction of the optical fibers constituting the respective fiber groups.

Interposer

A silicon interposer. The silicon interposer including: a silicon layer, including one or more optical waveguides each connectable to an optical fiber; an optically active component, configured to convert optical signals received from the optical fiber into electrical signals or to convert electrical signals into optical signals and provide them to the optical fiber; and one or more electrical interconnects, connected to the optically active component and connectable to a printed circuit board, a separate die, a separate substrate, or a wafer level package.

Minimally invasive medical instrument

The present invention relates to a minimally invasive medical instrument (100) having a proximal end (100b) and a distal end (100a) and comprising a sensor arrangement (10) arranged at the distal end (100b) of the medical instrument (100). The sensor arrangement (10) comprises a sensor (20) configured to generate sensor data in the form of an electrical sensor signal, and a data conversion device (40) configured to convert the electrical sensor signal into an optical signal and comprising an electrical input (41) for receiving the electrical sensor signal and an optical output (42) for transmitting the optical signal. The sensor arrangement (10) further comprises an optical fiber (50) configured to transmit the optical signal from the distal end (100a) to the proximal end (100b), the optical fiber (50) coupled to the output of the data conversion device (40) for receiving the optical signal, the optical fiber (50) extending from the distal end (100a) to the proximal end (100b) of the instrument (100). The present invention further relates to a method of manufacturing such a minimally invasive medical instrument (100).

Photoelectric Fiber and Communication Device

A photoelectric fiber includes a fiber including a core through which light is guided; an electrical unit formed continuously with the fiber, the electrical unit being configured to house a photoelectric conversion chip including a photoelectric conversion element; and an external electrode formed on a front surface of at least one of the fiber or the electrical unit, wherein the photoelectric conversion chip is optically connected to the core and electrically connected to the external electrode.

MEMS/NEMS integrated broken racetrack tunable laser diode

According to an aspect, an optical system includes a laser diode configured to emit optical signals and at least two size-switchable broken racetrack ring resonators optically coupled to an optical waveguide, where each broken racetrack ring resonator is configured to exhibit a resonant wavelength. The optical system also includes a tuning arrangement associated with the broken racetrack ring resonators, where the tuning arrangement includes a micro electro-mechanical system (MEMS) or nano electro-mechanical system (NEMS) actuator mechanically coupled to a first portion of a first one of the broken racetrack ring resonators and configured to mechanically move the first portion so as to change the resonant wavelength of the first one of the broken racetrack ring resonators.

MODULE RETRACTING TYPE INSTALLING AND UNINSTALLING DEVICE
20170324194 · 2017-11-09 ·

A module retracting type installing and uninstalling device, including a base, a slide block, a pressing cover and a bail. The slide block includes a long-strip-shaped slide block base body, and U-shaped grooves are respectively formed in the middle part of two side walls of the slide block base body. A square hole is formed at the rear end of the slide block base body, and is sheathed onto a triangular lock catch of the base. First and second rotating shafts of the bail are respectively located in two snapping grooves at the front end of the base, and third and fourth rotating shafts are respectively located in the U-shaped grooves. The pressing cover includes a square pressing cover base body, and a pressure resilient sheet attached to the upper surface of the slide block and being pressed to the base.

Adiabatic secondary optics for solar concentrators used in concentrated photovoltaic systems

A solar concentrator for concentrating solar radiation toward a solar cell, a concentrated photovoltaic module including a solar concentrator and a solar cell, and a secondary optical element for use in a solar concentrator are provided. The solar concentrator includes a primary optical element for collecting and focusing the solar radiation, and a secondary optical element. The secondary optical element is arranged to receive the solar radiation collected and focused by the primary optical element and includes an input end, and output end, and an adiabatic light guide tapering from the input end toward the output end and configured for concentrating and adiabatically guiding the solar radiation between the input and output ends. Some embodiments of the present invention can be useful in solar photovoltaic applications where it is desirable to provide high acceptance angles while maintaining high concentration and optical efficiency levels.

Chip-to-chip optical data communication system

An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.