In general, the disclosure is directed toward transmitting radiant energy across a boundary of a medical device via an optical feedthrough. A system for transmitting radiant energy across a boundary of a medical device includes a first functional module of a medical device, a second functional module of the medical device, an optical feedthrough assembly coupled to the first functional module, and a radiant energy source that emits a beam through the optical feedthrough assembly to perform a manufacturing process on the first functional module and the second functional module.

A passive optical network includes a central office providing subscriber signals; a fiber distribution hub including an optical power splitter and a termination field; and a drop terminal. Distribution fibers have first ends coupled to output ports of a drop terminal and second ends coupled to the termination field. A remote unit of a DAS is retrofitted to the network by routing a second feeder cable from a base station to the hub and coupling one the distribution fibers to the second feeder cable. The remote unit is plugged into the corresponding drop terminal port, for example, with a cable arrangement having a sealed wave division multiplexer.

The present invention provides systems, methods, and apparatuses for subsea optical to electrical distribution. The present invention comprises one or more routing units adapted to convert optical signals to electrical signals and route the converted electrical signals to an appropriate end device. The routing unit is a compact device that may be installed without the use of heavy equipment.

A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

Methods and instruments for measuring a liquid sample (S1) in a well plate (50) by means of an optical chip 10. The chip (10) comprises an optical sensor (13) that is accessible to the liquid sample (S1) at a sampling area (SA) of the chip. A free-space optical coupler (11,12) is accessible to receive input light (L1) and/or emit output light (L2) via a coupling area (CA) of the chip (10). The sampling area (SA) of the chip 10 is submerged in the liquid sample (S1) while keeping the liquid sample (S1) away from the coupling area (CA) for interrogating the optical coupler (11,12) via an optical path (P) that does not pass through the liquid sample (S1).

An optical fibres connector for an optoelectronic active implantable medical device (AIMD) for implantation in a living body is provided. The optical fibres connector includes a male component (M) coupled to a first set of optical fibres, a female component (F) coupled to a second set of optical fibres or optical elements, and a coupling component (C) for reversibly locking the male and female components in a coupled position. The optical fibres or optical elements are in perfect alignment. The coupling component includes a fixed element (40f) and a rotatable element (40r) all optical fibres (41f) and optical elements of the connector remaining static upon rotation of the rotatable element, reversibly locking the male and female components in the coupled position is achieved by rotating the rotatable element with respect to the fixed element.

A plug connector is attachable with an optical fiber cable and is connectable with a receptacle connector. The receptacle connector comprises a receptacle shell. The plug connector comprises a front holder, a cable holding portion, a rear holder and a coupling member. The front holder is made of metal. The front holder is mated with the receptacle shell when the plug connector is connected with the receptacle connector. The cable holding portion is made of metal. The cable holding portion is configured to hold the optical fiber cable. The rear holder guards the cable holding portion. The rear holder comprises, at least in part, a thermal insulating portion made of non-metal material. The coupling member couples the front holder and the rear holder with each other. Each of the coupling member and the front holder is in contact with the rear holder only on the thermal insulating portion.

An optical subassembly includes an eyelet including a first through-hole penetrating from a first surface through a second surface; a first lead terminal, which is to be inserted into the first through-hole, and is configured to transmit an electric signal; a dielectric material, which is filled in a space between the first through-hole and the first lead terminal; a device mounting substrate, on which an optical device is to be mounted, and which includes a first conductor pattern configured to transmit the electric signal to the optical device; a metal block having mounted thereon the device mounting substrate; a temperature regulator placed between the metal block and the eyelet; a relay substrate including a second conductor pattern, which is configured to transmit the electric signal to the optical device; a seat, which protrudes from the first surface in a direction extended from the first through-hole, and has a third surface mounting the relay substrate; and a spacer interposed between the third surface and the relay substrate to establish conduction between a rear surface of the relay substrate and the seat.

Embodiments of the disclosure provide a photonic integrated circuit (PIC) structure with a passage for a waveguide through a barrier structure. The PIC structure includes a barrier structure on a substrate, having a first sidewall and a second sidewall opposite the first sidewall. A passage is within the barrier structure, and extends from a first end at the first sidewall of the barrier structure to a second end at the second sidewall of the barrier structure. A shape of the passage includes a reversal segment between the first end and the second end. A waveguide within the passage and extends from the first end to the second end of the barrier structure.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate, and a photonics die coupled to the package substrate. In an embodiment, a compute die is coupled to the package substrate, where the photonics die is communicatively coupled to the compute die by a bridge in the package substrate. In an embodiment, the optical package further comprises an optical waveguide embedded in the package substrate. In an embodiment, a first end of the optical waveguide is below the photonics die, and a second end of the optical waveguide is substantially coplanar with an edge of the package substrate.