Methods and devices for a planar bidirectional optical coupler for wavelength division multiplexing are described. The optical coupler can be used in an optical transceiver housed within a compact optical interconnect module for optical fiber-based data communication and/or OTDR measurement. According to one aspect, the optical coupler includes a layered planar construction, each layer based on a transparent planar substrate. A bottom carrier layer includes a metallized surface for mounting of electronic and/or electro-optical components. A lens layer overlays the carrier layer and includes collimating transmit and/or focusing receive lenses. A beam splitter/combiner layer overlays the lens layer and includes angled coated lateral surfaces that provide beam splitting and wavelength filtering functionality. The beam splitter/combiner layer is optically coupled to a ferrule receptacle of a fiber connector of the optical transceiver. Alternatively, the beam splitter/combiner is optically coupled to a planar optical fiber connector via an additional lens guide layer.

Fiber optic assemblies are used to link transceivers carrying a signal from the transmitter portion of one transceiver to the receiver portion of another transceiver. The fiber optic assemblies have fiber optic connectors with a gender of either male or female. When the fiber optic connectors have fiber optic connectors with the same gender, the plurality of optical fibers are inverted and when the fiber optic assemblies have fiber optic connectors with an opposite gender, the plurality of optical fibers are not inverted. The inversion may also occur when the fiber optic connectors have the opposite gender in an alternative embodiment.

Systems and methods include an optical switch system which provides a combination of .Math.LED arrays, PDs, imaging fiber cables, and crosspoint switch on a single chip. The system includes one or more input ports with each inputport configured to connect to an inputfiber bundle. The system additionally includes one or more output ports with each output port configured to connect to an outputfiber cable, wherein each of the inputfiber bundle and the outputfiber cable include a plurality of fiber cores. An electrical crosspoint switch is connected to the one or more input ports and the one or more output ports, wherein the electrical crosspoint switch is configured to connect a given input port to a corresponding output port, including all signals in the input fiber cable to the corresponding output fiber cable.

A network device includes an enclosure, a multi-chip module (MCM), an optical-to-optical connector, and a multi-core fiber (MCF) interconnect. The enclosure has a panel. The MCM is inside the enclosure. The optical-to-optical connector, which is mounted on the panel of the enclosure, is configured to transfer a plurality of optical communication signals. The MCF interconnect has a first end coupled to the MCM and a second end connected to the optical-to-optical connector on the panel, for routing the plurality of optical communication signals between the MCM and the panel.

Embodiments of the present disclosure include optical transmitters and transceivers with improved reliability. In some embodiments, the optical transmitters are used in network devices, such as in conjunction with a network switch. In one embodiment, lasers are operated at low power to improve reliability and power consumption. The output of the laser may be modulated by a non-direct modulator and received by integrated optical components, such as a modulator and/or multiplexer. The output of the optical components may be amplified by a semiconductor optical amplifier (SOA). Various advantageous configurations of lasers, optical components, and SOAs are disclosed. In some embodiments, SOAs are configured as part of a pluggable optical communication module, for example.

A computer memory system includes an electro-optical chip, an electrical fanout chip electrically connected to an electrical interface of the electro-optical chip, and at least one dual in-line memory module (DIMM) slot electrically connected to the electrical fanout chip. A photonic interface of the electro-optical chip is optically connected to an optical link. The electro-optical chip includes at least one optical macro that converts outgoing electrical data signals into outgoing optical data signals for transmission through the optical link. The optical macro also converts incoming optical data signals from the optical link into incoming electrical data signals and transmits the incoming electrical data signals to the electrical fanout chip. The electrical fanout chip directs bi-directional electrical data communication between the electro-optical chip and a dynamic random access memory (DRAM) DIMM corresponding to the at least one DIMM slot.

An optical waveguide substrate includes: a substrate; a clad disposed on a plane of the substrate and made of a transparent material; and a plurality of cores that are surrounded by the clad, extend in parallel with the plane of the substrate and are made of a transparent material having a refractive index different from a refractive index of the clad, the cores including at least a pair of cores with diameters different from each other. The cores are provided at positions where centers of sections of the cores are all positioned in a straight line.

The disclosure relates to a high-density optical waveguide structure, a printed circuit board and a preparation method thereof. The high-density optical waveguide structure comprises an undercladding layer, a core layer and an upper cladding layer in sequence; wherein, the lower cladding layer is arranged at intervals. The trench is filled with an optical waveguide material to form a core layer. The waveguide structure integrates an optical waveguide into a PCB to realize photoelectric interconnection. The waveguide structure can better achieve higher parallel interconnection density, maintain good signal integrity, reduce device and device size, and at the same time, consume less power. The structure is configured to easily dissipate heat, enabling a simpler physical architecture and design, maximizing the wiring space of printed circuit boards, facilitating the fabrication of ultra-fine wire boards; and improving the wiring density and reliability of existing manufacturing methods.

A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.

A method and device for emitting electromagnetic radiation at high power using nonpolar or semipolar gallium containing substrates such as GaN, AlN, InN, InGaN, AlGaN, and AlInGaN, is provided. In various embodiments, the laser device includes plural laser emitters emitting green or blue laser light, integrated a substrate.