A multi-chip package assembly includes a substrate, a first semiconductor chip attached to the substrate, and a second semiconductor chip attached to the substrate, such that a portion of the second semiconductor chip overhangs an edge of the substrate. A first v-groove array for receiving a plurality of optical fibers is present within the portion of the second semiconductor chip that overhangs the edge of the substrate. An optical fiber assembly including the plurality of optical fibers is positioned and secured within the first v-groove array of the second semiconductor chip. The optical fiber assembly includes a second v-groove array configured to align the plurality of optical fibers to the first v-groove array of the second semiconductor chip. An end of each of the plurality of optical fibers is exposed for optical coupling within an optical fiber connector located at a distal end of the optical fiber assembly.

In accordance with a plurality of embodiments of the present invention, exemplary systems and articles of manufactures are described herein that are configured to propagate a MM signal from a light source, such as an optical fiber assembly for propagating a multimode (MM) signal from a light source, the optical fiber assembly comprising a multicore fiber (MCF) having a fiber numerical aperture (NA) value, a first core diameter and a first outer diameter (OD), and a combiner including a taper fiber bundle (TFB) portion in communication with the MCF, and at least one pigtail portion in communication with the light source, wherein the combiner propagates the MM signal from the light source, the MM signal having a signal NA value that is less than the fiber NA value such that the MM signal underfills the at least one pigtail portion.

An ultra-thin board-to-board photoelectric conversion device includes: a plug arranged at one end of an optical fiber; a socket on which the plug is arranged; a retaining element arranged to retain the plug in the socket; and a first circuit substrate on which the socket is mounted. The plug includes: a second circuit substrate; and a photoelectric chip, a lens for transmitting and processing light beams between the optical fiber and the photoelectric chip and a gold finger arranged on the second circuit substrate. The socket includes: a socket main body; and a hollow part for accommodating the lens and the photoelectric chip, an elastic sheet electrode extending from top of the socket main body to bottom of the socket main body and a casing arranged on the socket main body extending from an outer circumference of the socket main body to the top of the socket main body.

A circuit board utilizing the better and faster performance of optical signals includes interconnected first, second, and third areas. The first area includes a first circuit substrate, and a first coupling element and a chip connected thereon. The second area includes an optical fiber within an insulating layer. The third area includes a second circuit substrate, and a second coupling element and an electronic element connected thereon. The first coupling element and the second coupling element are optically aligned with the optical fiber for signal reception and transmission. A method for manufacturing such composite circuit board is also disclosed.

An optical interconnect may provide for optical communications between two IC chips. The optical interconnect may include an array of optoelectronic elements, for example microLEDs and photodetectors, with the array including a plurality of sub-arrays. A fiber bundle of optical fibers may couple the optoelectronic elements, and the fiber bundle may include a plurality of sub-bundles, with for example one sub-bundle for coupling pairs of sub-arrays. Fibers of each sub-bundle may be accurately positioned with respect to one another.

A processing chamber is described. The processing chamber includes a chamber having an interior volume, a light pipe window structure coupled to the chamber, the light pipe window structure having a first transparent plate disposed within the interior volume of the chamber, and a radiant heat source coupled to a second transparent plate of the light pipe window structure in a position outside of the interior volume of the chamber, wherein the light pipe window structure includes a plurality of light pipe structures disposed between the first transparent plate and the second transparent plate.

An optical ferrule has a different thermal expansion coefficient than a substrate to which a optical device is mounted, the ferrule optically coupling the device to one or more optical fibers. The optical ferrule includes and/or a cradle in which the ferrule is mounted include lateral and longitudinal engagement feature that ensure alignment with the optical device at an operating temperature, the ferrule expanding relative to the substrate when transitioning to the operating temperature.

An optical connector for a photonic circuit. The optical connector includes a first part, fixable to a photonic circuit, having at least one slab of optically transparent material, the at least one slab including a first lens. The optical connector includes a second part, movable between a connected position adjacent the first part and a disconnected position removed from the first part. The second part includes at least one slab of optically transparent material, the at least one slab including a second lens located to be in alignment with the first lens in the connected position. One or more guiding elements are arranged to direct light to the second lens. The second part is configured to connect the one or more guiding elements to an optical fiber.

An apparatus may include one or more optical fibers, one or more optical waveguides, and multiple resonator nodes arranged in an array of sensing locations. Each resonator node may include an optical coupling between an optical waveguide and an optical fiber having a set of resonant frequencies at a respective sensing location. Each resonator node may be further configured to communicate a set of signals corresponding to at least one shift in the set of resonant frequencies in the optical fiber at the respective sensing location.

An OSFP optical transceiver having split multiple fiber optical port using reduced amount of MPO terminations is provided that includes two adjacent sockets integrated into the optical port of the OSFP optical transceiver. The two adjacent sockets are vertically oriented with respect to the mounting baseplate of the OSFP optical transceiver, and each of the two adjacent sockets is adapted to receive an MPO receptacle that terminates the proximal end of a bundle of fibers. The OSFP optical transceiver also includes an optical connection between each socket and a corresponding lens in the OSFP optical transceiver, for transmitting optical signals received from other transceivers into the OSFP optical transceiver and optical signals generated in the OSFP optical transceiver to other transceivers.