An optical connector assembly (OCA) includes a connector housing to maintain alignment between optical components housed within the OCA and photoelectric converters on an optoelectronic substrate (OES) assembly. The optical components include a ferrule and an optical cable. The ferrule is optically coupled to the optical cable. The OCA includes a ferrule holder to hold the ferrule within the OCA, and a spring located between the connector housing and the ferrule holder. The spring is to apply a separating force between the ferrule holder and the connector housing. The OCA includes a gasket coupled to the connector housing. The coupling of the connector housing to a socket compresses the gasket to provide a seal between the connector housing and the socket.

Two semiconductor chips are optically aligned to form a hybrid semiconductor device. Both chips have optical waveguides and alignment surface positioned at precisely-defined complementary vertical offsets from optical axes of the corresponding waveguides, so that the waveguides are vertically aligned when one of the chips is placed atop the other with their alignment surface abutting each other. The position of the at least one of the alignment surface in a layer stack of its chip is precisely defined by epitaxy. The chips are bonded at offset bonding pads with the alignment surfaces abutting in the absence of bonding material therebetween.

An optical path change element includes a first facet that receives incidence of light beams outgoing from outgoing portions of a first optical element, a second facet that has a predetermined radius of curvature and is provided with a reflection face to reflect the incident light beams from the first facet, and a third facet causing the light beams reflected on the reflection face to outgo to the incident portions of a second optical element. The second facet has protruded faces spaced from the reflection faces. Virtual planes tangent to the protruded faces are defined. At least one of the virtual planes covers the reflection face without being tangent to the reflection face and being parallel with a tangent plane at an arbitrary point of the reflection face.

Described herein is an integrated photonics device including a light emitter, integrated edge outcoupler(s), optics, and a detector array. The device can include a hermetically sealed enclosure. The hermetic seal can reduce the amount of moisture and/or contamination that may affect the measurement, analysis, and/or the function of the individual components within the sealed enclosure. Additionally or alternatively, the hermetic seal can be used to protect the components within the enclosure from environmental contamination induced during the manufacturing, packaging, and/or shipping process. The outcoupler(s) can be formed by creating one or more pockets in the layers of a die. Outcoupler material can be formed in the pocket and, optionally, subsequent layers can be deposited on top. The edge of the die can be polished until a targeted polish plane is achieved. Once the outcoupler is formed, the die can be flipped over and other components can be formed.

A method for forming hermetic seals between the cap and sub-mount for electronic and optoelectronic packages includes the formation of metal mounds on the sealing surfaces. Metal mounds, as precursors to a metal hermetic seal between the cap and sub-mount of a sub-mount assembly, facilitates the evacuation and purging of the volume created within cap and sub-mount assemblies prior to formation of the hermetic seal. The method is applied to discrete cap and sub-mount assemblies and also at the wafer level on singulated and non-singulated cap and sub-mount wafers. The method that includes the formation of the hermetic seal provides an inert environment for a plurality of electrical, optoelectrical, and optical die that are attached within an enclosed volume of the sub-mount assembly.

The present disclosure relates to a fiber optic network configuration having an optical network terminal located at a subscriber location. The fiber optic network configuration also includes a drop terminal located outside the subscriber location and a wireless transceiver located outside the subscriber location. The fiber optic network further includes a cabling arrangement including a first signal line that extends from the drop terminal to the optical network terminal, a second signal line that extends from the optical network terminal to the wireless transceiver, and a power line that extends from the optical network terminal to the wireless transceiver.

A multilayer stack comprises a surface wherein a predetermined region is defined for enclosing a device provided on the multilayer stack, the region being encircled by a welding zone defined on the surface, the welding zone being suitable for being welded by a welding radiation beam to a capping structure. It also comprises a first layer embedded within the multilayer stack, including at least one embedded component suitable for being functionally connected to the device provided on the multilayer stack. It furthermore comprises at least a second layer over the first layer comprising a shielding structure positioned between the at least one component of the first layer and the welding zone defined on the surface, the shielding structure being adapted to limit the welding depth of the welding radiation beam provided on the welding zone.

The present disclosure describes sealing boots for protecting an optical interconnection. A sealing boot may include a main body having an interior cavity, the interior cavity having an annular recess adjacent to one end of the main body, the annular recess configured to receive a feature of a remote radio unit, and a neck merging with the opposing end of the main body and having a cylindrical inner surface that defines a bore that is continuous with the cavity of the main body, the inner surface having an inner diameter that is less than an inner diameter of the interior cavity of the main body. The sealing boot is configured to surround at least a portion of a fixed active optical connector when the fixed active optical connector is plugged into the remote radio unit.

An implantable optical sensor comprises a photonic integrated circuit comprising a substrate 2 and an optical microstructure 3 integrated with the substrate 2. The optical microstructure is positioned to form an exposed optical interaction area 4 on a part of a surface 5 of the substrate 2. A cover cap 6 is sealed onto a part of the substrate 2 adjacent to the optical interaction area 4 and by wafer-to-wafer bonding technology or another wafer-level hermetic packaging technique. At least one active component 8 is positioned in a sealed cavity 9 which is formed between the surface 5 and the cover cap 6. The substrate 2 comprises at least one optical feedthrough 10, which is an embedded waveguide extending from the sealed cavity 9 to the optical interaction area 4.

Embodiments disclosed herein include optical packages. In an embodiment, an optical package comprises a package substrate and a compute die on the package substrate. In an embodiment, an optics die is on the package substrate, and an integrated heat spreader (IHS) is over the compute die and the optics die. In an embodiment, channels are disposed on a surface of the IHS facing the package substrate.