An optical component is configured to optically connect a light-emitting element and an optical fiber, and includes an optical surface arranged in a middle of an optical path of a light to be emitted from the light-emitting element to the optical fiber to reflect the light. The optical surface includes an optical path area configured to reflect the light and a non-optical path area other than the optical path area, and the optical path area and the non-optical path area are coplanar. The optical path area has a smooth surface, and at least a part of the non-optical path area has a rough surface which is rougher than the optical path area.

An injection moulding apparatus and method for producing a moulded article is disclosed herein. In a described embodiment, the method comprises: (i) securing a layer of film to a part of a first mould half at step 504; (ii) adjusting relative position of the first mould component and a second mould component to an initial moulding position at step 506 to define a mould cavity; (iii) injecting molten moulding material into the mould cavity at step 508 to enable the molten moulding material to contact the layer of protective film; (iv) moving a movable core at step 510 to compress the molten moulding material in the mould cavity; and (v) cooling the compressed molten moulding material at step 514 to bond the layer of film to the cooled moulding material to form the moulded article.

An example optoelectronic module includes a housing that extends between a first end portion and a second end portion. The optoelectronic module includes a printed circuit board (PCB) that includes an electrical connector at the second end portion of the housing, at least one transmitter electrically coupled to the PCB and optically coupled with at least one optical fiber, at least one receiver electrically coupled to the PCB and optically coupled with at least one optical fiber, and at least one electromagnetic interference (EMI) attenuating component formed of a plastic material that is configured to attenuate EMI. The EMI attenuating component is configured to attenuate EMI generated by one or more other components of the optoelectronic module.

Various embodiments may relate to a method of forming a photonic integrated circuit package (PIC). The method may include forming a redistribution layer (RDL) over a carrier. The method may also include forming a through hole or cavity on the redistribution layer. The method may additionally include providing a stop-ring structure, the stop-ring structure including a ring of suitable material, the stop-ring structure defining a hollow space, over the redistribution layer so that the hollow space is over the through hole or cavity. The method may further include arranging a photonic integrated circuit (PIC) die over the redistribution layer so that the photonic integrated circuit (PIC) die is on the stop-ring structure. The method may also include forming a molded package by forming a mold structure to at least partially cover the photonic integrated circuit (PIC) die to form the photonic integrated circuit package.

Provided is a method for manufacturing an optical receptacle with which the occurrence of bending of a guide pin hole can be suppressed. The method for manufacturing an optical receptacle of the present invention includes an injection step of injecting a resin through a resin injection port of a mold into a cavity of the mold, and a solidification step of solidifying the resin in the cavity of the mold. The cavity of the mold has a protruding portion for forming a recessed portion in a main body of an optical receptacle, a pair of pins for forming a pair of guide pin holes in the main body of the optical receptacle, and a pair of pin-retaining portions. In the injection step, the mold during the injection of the resin is in a state in which the pair of pins are respectively disposed on two end sides of the protruding portion, the resin injection port is disposed so that the resin flows from one end side of the pair of pins toward opposing faces of the pins that oppose each other, one of the pin-retaining portions is disposed in contact with a side of a corresponding one of the pins that is opposite to the opposing face thereof, and the other of the pin-retaining portions is disposed in contact with a side of the other of the pins that is opposite to the opposing face thereof.

A hermetic optical subassembly includes an optical bench having a mirror directing optical signals to/from an optical waveguide, a carrier supporting a photonic device, and an intermediate optical bench having a mirror directing optical signals between the photonic device and the optical bench. The optical bench and the intermediate optical bench optically aligns the photonic device to the waveguide along a desired optical path. In one embodiment, the photonic device is an edge emitting laser (EML). The mirror of the optical bench may be passively aligned with the mirror of the intermediate optical bench. The assembled components are hermetically sealed. The body of the optical benches are preferably formed by stamping a malleable metal material to form precise geometries and surface features. In a further aspect, the hermetic optical subassembly integrates a multiplexer/demultiplexer, for directing optical signals between a single optical fiber and a plurality of photonic devices.

The optical receptacle of the present invention comprises an optical receptacle body and a support member. The optical receptacle body comprises: a first optical surface upon which is incident light transmitted from the photoelectric conversion element; a second optical surface that emits light transmitted from the photoelectric conversion element to the light transmission medium. The support member comprises a support member body that includes a mounting surface for mounting on a substrate, and a second mating part that mates with the first mating part and that is positioned at a position on the inside of the support member body at a position corresponding to the first mating part. The optical receptacle is positioned on the support member side of the mounting surface.

An injection moulding apparatus and method for producing a moulded article is disclosed herein. In a described embodiment, the method comprises: (i) securing a layer of film to a part of a first mould half at step 504; (ii) adjusting relative position of the first mould component and a second mould component to an initial moulding position at step 506 to define a mould cavity; (iii) injecting molten moulding material into the mould cavity at step 508 to enable the molten moulding material to contact the layer of protective film; (iv) moving a movable core at step 510 to compress the molten moulding material in the mould cavity; and (v) cooling the compressed molten moulding material at step 514 to bond the layer of film to the cooled moulding material to form the moulded article.

Provided are a slim connector plug capable of transmitting and receiving a large amount of data at an ultra-high speed and implementing a miniaturized and slimmed structure with a thickness of 1 mm while being manufactured at low cost, and an active optical cable (AOC) assembly using the same. The connector plug includes: an optical sub-assembly in which an optical fiber seating groove on which an optical fiber is mounted is formed on one side of the optical sub-assembly and a reflective surface is formed on an inner end of the optical fiber seating groove; an optical element module having an optical engine stacked on the optical sub-assembly and generating an optical signal or receiving an optical signal; and an optical component installed on the reflective surface of the OSA and transmitting the optical signal between the optical fiber and the optical engine.

A micro-mirror array for optical coupling in a waveguide array including, a transparent body having a slanted portion, a sidewall portion, and a bottom portion, the sidewall portion and the bottom portion each respectively facing the slanted portion, and wherein a complementary shape of a conventional form off-axis mirror is arranged on the slanted portion, and a reflective coating on at least a portion of the complementary shape.