In one embodiment, a module for plugging into a QSFP-DD (Quad Small Form Factor Pluggable Double Density) cage is provided that has one or more projections for contacting a QSFP-DD optical module in an adjacent QSFP-DD recess of the QSFP-DD cage so as to evacuate heat from, and or provide power to, the QSFP-DD optical module.

Microelectronic assemblies including photonic integrated circuits (PICs), related devices and methods, are disclosed herein. For example, in some embodiments, a photonic assembly may include a PIC in a first layer including an insulating material, wherein the PIC has an active side and an opposing backside, and wherein the PIC is embedded in the insulating material with the active side facing down; a conductive pillar in the first layer; an integrated circuit (IC) in a second layer, wherein the second layer is on the first layer, wherein the second layer includes the insulating material and the IC is embedded in the insulating material in the second layer, and wherein the IC is electrically coupled to the backside of the PIC and the conductive pillar; and an optical component optically coupled to the active surface of the PIC.

A waveguide substrate configured includes a first surface, a second surface opposite the first surface, and a communication side having at least one projecting boss that at least partially defines a bore for receiving a ferrule of an optical connector. Each projecting boss includes an outboard end from which the bore extends into the waveguide substrate, and an end of the bore within the waveguide substrate defines an optical interface surface. At least one waveguide within the waveguide substrate extends from the optical interface surface. A first slot is formed in each projecting boss between the associated bore and the first surface, with the first slot extending from the outboard end of the projecting boss and along a majority of the bore.

An optical module includes: a housing, a heat sink arranged in the housing, a laser emitter arranged on the heat sink, a PCB partially arranged on the heat sink, and an optical system arranged in the housing. The optical module has an optical interface on one end and an electrical interface on the other end. The optical system is arranged between the laser emitter and the optical interface. The PCB is constructed as a rigid board. The laser emitter is electrically connected to the PCB. One end of the PCB is fixed on the heat sink, and the other end of the PCB is constructed as the electrical interface. The optical system transmits light emitted from the laser emitter to the optical interface.

An optical electrical connector includes a casing, a printed circuit board, an electronic chip, a photoelectric conversion component, and a heat sink device. The casing includes an electrical port and an optical port. A receiving space is defined between the electrical port and the optical port. The printed circuit board extends longitudinally along a first direction. The printed circuit board includes a main body portion located in the receiving space and a front end portion exposed in the electrical port. The electronic chip, the photoelectric conversion component and the heat sink device are all accommodated in the receiving space. The electronic chip and the photoelectric conversion component are not only disposed on the printed circuit board, but also electrically connected to the printed circuit board. The heat sink device is disposed on the casing and faces the electronic chip for conducting the heat accumulated on the electronic chip.

A light guide device has a support member, a light guide member, a first abutting part, and a cover member. The light guide member is supported by the support member and has a light incident surface. The first abutting part has the light guide member and positions the light guide member at the first reference position predetermined in the support member by abutting on the abutted part of the support member. The cover member is attached to the support member and covers the light guide member. The cover member has a first biasing part that biases the light guide member in an abutting direction where the first abutting part abuts the abutting part, with the cover member attached to the support member, and an engaging part that engages with an engaged part of the support member while the first biasing part generates a biasing force in the abutting direction.

A housing for an electronic device includes a panel, where the panel includes a window. A cage includes a plurality of panels and a first end and a second end that opposes the first end. The cage further includes an opening at its first end and an enclosure disposed between the panels of the cage. Connecting structure is disposed at the first end of the cage, where the connecting structure secures the first end of the cage to the panel. The cage is suitably dimensioned to receive and retain a portion of an optical module within the enclosure when the optical module is inserted within the opening at the first end of the cage.

At least some embodiments of disclosure provide a method and device for optical fiber monitoring and an optical fiber adapter. The method includes: a device for monitoring the optical fiber for performing optical fiber monitoring is installed in an optical fiber adapter and the optical fiber monitoring is performed by using the optical fiber adapter with the device for monitoring the optical fiber. The problem that the device for monitoring the optical fiber has complex wiring and a deployment position is limited is solved. And effects that the wiring complexity of the device for monitoring the optical fiber is reduced, and the deployment position is flexible and convenient are achieved.

An optical transceiver that includes a housing, an inner ceiling, and an outer ceiling. The housing includes sides and a bottom. The inner ceiling is assembled with the housing; while, the outer ceiling is fit with the housing. The outer ceiling, which forms a cavity accompanied with the housing, is fastened with the inner ceiling by a screw inserted into a screw hole.

A multi-channel optical transmitter or transceiver includes transmitter optical subassembly (TOSA) modules optically coupled to and directly aligned with mux input ports of an optical multiplexer without using optical fibers. The optical multiplexer may include an arrayed waveguide grating (AWG) or a reversed planar lightwave circuit (PLC) splitter and may be located in a multiplexer housing having at least one side wall with input apertures aligned with the mux input ports. The TOSA modules may include a base supporting at least a laser, laser driving circuitry, and a lens for focusing the light output from the laser. Z-rings may be used to facilitate alignment and to mount the TOSA bases to the side wall of the multiplexer housing, for example, by laser welding.