It is provided a lens unit to be small-sized, while reducing deterioration in optical performance after experiencing thermal expansion. The lens unit includes an aperture member, a lens, an image sensor, and a holder. A range where the aperture member abuts on a flange part of the lens overlaps with a range where the holder abuts on the flange part of the lens. A first gap is provided between a holder inclined surface of the holder and a lens inclined surface of the lens over the entire circumference. A second gap is provided between an outer circumferential surface of the lens and an inner surface of the holder over the entire circumference.

Provided are an under-screen biometric identification apparatus, a biometric identification component and a terminal device. The under-screen biometric identification apparatus includes: a display screen and a biometric identification module, where the biometric identification module is fixedly disposed under the display screen, and there is a gap between the biometric identification module and the display screen. In an embodiment of the present application, the biometric identification module and a lower surface of the display screen are designed to be separated, which can reduce difficulty of disassembling the biometric identification module, thereby improving maintainability of the terminal device. Further, complexity of manufacturing the biometric identification module under the display screen can be reduced and a production success rate can be enhanced, and thus production cost is reduced.

A lens module includes a circuit board, a carrier, and an optical filter. The carrier is fixed on a surface of the circuit board. The carrier defines a through hole. The optical filter is mounted on the carrier. The carrier defines at least one gas escape structure. A receiving space is between the optical filter and the circuit board, and the gas escape structure communicates with the receiving space to release water vapor in the receiving space and allow air pressure equalization and thus the relief of stress. The disclosure further provides an electronic device including the lens module.

A driving module is provided. The driving module includes a sensor module, a holder and at least three positioning components. The holder corresponds to the sensor module and is for holding an optical element. The positioning components are disposed between the sensor module and the holder.

The present disclosure discloses an optical imaging lens assembly, and the optical imaging lens assembly includes, sequentially from an object side to an image side along an optical axis: a first lens having positive refractive power, and at least one subsequent lens having refractive power. An F-number Fno1 of the optical imaging lens assembly satisfies Fno1>3.5, where an object distance is finite, and an F-number Fno2 of the optical imaging lens assembly satisfies Fno21.0, where the object distance is infinite.

Disclosed are a near-infrared absorbing composition including a copper complex represented by Chemical Formula 1, a near-infrared absorption layer formed by using the near-infrared absorbing composition including the copper complex represented by Chemical Formula 1, an optical structure including the near-infrared absorption layer, and a camera module or an electronic device including the optical structure, wherein Chemical Formula 1 is provided below, and ##STR00001##
and in Chemical Formula 1, R.sup.1, R.sup.2, x, and y are the same as described in the detailed description.

A lens module includes a circuit board, a photosensitive chip, a mounting bracket, a filter, a lens base, and a lens. The circuit board defines a first through hole. The photosensitive chip is mounted within the first through hole. Gold fingers are mounted on the circuit board surrounding the photosensitive chip. Metal wires are mounted on a periphery of the photosensitive chip. Each of the metal wires is coupled to a corresponding one of the gold fingers. The metal wires are encapsulated by a colloid so that the metal wires do not contact each other. The mounting bracket is mounted on the circuit board. The filter is mounted on the mounting bracket and aligned with the photosensitive chip. The lens base is mounted on the mounting bracket. The lens is mounted within the lens base and aligned with the photosensitive chip.

The present disclosure discloses a camera optical lens. The camera optical lens includes, in an order from an object side to an image side, an aperture, a first lens, a second lens, a third lens, a fourth lens, and a fifth lens. The camera optical lens further satisfies specific conditions.

A lens module with improved structural grounding and adhesion on and to a carrier includes a voice coil motor, a carrier, and a colloid attaching the voice coil motor to the carrier. A wall of the carrier defines at least one hole, and the hole is filled with the colloid to enhance and reinforce a bonding strength between the voice coil motor and the carrier. An electronic device applying such a lens module is also provided.

A composite optical element comprises a first base member, an optical resin layer, a bonding layer, and a second base member which are sequentially laminated such that the optical resin layer and the bonding layer are sandwiched between light entering/exiting surfaces of the first base member and the second base member. The thickness of the bonding layer changes along a straight line extending from the center toward the outer periphery of the bonding layer. Specifically, the thickness along the straight line is greater at an intermediate position between a first position and a second position than either of the thicknesses at the first position and at the second position. The first position is apart from the center by 0.8 times of half the diameter of the optical resin layer, and the second position corresponds to the outer periphery of the bonding layer.