An imaging apparatus includes a light source, a spatial light modulator, a Fourier transform optical system, a photodetector, and a control unit. The control unit sets a first region and a second region on a modulation plane of the spatial light modulator, sequentially sets a plurality of light phase modulation patterns in the first region, sequentially sets a plurality of uniform phase shifts in a region other than the first region when setting each light phase modulation pattern in the first region to acquire a light intensity value, and acquires a phase image of a region of an object corresponding to the first region using a phase shift method.

An optical module includes a support layer, a device layer which is provided on the support layer, and a movable mirror which is mounted in the device layer. The device layer has a mounting region which is penetrated by the movable mirror, and a driving region which is connected to the mounting region. A space corresponding to at least the mounting region and the driving region is formed between the support layer and the device layer. A portion of the movable mirror is positioned in the space.

Described examples include a micromechanical device having a substrate. The micromechanical device includes a MEMS element and a via between the MEMS element and the substrate, the via having a conductive layer extending from the substrate to the MEMS element and having a structural integrity layer on the conductive layer.

The present disclosure relates to a scanner and an electronic apparatus including the scanner. The scanner according to the present disclosure comprises a mirror, a substrate separated from the outside of the mirror, a first and a second mirror support member, a first and a second mirror spring, and a plurality of combs formed on the substrate and to supply a rotational force based on electrostatic force to the mirror, wherein the substrate includes a first edge and a second edge closer to the mirror than the first edge and placed at a lower position than the first edge, and the optical interference angle at the second edge is greater than the optical interference angle at the first edge. Accordingly, it is possible to output light in both directions of a mirror and thereby to perform wide-angle scanning.

The present disclosure provides a method for preparing a MEMS micro mirror with electrodes on both sides. The method includes: providing a first base, forming an electrode lead groove in the first base; forming an insulating groove, a plurality of lower comb plates and a moving space groove in a first device layer to obtain a bonded structure layer; providing a second base bonded with the bonded structure layer to obtain a bonded piece; forming a frame, upper comb plates, movable micro light reflector, and elastic beams in a second device layer, with the movable micro light reflector located inside the frame, and the elastic beam connected with the frame and/or the movable micro light reflector; forming a metal reflecting layer, a first upper comb plate electrode, a first lower comb plate electrode, a second upper comb plate electrode and a second lower comb plate electrode.

An optical device is disclosed. The optical device includes a first lens having a first surface and a plurality of side surfaces; a first display device disposed on a first side surface of the side surfaces of the first lens; and a first active mirror disposed in the first lens. The first active mirror is tilted at a first angle during a first period and is tilted at a second angle during a second period.

An example includes: an electrode layer including address electrodes and a hinge base; a hinge layer over the electrode layer, the hinge layer including: a torsional hinge having a longitudinal axis between opposite ends; a first single spring tip and a second single spring tip spaced from the torsional hinge; and raised electrodes spaced from the torsional hinge, from the first single spring tip, and from the second single spring tip; and a mirror over the hinge layer, the mirror having a tilt axis on a diagonal between a first corner and a second corner, the tilt axis aligned with the longitudinal axis of the torsional hinge, the mirror having a first tilting corner and a second tilting corner opposing one another across the tilt axis, the first single spring tip under the first tilting corner and the second single spring tip under the second tilting corner.

Implementations of a compressive light field projection system are disclosed herein. In one embodiment, the compressive light field projection system utilizes a pair of light modulators, such as digital micromirror devices (DMDs), that interact to produce a light field. The light field is then projected via a projection lens onto a screen, which may be an angle expanding projection screen that includes a Fresnel lens for straightening the views of the light field and either a double lenticular array of Keplerian lens pairs or a single lenticular, for increasing the field of view. In addition, compression techniques are disclosed for generating patterns to place on the pair of light modulators so as to reduce the number of frames needed to recreate a light field.

Embodiments of the disclosure provide a micromachined mirror assembly. The micromachined mirror assembly includes a micro mirror configured to tilt around an axis and a first and a second torsion beam each having a first and a second end. The second end of the first torsion beam and the second end of the second torsion beam are mechanically coupled to the micro mirror along the axis. The micromachined mirror assembly also includes a first DC voltage applied to the first end of the first torsion beam and a second DC voltage, different from the first DC voltage, is applied to the first end of the second torsion beam.

A light source or projector for a near-eye display includes a light source subassembly optically coupled to a waveguide concentrator. The light source subassembly may include several semiconductor chips each hosting an array of emitters such s superluminescent light-emitting diodes. The semiconductor chips may be disposed side-by-side, with their emitting sides or facets coupled to the waveguide concentrator, which provides a tight array of output light ports on a common output plane of the concentrator. The output diverging beams at the array of output light ports are coupled to a collimator, which collimates the beams and couples them to an angular scanner for scanning the collimated light beams together across the field of view of the display.