Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

A movable diffraction element and a spectroscope. The movable diffraction element includes a movable component having a comb-like shape, a supporting unit configured to support the movable component, a first cantilever actuator coupled to the supporting unit, a displacement determiner coupled to an edge of the first cantilever actuator, and a second cantilever actuator disposed parallel to the first cantilever actuator. In the movable diffraction element, a slope generated when the second cantilever actuator deforms is approximately equivalent to a slope generated at the first cantilever actuator. The spectroscope includes the movable diffraction element.

An actuator element of a MEMS device on a substrate is provided to create large, out-of-plane deflection. The actuator element includes a metallic layer having a first portion contacting the substrate and a second portion having an end proximal to the first portion. A distal end is cantilevered over the substrate. A first insulating layer contacts the metallic layer on a bottom contacting surface of the second cantilevered portion from the proximal to the distal end. A second insulating layer contacts the metallic layer on a portion of a top contacting surface at the distal end. The second portion of the metallic layer is prestressed. A coefficient of thermal expansion of the first and second insulating layers is different than a coefficient of thermal expansion of the metallic layer. And, a Young's modulus of the first and second insulating layer is different than a Young's modulus of the metallic layer.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

An oral scanner including a heating element, a reflecting element and a temperature difference generating element is provided. The temperature difference generating element has a high temperature end and a low temperature end. The high temperature end is connected to the reflecting element to heat the reflecting element, and the low temperature end is connected to the heating element to cool the heating element.

A displacement enlarging mechanism includes a substrate, a fixing portion provided at the substrate, an actuator coupled to the fixing portion, a beam extending in a direction substantially parallel to an upper surface of the substrate and having a base end side has been coupled to the actuator and coupled to the fixing portion and having folded back in a direction crossing the upper surface of the substrate, and a coupling portion and a mirror coupled to a folded-back portion formed by folding back of the beam. The actuator drives the beam to push or pull the beam from the base end side in the direction of the folded-back portion.

An actuator element of a MEMS device is provided, which is fabricated using surface micromachining on a substrate. An insulating layer having a first portion contacts the substrate while a second portion is separated from the substrate by a gap. A metallic layer contacts the insulating layer having a first portion contacting the first portion of the insulating layer and a second portion contacting the second portion of the insulating layer. The second portion of the metallic layer is prestressed. Alternately, the actuator element includes a first insulating layer separated from the substrate by a gap. A metallic layer has a first portion contacting the substrate and a second portion contacting the insulating layer. A second insulating layer contacts a portion of the second portion of the metallic layer opposite the first insulating layer, where the second insulating layer is prestressed.