This application discloses a MEMS chip structure, including a substrate, a side wall, a dielectric plate, a MEMS micromirror array, and a grid array, where the MEMS micromirror array includes a plurality of grooves and a plurality of MEMS micromirrors. The plurality of MEMS micromirrors are in a one-to-one correspondence with the plurality of grooves. The grid array is located above the MEMS micromirror array, and a lower surface of the grid array is connected to upper surfaces of side walls of at least some of the plurality of grooves.

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.

A method of post-processing an actuator element is presented. The method begins by receiving a fabricated actuator element including a metallic layer contacting a substrate, sacrificial layer proximate the metallic layer, and a first dielectric layer on the sacrificial layer. The metallic layer has an end proximal to and contacting at least part of the substrate and a distal end extending over the first dielectric layer. A second dielectric is deposited on a portion of the metallic layer at the distal end. And, the sacrificial layer is removed.

According to an aspect of the invention, there is provided a mirror structure for adaptive optics devices, characterized in that it comprises: an elastically deformable layer in response to an applied force, said deformable layer comprising a central portion reflective to said an incident light beam (F); a support substrate positioned spaced with respect to said deformable layer; a spacer element connected to said elastically deformable layer and support substrate and positioned there between, said spacer element being arranged so that the separation distance between said first and second inner surface is in the range between 2 and 100 micron; an inner chamber at least partially defined by said first and substrate and by said spacer element, said inner chamber containing a pressurized gas (G); an actuator system capable of causing a deformation of said central portion counteracting the pressure of said pressurized gas; wherein, in use, said central portion is deformed according to profiles such as to control said light beam. Advantages may include thermal robustness and improved dimensional scaling properties.

A micromirror structure includes an outer frame, an inner frame, a lens, a pair of first hinges, a pair of second hinges, a first driver module, and a second driver module. The pair of first hinges is respectively connected between two ends of the lens and an inner wall of the inner frame, and a connection line of the pair of first hinges forms a first rotation axis. The pair of second hinges is respectively connected between an outer wall of the inner frame and an inner wall of the outer frame, a connection line of the pair of second hinges forms a second rotation axis, and the first rotation axis is perpendicular to the second rotation axis. The micromirror structure can ensure that the lens is precisely positioned in a rotation process.

A micro laser diode projector comprises: an MEMS scanning device, which rotates around a first axis and a second axis that are orthogonal to each other; and a micro laser diode light source including at least one micro laser diode, wherein the micro laser diode light source is mounted on the MEMS scanning device and rotates around the first and second axes with the MEMS scanning device to project light to a projection screen. An electronics apparatus including the micro laser diode projector is also discussed.

Systems, methods, and apparatuses for providing on-board electromagnetic radiation sensing using beam splitting in a radiation sensing apparatus. The radiation sensing apparatuses can include a micro-mirror chip including a plurality of light reflecting surfaces. The apparatuses can also include an image sensor including an imaging surface. The apparatuses can also include a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit can include a beamsplitter that includes a partially-reflective surface that is oblique to the imaging surface and the micro-mirror chip. The apparatuses can also include an enclosure configured to enclose at least the beamsplitter and a light source. With the apparatuses, the light source can be attached to a printed circuit board (PCB). Also, the enclosure can include an inner surface that has an angled reflective surface that is configured to reflect light from the light source in a direction towards the beamsplitter.

Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.

A displacement enlarging mechanism includes a substrate, a fixing portion provided at the substrate, an actuator coupled to the fixing portion, a beam extending in a direction substantially parallel to an upper surface of the substrate and having a base end side has been coupled to the actuator and coupled to the fixing portion and having folded back in a direction crossing the upper surface of the substrate, and a coupling portion and a mirror coupled to a folded-back portion formed by folding back of the beam. The actuator drives the beam to push or pull the beam from the base end side in the direction of the folded-back portion.