G02F1/16755

Display device and array substrate

According to one embodiment, a display device includes a scanning line, a semiconductor layer, a first inorganic insulating film located between the scanning line and the semiconductor layer, a first signal line, a second inorganic insulating film having a main surface which contacts the first signal line and located between the semiconductor layer and the first signal line, a capacitance electrode contacting the main surface, a pixel electrode overlapping the capacitance electrode, and a third inorganic insulating film covering the first signal line and the capacitance electrode and located between the first signal line and the pixel electrode and between the capacitance electrode and the pixel electrode.

Display device and array substrate

According to one embodiment, a display device includes a scanning line, a semiconductor layer, a first inorganic insulating film located between the scanning line and the semiconductor layer, a first signal line, a second inorganic insulating film having a main surface which contacts the first signal line and located between the semiconductor layer and the first signal line, a capacitance electrode contacting the main surface, a pixel electrode overlapping the capacitance electrode, and a third inorganic insulating film covering the first signal line and the capacitance electrode and located between the first signal line and the pixel electrode and between the capacitance electrode and the pixel electrode.

CONDUCTIVE STRUCTURE AND E-PAPER DEVICE
20220026776 · 2022-01-27 ·

A conductive structure is applied to an e-paper device, which includes a driving substrate and an e-paper film. The e-paper film is disposed on the driving substrate, and includes a transparent substrate, a common electrode layer, and a display medium layer disposed between the common electrode layer and the driving substrate. The common electrode layer is disposed on one side of the transparent substrate facing the driving substrate. The display medium layer includes a through hole. The conductive structure is disposed in the through hole and includes a conductive member and at least one spacer. The conductive member is electrically connected to the driving substrate and the common electrode layer. The spacer is disposed in/on the conductive member, and contacts with the driving substrate and the common electrode layer. An e-paper device with the conductive structure is also disclosed.

CONDUCTIVE STRUCTURE AND E-PAPER DEVICE
20220026776 · 2022-01-27 ·

A conductive structure is applied to an e-paper device, which includes a driving substrate and an e-paper film. The e-paper film is disposed on the driving substrate, and includes a transparent substrate, a common electrode layer, and a display medium layer disposed between the common electrode layer and the driving substrate. The common electrode layer is disposed on one side of the transparent substrate facing the driving substrate. The display medium layer includes a through hole. The conductive structure is disposed in the through hole and includes a conductive member and at least one spacer. The conductive member is electrically connected to the driving substrate and the common electrode layer. The spacer is disposed in/on the conductive member, and contacts with the driving substrate and the common electrode layer. An e-paper device with the conductive structure is also disclosed.

Piezo electrophoretic display

Provided herein is an electro-optic display having a layer of electrophoretic material, a first conductive layer, and a piezoelectric material positioned between the layer of electrophoretic material and the first conductive layer, the piezoelectric material overlaps with a portion of the layer of electrophoretic material, and a portion of the first conductive layer overlaps with the rest of the electrophoretic material.

Piezo electrophoretic display

Provided herein is an electro-optic display having a layer of electrophoretic material, a first conductive layer, and a piezoelectric material positioned between the layer of electrophoretic material and the first conductive layer, the piezoelectric material overlaps with a portion of the layer of electrophoretic material, and a portion of the first conductive layer overlaps with the rest of the electrophoretic material.

Superomniphobic, flexible and rigid substrates with high transparency and adjustable haze for optoelectronic application

The invention relates generally to optically high transparency and adjustable haze, superomniphobic, rigid and flexible structures and, more particularly, to fused silica glass and flexible plastic, e.g., polymer, structures having a sub-wavelength texture formed on a surface thereof, which is effective to impart the optical properties of high transparency and adjustable haze to the structures. The texture is reentrant. Additionally, the optically high transparency and adjustable haze structures include a silicon dioxide coating applied to the texture and a treatment of a low surface energy material deposited on the silicon dioxide coating. The silicon dioxide coating renders the structures super hydrophilic, and the low surface energy material treatment renders the structures superomniphobic.

Superomniphobic, flexible and rigid substrates with high transparency and adjustable haze for optoelectronic application

The invention relates generally to optically high transparency and adjustable haze, superomniphobic, rigid and flexible structures and, more particularly, to fused silica glass and flexible plastic, e.g., polymer, structures having a sub-wavelength texture formed on a surface thereof, which is effective to impart the optical properties of high transparency and adjustable haze to the structures. The texture is reentrant. Additionally, the optically high transparency and adjustable haze structures include a silicon dioxide coating applied to the texture and a treatment of a low surface energy material deposited on the silicon dioxide coating. The silicon dioxide coating renders the structures super hydrophilic, and the low surface energy material treatment renders the structures superomniphobic.

Optical Component and Light Control Film Including Same

An optical component includes a substrate and a plurality of structures formed on a first major surface of the substrate and extending from the first major surface along a thickness direction of the optical component. The optical component can be assembled with another optical component to form a light control film. A light control film includes first and second optical components including respective pluralities of first and second structures formed on, and extending from, respective first and second substrates. The first and second optical components are assembled so that the first and second structures are disposed between the first and second substrates and interleaved to form a plurality of pairs of adjacent first and second structures. For each of at least some of the pairs, the adjacent first and second structures define an optical cavity therebetween substantially filled with a light absorbing material.

Optical Component and Light Control Film Including Same

An optical component includes a substrate and a plurality of structures formed on a first major surface of the substrate and extending from the first major surface along a thickness direction of the optical component. The optical component can be assembled with another optical component to form a light control film. A light control film includes first and second optical components including respective pluralities of first and second structures formed on, and extending from, respective first and second substrates. The first and second optical components are assembled so that the first and second structures are disposed between the first and second substrates and interleaved to form a plurality of pairs of adjacent first and second structures. For each of at least some of the pairs, the adjacent first and second structures define an optical cavity therebetween substantially filled with a light absorbing material.