A positive photosensitive resin composition includes a polymer resin, a quinonediazide compound, and a solvent. The polymer resin includes (i) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 1, ii) 5 to 95 wt. % of a polyimide precursor having a structural unit represented by Formula 2, and iii) 0 to 20 wt. % of a polyimide precursor having a structural unit represented by Formula 3. The quinonediazide compound is included in an amount of 5 to 50 parts by weight per 100 parts by weight of the polymer resin. The solvent is included in an amount of 100 to 2,000 parts by weight per 100 parts by weight of the polymer resin.

The present disclosure relates to a method for selecting a photosensitive resin composition, the method including: exposing a resin film of a photosensitive resin composition at 100 to 2000 mJ/cm.sup.2 and heat-treating the resin film at 150° C. to 250° C. for 1 to 3 hours under nitrogen to produce a strip sample of a cured film having a film thickness of 10 μm and a width of 10 mm; performing a fatigue test of repeatedly pulling the strip sample under condition (1) in which the set temperature is 25° C., the distance between chucks is 20 mm, the testing rate is 5 mm/min, and the cyclic load stress is 100 MPa, or under condition (2) in which the set temperature is −55° C., the distance between chucks is 20 mm, the testing rate is 5 mm/min, and the cyclic load stress is 120 MPa; and selecting a photosensitive resin composition satisfying the following condition: the number of times of pulling required until the strip sample breaks in the fatigue test is 100 or more cycles.

According to the present invention, a resin composition can be provided, comprising at least three components (a), (b) and (c), wherein component (a) is a polymer having a structure represented by the following formula (1), component (b) comprises thermal crosslinking agent (b1) and thermal crosslinking agent (b2), and component (c) is a photosensitizer, wherein R.sup.1 and R.sup.2 are independently selected from groups containing at least one atom other than hydrogen; and R.sup.3 and R.sup.4 are independently selected from a hydrogen atom or an organic group having 1 to 20 carbon atoms, and n is an integer selected from 1 to 10. The use of the resin composition of the present invention can result in a better flatness and bending recovery performance.

The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one structure selected from a polyimide structure, a polyamide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a polymer compound having a structural unit formed by cyclopolymerization; and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that are soluble in an alkaline aqueous solution, that can achieve high resolution without damaging excellent features such as the mechanical characteristics of a protective film, adhesiveness, etc., and that have excellent mechanical characteristics and adhesiveness to a substrate even when cured at low temperatures.

A negative-type photosensitive resin composition that has a satisfactory imidization rate and can yield a resin layer with high chemical resistance, even under low-temperature curing conditions of 200° C. or below, the negative-type photosensitive resin composition containing a photopolymerization initiator (B) in a proportion of 0.1 part by mass to 20 parts by mass with respect to 100 parts by mass of a polyimide precursor (A), the polyimide precursor (A) being a polyamic acid ester or polyamic acid salt with a specific structure, and the weight-average molecular weight (Mw) of the polyimide precursor (A) being 3,000 or greater and less than 16,000, in terms of polystyrene, according to gel permeation chromatography (GPC).

There is provided a highly sensitive colorant-containing photosensitive resin composition that can form an excellent crack resistant cured product for use in the formation of organic EL element barrier ribs. One embodiment of the photosensitive resin composition for use in organic EL element barrier ribs comprises: (A) a binder resin; (B) a phenolic hydroxyl group-containing compound having a molecular weight of 260 to 5,000 and a phenolic hydroxyl group equivalent of 80 to 155; (C) a radiation sensitive compound; and (D) a colorant selected from the group consisting of black dyes and black pigments.

The present specification relates to a binder resin, a photosensitive resin composition, an insulating film and a semiconductor device.

The present disclosure relates to novel negative-type photoresist composition and methods of their use. The disclosure further relates to multiple trigger photoresist processes which allow for the improvement in contrast, resolution, and/or line edges roughness in some systems without giving up sensitivity. The photoresist compositions and the methods of the current disclosure are ideal for fine patent processing using, for example, ultraviolet radiation, extreme ultraviolet radiation, beyond extreme ultraviolet radiation, X-rays and changed particle. The disclosure further relates to sensitivity enhancing materials useful in the disclosed compositions and methods.

Provided are a photosensitive resin composition which has excellent pattern processabilities (high sensitivity and high resolution) and is excellent in chemical resistance and thermal resistance after thermally treated; a heat-resistant resin or heat-resistant resin precursor used for the composition; and a diamine compound which is a raw material of the resin and the precursor. The diamine compound is a diamine compound represented by a general formula (1).

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Provided is a resin capable of producing a photosensitive resin composition having high sensitivity and heat resistance. Disclosed is a resin having a structure represented by general formula (1) or (2) as a main component, wherein R.sup.2 has an organic group represented by general formula (3) and an organic group represented by general formula (4).