Provided is a polysiloxane composition containing a polysiloxane compound including a constitutional unit represented by Formula (1) and at least one of a constitutional unit of Formula (2) and a constitutional unit of Formula (3), and a solvent.

[(R.sup.x).sub.bR.sup.1.sub.mSiO.sub.n/2]  (1)

[(R.sup.y).sub.cR.sup.2.sub.pSiO.sub.q/2]  (2)

[SiO.sub.4/2]  (3)

Here, R.sup.x is a monovalent group represented by Formula (1a) (X is a hydrogen atom or an acid-labile group, a is an integer of 1 to 5, and a broken line represents a bond), R.sup.y is a monovalent organic group having 1 to 30 carbon atoms, which contains any one of an epoxy group, an oxetane group, an acryloyl group, and a methacryloyl group.

##STR00001##

The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position: ##STR00001##
wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO).sub.n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO).sub.n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition, in which an acrylic copolymer and a siloxane copolymer are used together while a bulky monomer is introduced into the acrylic copolymer, facilitates the penetration of a developer and, at the same time, increases the inhibition efficiency of acid groups to produce the effect of improving the sensitivity.

A silsesquioxane resin, photoresist composition comprising the silsesquioxane resin and a photoacid generator, etching mask composition comprising the silsesquioxane resin, products prepared therefrom, methods of making and using same, and manufactured articles and semiconductor devices containing same. The silsesquioxane resin comprises silicon-bonded hydrogen atom T-units and T-units having a silicon-bonded group of formula —CH.sub.2CH.sub.2CH.sub.2CO.sub.2C(R.sup.1a).sub.3 or —CH(CH.sub.3)CH.sub.2CO.sub.2C(R.sup.1a).sub.3, wherein each R.sup.1a is independently an unsubstituted (C.sub.1-C.sub.2)alkyl.

An organic EL display device having excellent light-emitting reliability while it has pixel division layer (8) and/or planarization layer (4) having excellent optical properties is provided. An organic EL display device comprising first electrode (10), the pixel division layer (8), light emitting pixel (9), second electrode (5), the planarization layer (4), and substrate (6) wherein the pixel division layer (8) and/or the planarization layer (4) contains a yellow pigment having the benzimidazolone structure represented by the structural formula (1): ##STR00001##

The present invention is a resin composition including (a) a resin, (b) an antioxidizing agent, and (d) a crosslinking agent, wherein the resin composition is characterized by the following: the resin (a) is formed of one or more kinds of resins selected from among polyimide precursor, polyamide, polyimide, polybenzoxazole, and copolymers thereof; and the crosslinking agent (d) includes a phenolic hydroxyl group in one molecule, and also includes a substituent group having a molecular weight of 40 or more at both ortho positions of the phenolic hydroxyl group. Provided is the resin composition by which obtained is a pattern-cured film that enables fine patterns to be obtained, that exhibits excellent in-plane pattern uniformity while being curable at a low temperature of 250° C. or less, and that retains high extensibility and high adhesion with metal wires even after a reliability evaluation which is an actual-use accelerated test.

A patterning method and a method for manufacturing an array substrate are provided, and the patterning method includes: forming a photolithography auxiliary film and a positive photoresist film in turn on a base substrate provided with a layer to be patterned; subjecting the photolithography auxiliary film and the positive photoresist film to a photolithography process to form a photolithography auxiliary layer pattern and a positive photoresist pattern; patterning the layer to be patterned; and UV irradiating the photolithography auxiliary layer pattern and the positive photoresist pattern and then removing the photolithography auxiliary layer pattern and the positive photoresist pattern.

Disclosed are photosensitive resin compositions capable of forming positive resin films with excellent heat shape retention. The photosensitive resin compositions comprises a polymer having a monomer unit represented by the following general formula (I) and a polyamideimide: ##STR00001##
where R.sup.1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R.sup.2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent.

The present invention addresses the problem of providing a photosensitive resin composition which exhibits good imidization rate even in cases where the photosensitive resin composition is fired at a temperature of 200° C. or less, while having high pattern processability, and a cured film of which exhibits high long-term reliability if used in an organic EL display device. In order to solve the above-described problem, a photosensitive resin composition according to the present invention contains (a) a polyimide precursor, (b) a phenolic compound having an electron-withdrawing group and (c) a photosensitive compound; and the polyimide precursor (a) has a residue which is derived from a diamine that has an ionization potential of less than 7.1 eV.

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.