A highly-sensitive photosensitive resin composition contains a coloring agent, and can inhibit a coating from coming off in a development step. The photosensitive resin composition according to an embodiment of the present invention contains a binder resin (A), a compound (B) having a triazine ring and represented by formula (1), a radiation-sensitive compound (C), and a coloring agent (D) selected from the group consisting of black dyes and black pigments. In formula (1), R.sup.1, R.sup.2, and R.sup.3 each independently represent a hydroxy group, an alkyl group having 1-5 carbon atoms, an alkenyl group having 2-6 carbon atoms, an alkenyl ether group having 2-6 carbon atoms, an optionally substituted amino group, a halogenated alkyl group, a sulfide group, a mercapto group, a phenyl group, a phenyl ether group, a halogeno group, a naphthyl group, a pyridyl group, a biphenyl group, a morpholino group, a fluorene group, or a carbazole group.

An exemplary embodiment of the present application provides a polyimide resin in which the functional group represented by Chemical Formula 1 or 2 is bonded to at least one end of the polyimide resin.

An exemplary embodiment of the present application provides a polyimide resin comprising a structure represented by Chemical Formula 1 and a positive-type photosensitive resin composition comprising the same.

A polymer in the present invention contains a structural unit represented by the following general formula (1), where X.sub.1 is a tetravalent organic group, Z.sub.1 is a divalent organic group, and “k” is an integer of 1 to 3. Thus, the present invention provides: a positive photosensitive resin composition and a negative photosensitive resin composition which exhibit favorable solvent solubility and are capable of forming a fine pattern with high resolution as a result of solubility in an aqueous alkaline solution; a polyimide-based polymer usable as a base resin for these compositions; and a patterning method and a method for forming a cured film which use the compositions.

##STR00001##

A positive photosensitive resin composition for a low-temperature process includes an alkali-soluble phenolic resin, a compound with quinonediazide group, a mixed solvent and at least one additive. The mixed solvent includes a first solvent and a second solvent. The first solvent has a volatilization rate of more than 50 relative to a volatilization rate of butyl acetate of 100, and the second solvent has a boiling point between 150° C. and 200° C. The at least one additive has a molecular weight of 500-5000 and a structural unit as Formula (I), wherein R.sub.1 is selected from a group consisting of hydrogen, hydroxyl group, C1-C5 alkyl group, phenyl group, halogen atoms and cyano group, R.sub.2 is selected from a group consisting of hydrogen, acid radical, benzene and derivatives thereof, phenols, benzoic acid and derivatives thereof and aromatic heterocycles, and n is 10-80. It is also provided a method for preparing a photoresist film

##STR00001##

A composition for film formation containing a polycyclic polyphenolic resin having repeating units derived from at least one monomer selected from the group consisting of aromatic hydroxy compounds represented by the following formulae (1A) and (1B), wherein the repeating units are linked to each other by a direct bond between aromatic rings.

##STR00001##

(In the formula (1A), X represents an oxygen atom, a sulfur atom, a single bond, or non-crosslinked state and Y represents a 2n-valent group having 1 to 60 carbon atoms, or a single bond, wherein when X is non-crosslinked state, Y represents the 2n-valent group; in the formula (1B), A represents a benzene ring or a fused ring; in the formulas (1A) and (1B), each R.sup.0 is independently an alkyl group having 1 to 40 carbon atoms and optionally having a substituent, an aryl group having 6 to 40 carbon atoms and optionally having a substituent, an alkenyl group having 2 to 40 carbon atoms and optionally having a substituent, an alkynyl group having 2 to 40 carbon atoms, an alkoxy group having 1 to 40 carbon atoms and optionally having a substituent, a halogen atom, a thiol group, or a hydroxy group, wherein at least one R.sup.0 is a hydroxy group, and each m is independently an integer of 1 to 9; and N is an integer of 1 to 4, and each p is independently an integer of 0 to 3.)

The present invention is a photosensitive resin composition containing: (A) a resin; (B) a photosensitizer; (C) a surfactant containing a structural unit represented by the following average composition formula (1); and (D) a solvent, where Y.sub.1 and Y.sub.2 each independently represent a hydrogen atom, a methyl group, a phenyl group, or a group represented by the following general formula (2), at least one of Y.sub.1 and Y.sub.2 is a group represented by the following general formula (2), R.sub.1 to R.sub.6 are monovalent hydrocarbon groups that may be the same or different and optionally contain a heteroatom, having 1 to 20 carbon atoms, “l” and “n” are each independently integers of 1 to 100, and “m” is an integer of 0 to 100. This provides: a photosensitive resin composition that is excellent in film thickness uniformity at the time of application and that has reduced coating defects when forming a thick film; a patterning process performed using the photosensitive resin composition; a cured film formed by curing the pattern; and an electronic component having the cured film.

##STR00001##

A method of manufacturing a semiconductor device includes applying a polymer mixture over a substrate, exposing and developing at least a portion of the polymer mixture to form a developed dielectric, and curing the developed dielectric to form a dielectric layer. The polymer mixture includes a polymer precursor, a photosensitizer, and a solvent. The polymer precursor may be a polyamic acid ester.

The present invention provides an alkali-soluble resin with which a cured film having high extensibility, reduced stress, high adhesion to a metal, and high heat resistance can be obtained, and a photosensitive resin composition containing the alkali-soluble resin, and the present invention is an alkali-soluble resin (A) including a structure represented by a general formula (1) wherein X.sup.1 represents a divalent organic group having 2 to 100 carbon atoms, Y.sup.1 and Y.sup.2 each represent a divalent to hexavalent organic group having 2 to 100 carbon atoms, X.sup.2 represents a tetravalent organic group having 2 to 100 carbon atoms, p and q each represent an integer in a range of 0 to 4, and n.sup.1 and n.sup.2 each represent an integer in a range of 5 to 100,000, wherein (I) and (II) described below are satisfied: (I) an organic group having an aliphatic chain having 8 to 30 carbon atoms is contained as X.sup.1 of the general formula (1) at a content of 30 to 70 mol % based on 100 mol % of a total of X.sup.1 and X.sup.2, and (II) an organic group having a diphenyl ether structure is contained as Y.sup.1 of the general formula (1) at a content of 1 to 30 mol % based on 100 mol % of a total of Y.sup.1 and Y.sup.2.

The present invention is a positive photosensitive resin composition including: (A) an alkali-soluble resin containing at least one or more structures selected from a polyimide structure, a polybenzoxazole structure, a polyamide-imide structure, and a precursor structure thereof; (B) a crosslinkable polymer compound containing a structural unit represented by the following general formula (1) and having a group crosslinked with the component (A); and (C) a compound having a quinonediazide structure for serving as a photosensitizer to generate an acid by light and increase a dissolution speed to an alkaline aqueous solution. An object of the present invention is to provide a positive photosensitive resin composition and a positive photosensitive dry film that enable formation of a fine pattern and high resolution, have excellent mechanical characteristics even when cured at low temperatures, and have no degradation in adhesive force between before and after a high temperature and high humidity test.

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