G03F7/031

PHOTOSENSITIVE COMPOUND, PHOTOSENSITIVE COMPOSITION, AND PATTERNING METHOD

A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of

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The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.

PHOTOSENSITIVE COMPOUND, PHOTOSENSITIVE COMPOSITION, AND PATTERNING METHOD

A patterning method includes providing a photosensitive composition on a material layer. The photosensitive composition includes one part by weight of a photo sensitive compound, 1.5 to 8 parts by weight of a resin, and 10 to 40 parts by weight of a diluent. The photosensitive compound has a chemical structure of

##STR00001##

The patterning method further includes removing the diluent in the photosensitive composition to form a photoresist layer, exposing the photoresist layer, and removing an exposed part of the photoresist layer to expose a part of the material layer.

CURABLE RESIN COMPOSITION AND DISPLAY DEVICE

Provided is a curable resin composition containing quantum dots (A), a compound (B-1) having a first functional group and a second functional group, a resin (C), a photopolymerizable compound (D), and a photopolymerization initiator (E), wherein the first functional group is a carboxy group and the second functional group is a carboxy group or a thiol group.

ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD

Provided is an on-press development type lithographic printing plate precursor having a support, an image-recording layer, and an outermost layer in this order, in which the image-recording layer contains an infrared absorber, an electron-accepting polymerization initiator, and a polymerizable compound, LUMO of the electron-accepting polymerization initiator-LUMO of the infrared absorber is 0.45 eV or more, and the outermost layer contains a discoloring compound. Also provided is a method of preparing a lithographic printing plate and a lithographic printing method in which the on-press development type lithographic printing plate precursor is used.

ON-PRESS DEVELOPMENT TYPE LITHOGRAPHIC PRINTING PLATE PRECURSOR, METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE, AND LITHOGRAPHIC PRINTING METHOD

Provided is an on-press development type lithographic printing plate precursor having a support, an image-recording layer, and an outermost layer in this order, in which the image-recording layer contains an infrared absorber, an electron-accepting polymerization initiator, and a polymerizable compound, LUMO of the electron-accepting polymerization initiator-LUMO of the infrared absorber is 0.45 eV or more, and the outermost layer contains a discoloring compound. Also provided is a method of preparing a lithographic printing plate and a lithographic printing method in which the on-press development type lithographic printing plate precursor is used.

COLORING COMPOSITION, FILM, OPTICAL FILTER, SOLID-STATE IMAGING ELEMENT, IMAGE DISPLAY DEVICE, AND COMPOUND

A coloring composition includes at least one compound S selected from a compound S-1 represented by Formula (1) or a compound S-2 in which the compound S-1 is coordinated to a metal atom, a pigment, a resin P, and a solvent, in which the resin P includes at least one selected from a graft resin P-1 having a specific graft chain, a block copolymer P-2 including a specific structure, or a resin P-3 in which at least one terminal of a polymer chain including a specific structure is capped with an acid group.

##STR00001##

PHOTORESIST COMPOSITIONS AND METHODS FOR FABRICATING SEMICONDUCTOR DEVICE USING THE SAME

A photoresist composition including an organometallic compound, and a method for fabricating a semiconductor device using the same are provided. The photoresist composition may include an organometallic compound, a radical sensitizer including a structure of Chemical formula 2-1 or Chemical formula 2-2, and a solvent.

In Chemical formula 2-1,

##STR00001##

A.sup.1 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R.sup.1, R.sup.2 and R.sup.3 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.

In Chemical formula 2-2,

##STR00002##

A.sup.2 is a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, and R.sup.4 and R.sup.5 are each independently hydrogen, a halogen, a substituted or unsubstituted hydrocarbon group having 1 to 20 carbon atoms, or a hetero-functional group.

Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

Photoimageable compositions and processes for fabrication of relief patterns on low surface energy substrates

The present invention is directed to a permanent photoimageable compositions and the cured products thereof useful for making negative-tone, permanent photoresist relief patterns on low surface energy polymer substrates, comprising: (A) one or more alkali soluble, film forming resins or one or more film forming resins that become soluble in alkali solutions by action of an acid, (B) one or more cationic photoinitiators, (C) one or more film casting solvents, and (D) one or more fluorinated compounds. The present invention is also directed to methods of forming a permanent photoresist relief pattern on a low surface energy polymer substrate using the disclosed compositions.

Laminate, kit, method for producing laminate, and optical sensor

Provided is a laminate having a good whiteness and a high infrared-shielding property. Provided are also a kit forming the above-mentioned laminate, a method for producing a laminate, and an optical sensor. The laminate includes an infrared-shielding layer and a white layer, in which the infrared-shielding layer is a layer that shields at least a part of a wavelength range at 800 to 1,500 nm, and the white layer has a value of L* of 35 to 100, a value of a* of −20 to 20, and a value of b* of −40 to 30 in a L*a*b* color coordinate system of CIE 1976.