The present invention provides a positive photoresist composition having excellent storage stability, sensitivity, developing properties, plating resistance, and heat resistance. More specifically, a specific dissolution inhibitor in the form of an oligomer having the same repeating unit structure as the resin contained in the photoresist composition is applied to said composition.

There are provided a manufacturing method for a substrate having a conductive pattern, a manufacturing method for an electronic device, and a substrate having a conductive pattern, which are excellent in the dimensional stability of the conductive pattern after applying an electric current, as well as a protective film for a metal nanobody.

Provided are the manufacturing method for a substrate having a conductive pattern, comprising a step 1a of forming a conductive layer a containing a metal nanobody and a resin 1 on a substrate; a step 1b of forming a resin layer b containing a resin 2 on the conductive layer a; a step 2a of forming a photosensitive resin layer c on the resin layer b; a step 3 of obtaining a resin pattern c′ of the photosensitive resin layer by exposure and development treatment on the photosensitive resin layer c; a step 4 of removing the metal nanobody in the conductive layer a by etching to form a conductive pattern d; and a step 5a of softening or swelling at least one of the resin 1 or the resin 2, the manufacturing method for an electronic device, the substrate having a conductive pattern, and the protective film for a metal nanobody.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film manufactured using the same, a backlight unit and a display apparatus.

The present specification relates to a compound represented by Chemical Formula 1, a photoresist fluorescent resin composition including the same, and a color conversion film manufactured using the same, a backlight unit and a display apparatus.

The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.

The present invention provides a photosensitive resin multilayer body which is obtained by superposing, on a supporting film, a photosensitive resin layer containing a photosensitive resin composition that contains from 10% by mass to 90% by mass of (A) an alkali-soluble polymer, from 5% by mass to 70% by mass of (B) a compound having an ethylenically unsaturated double bond and from 0.01% by mass to 20% by mass of (C) a photopolymerization initiator; the alkali-soluble polymer (A) contains a copolymer which contains, as a copolymerization component, a (meth)acrylate that has an alkyl group having from 3 to 12 carbon atoms; an acrylate monomer is contained, as the compound (B) having an ethylenically unsaturated double bond, in an amount of from 51% by mass to 100% by mass relative to the total amount of the compound (B) having an ethylenically unsaturated double bond; the absorbance A of the photosensitive resin layer containing the photosensitive resin composition at a wavelength of 365 nm, said photosensitive resin layer having a film thickness T (μm), satisfies the relational expression 0<A/T≤0.007; and the film thickness of the photosensitive resin layer containing the photosensitive resin composition is from 40 μm to 600 μm.

Provided are a coloring resin composition including a resin, a coloring material, and an organic solvent, in which the resin includes a resin A including a repeating unit (A) represented by Formula (a), where, in Formula (a), L.sup.a1 represents a trivalent group, Ar.sup.a1 represents an aromatic hydrocarbon group having a substituent, the substituent is a group having a structure in which a bonding portion with the aromatic hydrocarbon group is an ester bond or an amide bond, in the ester bond, an atom on a side different from an oxygen atom in the ester bond is on a side of the bonding portion with the aromatic hydrocarbon group, and in the amide bond, an atom on a side different from a nitrogen atom in the amide bond is on a side of the bonding portion with the aromatic hydrocarbon group; a film formed of the coloring resin composition; a color filter; a solid-state imaging element; and an image display device.

##STR00001##

A composition includes two or more near infrared absorbing compounds having an absorption maximum in a wavelength range of 650 to 1000 nm and having a solubility of 0.1 mass % or lower in water at 23° C., in which the two or more near infrared absorbing compounds include a first near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm, and a second near infrared absorbing compound having an absorption maximum in a wavelength range of 650 to 1000 nm which is shorter than the absorption maximum of the first near infrared absorbing compound, and a difference between the absorption maximum of the first near infrared absorbing compound and the absorption maximum of the second near infrared absorbing compound is 1 to 150 nm.

The present invention provides a curable compound including a pigment, a compound A, a photopolymerization initiator, a curable compound other than the compound A, and a resin, in which a content of the compound A in a total solid content of the curable composition is 1 to 15 mass %. The compound A is a compound having each of a coloring agent partial structure, an acid group or a basic group, and a curable group. The present invention further provides a method for producing the curable composition, a film formed of the curable composition, a color filter, a method for manufacturing a color filter, a solid-state imaging element, and an image display device.

A sensor film includes a substrate, a sensor electrode which is disposed on the substrate, a lead wire which is disposed on the substrate, conducts with the sensor electrode, and has a connection terminal, a first protective layer which is disposed on the connection terminal, and a second protective layer which is disposed on at least the sensor electrode or a portion of the lead wire other than the connection terminal, in which the first protective layer satisfies a relationship represented by the following expression (1),

0 V<D×B≤30.0 V  (1) D: Thickness (μm) of the first protective layer B: Dielectric breakdown voltage (V/μm) of the first protective layer.