The present invention relates to a structure for a quantum dot barrier rib and a process for preparing the same. The structure for a quantum dot barrier rib of the present invention comprises a cured film having a uniform film thickness and an appropriate range of film thickness. Here, the reflectance R.sub.SCI measured by the SCI (specular component included) method and the reflectance R.sub.SCE measured by the SCE (specular component excluded) method are reduced, and the ratio between them (R.sub.SCE/R.sub.SCI) is appropriately adjusted, so that it is possible to satisfy such characteristics as high light-shielding property and low reflectance at the same time while the resolution and pattern characteristics are maintained to be excellent. In addition, when the structure for a quantum dot barrier rib is prepared, it is possible to form a multilayer pattern having a uniform film thickness suitable for the quantum dot barrier ribs in a single development process. Thus, it can be advantageously used for a quantum dot display.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.

The present invention relates to a positive-type photosensitive resin composition and a cured film prepared therefrom. The positive-type photosensitive resin composition comprises a nonpolar organic solvent, thereby suppressing the reactivity of the epoxy group in the composition to reduce the production of diol compounds. When a cured film is prepared from the composition, an appropriate level of developability can be maintained to further enhance the pattern adhesiveness, resolution, and sensitivity. Further, since the composition of the present invention has a small difference in the film retention rates at room temperature and low temperatures, the composition may have stable stability over time.

Provided are a photosensitive composition including a colorant A, a photopolymerization initiator B, a polymerizable compound C, and a compound D which is a salt of an anion and a di- or higher valent cation having a formula weight or molecular weight of 1000 or less and has a specific absorbance of 5 or less, the specific absorbance being at a maximum absorption wavelength in a wavelength range of 400 to 700 nm; a film formed of the photosensitive composition; and a color filter, a solid-state imaging element, and an image display device, which includes the film.

Disclosed are a photosensitive resin composition including (A) a colorant including a xanthene-based dye and a blue pigment having an average particle diameter (D50) of less than 100 nm; (B) a binder resin including a radically polymerizable double bond; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a matting agent; and (F) a solvent, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the photosensitive resin layer.

Disclosed are a photosensitive resin composition including (A) a colorant including a xanthene-based dye and a blue pigment having an average particle diameter (D50) of less than 100 nm; (B) a binder resin including a radically polymerizable double bond; (C) a photopolymerizable compound; (D) a photopolymerization initiator; (E) a matting agent; and (F) a solvent, a photosensitive resin layer manufactured using the photosensitive resin composition, and a color filter including the photosensitive resin layer.

A photosensitive transfer material including a temporary support and a transfer layer including a photosensitive layer, in which the photosensitive layer has infrared curing properties, and a transmittance of the photosensitive layer to light having a wavelength of 830 nm is 0.1% or more.

The present invention relates to: a photosensitive transfer material including a temporary support and a photosensitive layer containing a binder polymer, a polymerizable compound, a photopolymerization initiator, and a compound A, in which a number of hydrophilic groups in the compound A being decreased by an action of light or heat, and the photosensitive layer is transferred to a surface of a metal-containing layer; a method of producing the photosensitive transfer material; a film; a touch panel; a method of suppressing deterioration; a laminate; and a method of producing the film.

Provided are (1) a composition including an alkali-soluble resin, a polymerizable compound, a photopolymerization initiator, a surfactant, and a solvent, in which a surface tension measured by a Wilhelmy method at 25° C. is 26.5 mN/m or less; (2) a composition including a surfactant and a solvent, in which a surface tension T1 measured by a Wilhelmy method at 25° C. and a surface tension T2 measured by a Wilhelmy method at 25° C. immediately before a timing that a volume reaches 60% of an initial volume in an environment of a temperature of 25° C. and a relative humidity of 60% satisfy a relationship of T1>T2; and (3) applications thereof.

A curable photosensitive resin composition which can be cured at a relatively low temperature, has excellent developability and adhesion to a support, and a cured product that realizes low dielectric constant properties. A curable photosensitive resin composition containing a polyimide resin (A) which is a reaction product of monomer groups containing an aromatic tetracarboxylic anhydride (a1) and a diamine (a2) containing a dimer diamine, maleimides (B), and a polyfunctional polymerizable compound (C) having two or more ethylenic double bonds other than the component (A) and the component (B), a cured product, a photosensitive element, a resist pattern, a method of producing a resist pattern, a semiconductor device and an electronic device.