Disclosed are photosensitive resin compositions capable of forming positive resin films with excellent heat shape retention. The photosensitive resin compositions comprises a polymer having a monomer unit represented by the following general formula (I) and a polyamideimide: ##STR00001##
where R.sup.1 is a single chemical bond or a divalent C1-C6 hydrocarbon group which may have a substituent, and R.sup.2 is a hydrogen or a monovalent C1-C6 hydrocarbon group which may have a substituent.

A photosensitive resin composition according to the present invention is a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, (d-1) a photobleaching photopolymerization initiator having the structure represented by general formula (1), and (d-2) a photopolymerization initiator having the structure represented by general formula (1) and having a molar extinction coefficient at a wavelength of 405 nm of at least 1000 L/(mol.Math.cm). (In general formula (1), R.sup.1 represents a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, —NR.sup.3R.sup.4, C1-20 monovalent hydrocarbon group, C1-20 acyl group, or C1-20 alkoxy group, and R.sup.3 and R.sup.4 each independently represent a hydrogen atom or C1-10 alkyl group, provided that at least a portion of the hydrogen atoms in the hydrocarbon group, acyl group, and alkoxy group may be substituted by a halogen atom, hydroxy group, carboxy group, nitro group, cyano group, or —NR.sup.3R.sup.4, and a hydrocarbon group present in the hydrocarbon group, in the acyl group, or in the alkoxy group may be interrupted by an ether bond, thioether bond, ester bond, thioester bond, amide bond, or urethane bond. R.sup.2 represents a C1-5 alkyl group. The symbol * in the formula indicates bonding with a neighboring group via the * moiety.) The photosensitive resin composition according to the present invention is also a photosensitive resin composition comprising (a) an alkali-soluble polyimide, (b) an unsaturated bond-containing compound, (c) a thermally crosslinkable compound, and (d) at least two species of oxime ester-type photopolymerization initiators. The photosensitive resin composition according to the present invention enables a high-sensitivity, high-quality photographic patterning of the cap portion of a hollow structure. A photosensitive resin sheet that uses the photosensitive resin composition according to the present invention is useful for application to the cap of the hollow structure of an electronic component that includes a hollow structure.

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

There are provided a method of manufacturing a cured film, including a first exposure step of exposing a part of a photocurable film formed from a photocurable resin composition, a development step of developing the photocurable film after the exposure with a developing solution to obtain a pattern, and a second exposure step of exposing the pattern with light including light having a wavelength different from a wavelength of light used in the first exposure step, where the photocurable resin composition has a specific constitution, a photocurable resin composition that is used in the method of manufacturing the cured film, a method of manufacturing a laminate including the method of manufacturing a cured film, and a method of manufacturing an electronic device, which includes the method of manufacturing the cured film.

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

A resin having a small linear thermal expansion coefficient and a low absorbance is provided. The resin is characterized by including at least one structure selected from structures represented by the following general formulae (1) and (2): ##STR00001##

Provided are a coloring resin composition including a resin, a coloring material, and a solvent, in which the resin is a polyimide or polyimide precursor including a repeating unit represented by Formula (1-1) or Formula (1-2), and a content of the coloring material is 30 mass % or more with respect to a total solid content of the composition; a film; a color filter; a solid-state imaging element; and an image display device.

##STR00001##

A photosensitive resin composition used for forming an insulating layer includes a resin including an aromatic polyester imide structure, a photopolymerization initiator and a thermal radical polymerization initiator, and when the resin including an aromatic polyester imide structure does not include a (meth)acryl group, the resin composition includes a (meth)acryloyl compound.

This disclosure relates to a dielectric film-forming composition that includes (a) at least one cyanate ester compound, the at least one cyanate ester compound containing at least two cyanate groups; and (b) at least one dielectric polymer including a polybenzoxazoie precursor polymer, a polyimide precursor polymer, or a fully imidized polyimide polymer.

The present invention provides a photosensitive resin composition comprising (a) a polyamide ester represented by formula (1); (b) a polyimide; (c) a photo radical initiator; (d) a radical polymerizable compound; and (e) a solvent for dissolving the photosensitive polyimide

##STR00001## in which A, B, R.sup.1, R.sup.2, and m have the meaning as defined herein.