The disclosure provides a projection exposure method for exposing a substrate arranged in the region of an image plane of a projection lens with at least one image of a pattern of a mask arranged in the region of an object plane of the projection lens. A substrate is coated with a radiation-sensitive multilayer system including a first photoresist layer composed of a first photoresist material and, between the first photoresist layer and the substrate and a separately applied second photoresist layer composed of a second photoresist material. The first photoresist material has a relatively high first sensitivity in a first wavelength range and a second sensitivity, which is lower relative to the first sensitivity, in a second wavelength range separate from the first wavelength range. The second photoresist material has an exposure-suitable second sensitivity in the second wavelength range.

The disclosure provides a projection exposure method for exposing a substrate arranged in the region of an image plane of a projection lens with at least one image of a pattern of a mask arranged in the region of an object plane of the projection lens. A substrate is coated with a radiation-sensitive multilayer system including a first photoresist layer composed of a first photoresist material and, between the first photoresist layer and the substrate and a separately applied second photoresist layer composed of a second photoresist material. The first photoresist material has a relatively high first sensitivity in a first wavelength range and a second sensitivity, which is lower relative to the first sensitivity, in a second wavelength range separate from the first wavelength range. The second photoresist material has an exposure-suitable second sensitivity in the second wavelength range.

The present disclosure relates to a dynamic lithographic exposure method, and an associated apparatus, which exposes a photosensitive material over a plurality of depths of focus respectively spanning a different region of the photosensitive material. By exposing the photosensitive material over a plurality of depths of focus, the exposure of the photosensitive material is improved resulting in a larger lithographic process window. In some embodiments, the dynamic lithographic exposure method is performed by forming a photosensitive material over a substrate. The photosensitive material is exposed to electromagnetic radiation at a plurality of depths of focus that respectively span a different region within the photosensitive material. Exposing the photosensitive material to the electromagnetic radiation modifies a solubility of an exposed region within the photosensitive material. The photosensitive material is then developed to remove the soluble region.

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

The present disclosure, in some embodiments, relates to a photolithography tool. The photolithography tool includes an illumination source configured to generate electromagnetic radiation and projection optics configured to focus the electromagnetic radiation onto a photosensitive material overlying a substrate according to a pattern on a photomask. A dynamic focal element is configured to dynamically change positions at which the electromagnetic radiation is focused over the substrate during exposure of the photosensitive material. The positions at which the electromagnetic radiation is focused define a plurality of depths of focus. The plurality of depths of focus respectively span a different spatial region within the photosensitive material that is smaller than a thickness of the photosensitive material

An exposure apparatus exposes a substrate with illumination light via a liquid. A liquid immersion member of the exposure apparatus has a lower surface, a plurality of collection ports, and a plurality of supply ports. The lower surface has an opening through which illumination light passes. The collection ports are arranged at the lower surface to surround the opening, and the supply ports are arranged at the lower surface and between the opening and the collection ports to surround the opening, such that the liquid is supplied via the supply ports onto the substrate while the substrate is arranged opposite to a plane-convex lens of a projection optical system and such that the liquid is collected via the collection ports from the substrate.

The technology disclosed relates to accommodating embedded substrates during direct writing onto a printed circuit board and to other patterning problems that benefit from an extended depth of focus. In particular, it relates to multi-focus direct writing of a workpiece by the continuous or step-wise movement of the workpiece during the sequence of exposures having different focus planes. In one implementation, a multi-arm rotating direct writer is configured for interleaved writing focused on two or more focal planes that generally correspond to two or more surface heights of a radiation sensitive layer that overlays the uneven workpiece. Alternating arms can produce interleaved writing to the two or more focal planes.

An exposure apparatus exposes a substrate with illumination light via a liquid. A liquid immersion member of the exposure apparatus has a lower surface, a plurality of collection ports, and a plurality of supply ports. The lower surface has an opening through which illumination light passes. The collection ports are arranged at the lower surface to surround the opening, and the supply ports are arranged at the lower surface and between the opening and the collection ports to surround the opening, such that the liquid is supplied via the supply ports onto the substrate while the substrate is arranged opposite to a plane-convex lens of a projection optical system and such that the liquid is collected via the collection ports from the substrate.

An exposure apparatus exposes a substrate with illumination light via a liquid. A liquid immersion member of the exposure apparatus has a lower surface, a plurality of collection ports, and a plurality of supply ports. The lower surface has an opening through which illumination light passes. The collection ports are arranged at the lower surface to surround the opening, and the supply ports are arranged at the lower surface and between the opening and the collection ports to surround the opening, such that the liquid is supplied via the supply ports onto the substrate while the substrate is arranged opposite to a plane-convex lens of a projection optical system and such that the liquid is collected via the collection ports from the substrate.

An exposure apparatus exposes a substrate with illumination light via a liquid. A liquid immersion member of the exposure apparatus has a lower surface, a plurality of collection ports, and a plurality of supply ports. The lower surface has an opening through which illumination light passes. The collection ports are arranged at the lower surface to surround the opening, and the supply ports are arranged at the lower surface and between the opening and the collection ports to surround the opening, such that the liquid is supplied via the supply ports onto the substrate while the substrate is arranged opposite to a plane-convex lens of a projection optical system and such that the liquid is collected via the collection ports from the substrate.