A method for determining a correction to a patterning process. The method includes obtaining a plurality of qualities of the patterning process (e.g., a plurality of parameter maps, or one or more corrections) derived from metrology data and data of an apparatus used in the patterning process, selecting, by a hardware computer system, a representative quality from the plurality of qualities, and determining, by the hardware computer system, a correction to the patterning process based on the representative quality.

A light source for EUV is provided. The light source includes a target droplet generator, a laser generator, and a controller. The target droplet generator is configured to provide target droplets to a source vessel. The laser generator is configured to provide first laser pulses according to a control signal to irradiate the target droplets in the source vessel. The controller is configured to provide the control signal according to at least two of process parameters including temperature of the source vessel, droplet positions of the target droplets, and beam sizes and focal points of the first laser pulses. When the average value or the standard deviation of the temperature of the source vessel and the droplet positions of the target droplets exceed the predetermined range, the controller is configured to provide the control signal to the laser generator to stop providing the first laser pulses.

A radiation source apparatus is provided. The radiation source apparatus includes a chamber, an exhaust module, a measuring device, a gas supply module and a controller. The exhaust module is configured to extract debris caused by unstable target droplets out of the chamber according to a first gas flow rate. The measuring device is configured to measure concentration of the debris in the chamber. The gas supply module is configured to provide a gas into the chamber according to a second gas flow rate. The controller is configured to adjust the first gas flow rate and the second gas flow according to the measured concentration of the debris.

An extreme ultraviolet light generation apparatus that generates plasma by irradiating a target substance with a pulse laser beam and generates extreme ultraviolet light from the plasma includes: a droplet detection unit configured to detect a droplet passing through a predetermined position between a target supply unit and a plasma generation region; and a control unit configured to control a laser apparatus configured to output the pulse laser beam. The control unit performs control to determine whether there is a defective droplet based on a droplet detection signal obtained from the droplet detection unit and to stop, when it is determined that there is a defective droplet, irradiation of the defective droplet determined to be defective, a preceding droplet output one droplet before the defective droplet, and a following droplet output one droplet after the defective droplet with the pulse laser beam.

To provide a cleaning apparatus advantageous for cleaning, for example, an original plate used to transfer a pattern to a substrate. Provided is a cleaning apparatus that cleans an original plate used when a pattern is transferred to a substrate, the cleaning apparatus including a region dividing unit which divides the original plate into a plurality of regions on the basis of information of the original plate, a conditions generator which generates cleaning conditions for each of the separate regions, and a cleaner which cleans the original plate on the basis of the cleaning conditions.

A system and method for cleaning an optical element of an EUV optical system is disclosed. The system and method may include receiving design data of one or more samples. The system and method may include simulating a plurality of irradiance distributions at a plane of an EUV optical sub-system based on the design data and one or more parameters. The system and method may include aggregating the plurality of irradiance distributions to generate an aggregated irradiance distribution. The system and method may include determining a predicted contaminate distribution based on both the aggregated irradiance distribution and a contaminate growth rate. The system and method may include determining a cleaning recipe for the one or more optical elements based on the predicted contaminate distribution.

A system for a semiconductor fabrication facility includes a maintenance tool, a control unit, a first track, a second track, a maintenance crane movably mounted on the first track, a plurality of first sensors disposed on the first track, an OHT vehicle movably mounted on the second track, and a second sensor on the OHT vehicle. The first sensors detect a location of the maintenance crane and generate a first location data to the control unit. The second sensor generates a second location data to the control unit.

An extreme ultraviolet light generation apparatus may include: a chamber device including an internal space; a target supply unit disposed at the chamber device and configured to supply a droplet of a target substance to the internal space; a target collection unit disposed at the chamber device, communicated with the internal space through an opening provided to an inner wall of the chamber device, and configured to collect the droplet passing through the opening; a detection unit disposed at the chamber device and configured to detect the target substance accumulating in the vicinity of the opening of the inner wall; and a control unit configured to stop the target supply unit depending on a result of the detection by the detection unit.

Extreme ultraviolet (EUV) lithographic patterning methods are provided which implement a surface-hardened EUV resist mask to pattern features in multiple layers. A layer of EUV resist material is formed on a substrate. An EUV resist mask is formed by exposing and developing the layer of EUV resist material. A surface-hardened EUV resist mask is formed by applying a surface treatment to an upper surface of the EUV resist mask to form an etch-resistant layer that is embedded in the upper surface of the EUV resist mask. At least one layer of the substrate is patterned using the surface-hardened EUV resist mask. The surface treatment can be implemented using a neutral atom beam (NAB) process which is configured to implant a chemical or metallic species into the upper surface of the EUV resist mask to form the etch-resistant layer.

A cell control system that reduces an abnormality occurrence probability in a manufacturing cell according to a manufacturing cell operation plan includes a cell controller that transmits an operation instruction to a manufacturing machine of the manufacturing cell. The cell controller includes a machine operation instructing unit that transmits the operation instruction to each manufacturing machine based on an operation schedule, an operation information collecting unit that collects operation information of the manufacturing machine, an alarm probability estimating unit that estimates an alarm occurrence probability of the manufacturing machine, a schedule candidate creating unit that creates at least one operation schedule candidate having a changed order of an operation element of the operation schedule or start time, and an optimal candidate selecting unit that selects a shortest necessary time that takes the alarm occurrence into account from the operation schedule and the operation schedule candidate as a selected operation schedule.