Patent classifications
G03F7/70708
PROTECTIVE COATING FOR ELECTROSTATIC CHUCKS
An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO.sub.2), silicon nitride (Si.sub.3N.sub.4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
OBJECT TABLE COMPRISING AN ELECTROSTATIC CLAMP
Disclosed is an object table for holding an object, comprising: an electrostatic clamp arranged to clamp the object on the object table; a neutralizer arranged to neutralize a residual charge of the electrostatic clamp; a control unit arranged to control the neutralizer, wherein the residual charge is an electrostatic charge present on the electrostatic clamp when no voltage is applied to the electrostatic clamp.
Substrate holder and a method of manufacturing a device
A substrate holder, a method of manufacturing of the substrate holder and a lithographic apparatus having the substrate holder. In one arrangement, a substrate holder is for use in a lithographic apparatus. The substrate holder is configured to support a lower surface of a substrate. The substrate holder has a main body, a plurality of burls and a coating. The main body has a substrate-facing face. The plurality of burls protrudes from the substrate-facing face. Each burl has a distal end configured to engage with the substrate. The distal ends are configured for supporting the substrate. The coating is on the substrate-facing face between the burls. Between the burls the substrate-facing face has an arrangement of areas. Adjacent areas are separated by a step-change in distance below the support plane. Each step-change is greater than a thickness of the coating.
Protective coating for electrostatic chucks
An ElectroStatic Chuck (ESC) including a chucking surface having at least a portion covered with a coating of silicon oxide (SiO.sub.2), silicon nitride (Si.sub.3N.sub.4) or a combination of both. The coating can be applied in situ a processing chamber of a substrate processing tool and periodically removed and re-applied in situ to create fresh coating.
Apparatus and method for processing a substrate using the same
An apparatus for processing the substrate includes a substrate stage and a source. The substrate stage is configured to support a substrate thereon. The substrate stage includes a substrate support formed with a first opening therein. The first opening is an annular opening. The source is coupled to the first opening and is configured to supply first gas/air to a bottom surface of the substrate through the first opening.
BURLS WITH ALTERED SURFACE TOPOGRAPHY FOR HOLDING AN OBJECT IN LITHOGRAPHY APPLICATIONS
Various burl designs for holding an object in a lithographic apparatus are described. A lithographic apparatus includes an illumination system, a first support structure, a second support structure, and a projection system. The illumination system is designed to receive radiation and to direct the radiation towards a patterning device that forms patterned radiation. The first support structure is designed to support the patterning device on the first support structure. The second support structure has a plurality of burls and is designed to support the substrate on the plurality of burls. A topography of a top surface of each of the plurality of burls is not substantially flat, such that a contact area between the substrate and each of the plurality of burls is reduced. The projection system is designed to receive the patterned radiation and to direct the patterned radiation towards the substrate.
Apparatus for and method cleaning a support inside a lithography apparatus
Methods and systems are described for cleaning a support such as a clamp of a chuck that holds a patterning device or a wafer in a lithographic apparatus. The method includes loading a electrostatic cleaning substrate into a lithographic apparatus. The electrostatic cleaning substrate includes at least one electrode. The method further includes bringing the electrostatic cleaning substrate near to the clamping surface to be cleaned and connecting the electrode to a voltage source. Particles present on the support are then transferred to the electrostatic cleaning substrate.
Method and apparatus for lithography in semiconductor fabrication
A reticle holding tool is provided. The reticle holding tool includes a housing, a reticle chuck, and a gas delivery assembly. The housing includes an opening, a top housing member, and a lateral housing member extending from the top housing member and terminating at a lower edge which is located on a predetermined plane. The reticle chuck is positioned in the housing and has an effective surface configured to secure a reticle. The effective surface is located between the predetermined plane and the top housing member. The reticle chuck is movable between two boundary lines that are perpendicular to the effective surface. A width of the opening is greater than a distance between the two boundary lines. The gas delivery assembly is positioned within the housing and configured to supply gas into the housing.
SUBSTRATE PROCESSING APPARATUS AND ARTICLE MANUFACTURING METHOD
The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.
Substrate processing apparatus and article manufacturing method
The present invention provides a substrate processing apparatus that processes a substrate, the apparatus including a stage configured to hold and move the substrate, a conveying unit configured to hold and convey the substrate between conveying unit and the stage, an accumulation unit configured to accumulate control information concerning the stage and the conveying unit which is generated by processing the substrate, and a determination unit configured to determine a conveying procedure when conveying the substrate between the stage and the conveying unit by selecting one of a plurality of conveying procedures which can be set for the stage and the conveying unit based on control information accumulated in the accumulation unit.