A reticle detection apparatus includes a processing unit, an optical detection unit, and an auxiliary detection unit; the optical detection unit is configured to determine whether there is a reticle according to the intensity of the received light; the processing unit is configured to start the auxiliary detection unit when the optical detection unit does not detect the reticle; the auxiliary detection unit is configured to detect whether there is a reticle based on the piezoelectric effect or the acoustoelectric effect; wherein, after the auxiliary detection unit is started, the processing unit is configured to serve the detection result of the auxiliary detection unit as a basis for determining whether there is a reticle.

A storage environment monitoring device is capable of measuring and/or monitoring various parameters of an environment inside a storage area, such as airflow, temperature, and humidity, to increase the storage quality of semiconductor components stored in the storage area. The storage environment monitoring device is capable of measuring and/or monitoring the parameters of the environment inside the storage area without having to open an enclosure that is storing the semiconductor components in the storage area. This reduces exposure of the semiconductor components to contamination and other environmental factors. In addition, the storage environment monitoring device may perform automatic measurements inside the storage area based on usage schedules of the semiconductor components that are to be stored in the storage area, which decreases downtime of the storage area and/or the semiconductor components, and increases productivity in a semiconductor processing environment in which the semiconductor components are used.

In a method of manufacturing a semiconductor device a semiconductor wafer is retrieved from a load port. The semiconductor wafer is transferred to a treatment device. In the treatment device, the surface of the semiconductor wafer is exposed to a directional stream of plasma wind to clean a particle from the surface of the semiconductor wafer. The stream of plasma wind is generated by an ambient plasma generator and is directed at an oblique angle with respect to a perpendicular plane to the surface of the semiconductor wafer for a predetermined plasma exposure time. After the cleaning, a photo resist layer is disposed on the semiconductor wafer.

At least a first reticle is stored in a housing of a stocker. A first gas is delivered to the housing. At least one reticle pod having an additional reticle is delivered into a enclosure within the housing of the stocker. A second gas different from the first gas is delivered to the enclosure. The reticle pod is automatically retrieved from the enclosure. The delivery and retrieval of the reticle pod and delivery of the first gas and the second gas are automatically controlled.

The present application provides a semiconductor lithography apparatus, including: a photomask conveying device and a photomask clamping device connected to the photomask conveying device, wherein the photomask clamping device is configured to carry a photomask; and a photomask-cleaning gas jet device connected to the photomask clamping device for jetting a gas to an upper side of the photomask so as to prevent particulate matters from falling on a surface of the photomask.

A carrying device and a fixing method of a carrying device are provided. The carrying device includes a body and an electromagnet fixing module disposed on the body; wherein the electromagnet fixing module is configured to fix the carrying device. The present application uses the electromagnet fixing module to fix the carrying device, which can avoid downtime of an exposure machine caused by shaking of the carrying device when a robot arm of the exposure machine picks or places the mask form the carrying device so as to improve throughput.

Techniques are disclosed for realizing a two-dimensional target lithography feature/pattern by decomposing (splitting) it into multiple unidirectional target features that, when aggregated, substantially (e.g., fully) represent the original target feature without leaving an unrepresented remainder (e.g., a whole-number quantity of unidirectional target features). The unidirectional target features may be arbitrarily grouped such that, within a grouping, all unidirectional target features share a common target width value. Where multiple such groupings are provided, individual groupings may or may not have the same common target width value. In some cases, a series of reticles is provided, each reticle having a mask pattern correlating to a grouping of unidirectional target features. Exposure of a photoresist material via the aggregated series of reticles substantially (e.g., fully) produces the original target feature/pattern. The pattern decomposition techniques may be integrated into any number of patterning processes, such as litho-freeze-litho-etch and litho-etch-litho-etch patterning processes.

A method for temperature control of a component that is transferable between a first system and a second system includes: ascertaining a temperature drift of a temperature of the component that is to be expected after transfer of the component from the first system into the second system; and modifying a temperature prevailing in the first system and/or a temperature prevailing in the second system such that the temperature drift that is actually occurring after transfer of the component from the first system into the second system is reduced with respect to the expected temperature drift.

A reticle transport system having a magnetically levitated transportation stage is disclosed. Such a system may be suitable for use in vacuum environments, for example, ultra-clean vacuum environments. A magnetic levitated linear motor functions to propel the transportation stage in a linear direction along a defined axis of travel and to magnetically levitate the transportation stage.

A target supply system includes a load lock chamber configured to contain a solid target substance, a solid target supply pipe connected to the load lock chamber, a pressure regulator configured to regulate an externally supplied gas pressure, a gas pressure supply pipe connected to the pressure regulator, a melting tank connected to both the solid target supply pipe and the gas pressure supply pipe, and configured to melt the solid target substance supplied from the load lock chamber via the solid target supply pipe to generate a liquid target substance, a nozzle configured to discharge the liquid target substance by a gas pressure supplied from the pressure regulator to the melting tank via the gas pressure supply pipe, and a buffer tank configured to communicate with the melting tank and supply a gas pressure thereto when the solid target substance is supplied to the melting tank.