The instant disclosure discloses a workpiece container system comprising a storage assembly that comprises a seat member. The seat member has a storage portion that defines a longitudinal axis through a geometric center region thereof, provided with a workpiece receiving region that encompasses the geometric center region and configured to receive a workpiece. The seat member has a pair of flank portions arranged on opposite sides of the storage portion along the longitudinal axis, each having a thickness thinner than that of the storage portion. A diffuse inducing component is provided on the storage portion in the workpiece receiving region yet offsets the geometric center region thereof.

A reticle pod with antistatic capability includes a base and plural of support members. The base has a carrying surface having a recess formed thereon and defined by a bottom surface. The support members encircle the carrying surface of the base and are adapted to support a reticle. The recess is defined by a depth extending between the carrying surface and the bottom surface. The depth ranges from 300 μm to 3400 μm to thereby weaken the electrostatic force exerted upon particles on the carrying surface.

The invention discloses a reticle pod for receiving a reticle. The reticle pod includes a base and plural support device provided on the base for supporting the reticle. A first distance is defined between a peripheral area of a bottom surface of the reticle and an upward facing top surface of the base. A second distance is defined between a central area of the bottom surface of the base and the upward facing top surface of the base, wherein the central area is encircled by the peripheral area. The second distance is larger than the first distance.

The invention discloses a substrate storage apparatus having a detecting device detachably connecting to an outer pod. The detecting device includes a sensing member having a sensing terminal, a cavity and a sensor. The sensing terminal detachably connects to the outer pod such that the sensing terminal exposes in an accommodating space inside of the outer pod. The cavity receiving the sensor extends to an outside of the outer pod and the accommodating space. The cavity communicates with the accommodating space through the sensing terminal, allowing the sensor to read information regarding the accommodating space.

A method includes transferring a wafer over a wafer stage on a wafer table. The wafer table includes a table body, a wafer stage, a first sliding member, a second sliding member, a first cable, a first bracket and a second bracket, and a stopper. The second sliding member is movable along a first direction, in which the first sliding member is coupled to a track of the second sliding member, the first sliding member being movable along a second direction vertical to the first direction. The first bracket and the second bracket are connected by a leaf spring. The method includes moving the wafer stage toward the edge of the table body, such that the wafer stage pushes the first cable outwardly, such that the leaf spring is moved toward a first protective film on a surface of the stopper facing the leaf spring.

A substrate processing apparatus includes: a processing block in which a substrate is sequentially transferred and processed; a carry-in/out transfer mechanism that carrys-in/out the substrate with respect to modules; a carry-out module configured to place the substrate therein after the substrate is processed; a multi-module configured by a plurality of modules having a same order in which the substrate is transferred in the processing block; a main transfer mechanism that moves around in a transfer path provided in the processing block to deliver the substrate among the modules; and a controller that sets a first transfer schedule including determination of a number of modules to become transfer destinations of the substrate in the multi-module, and determination of a number of stay cycles which is a number of times that the main transfer mechanism moves around after the substrate is carried into the multi-module until the substrate is carried out.

In order to improve the throughput performance and/or economy of a measurement apparatus, the present disclosure provides a metrology apparatus including: a first measuring apparatus; a second measuring apparatus; a first substrate stage configured to hold a first substrate and/or a second substrate; a second substrate stage configured to hold the first substrate and/or the second substrate; a first substrate handler configured to handle the first substrate and/or the second substrate; and a second substrate handler configured to handle the first substrate and/or the second substrate, wherein the first substrate is loaded from a first, second or third FOUP, wherein the second substrate is loaded from the first, second or third FOUP, wherein the first measuring apparatus is an alignment measuring apparatus, and wherein the second measuring apparatus is a level sensor, a film thickness measuring apparatus or a spectral reflectance measuring apparatus.

A carrier system and method carries a plate-like object to an object mounting section. The system imparts vibration to the object that has been moved such that the object is vibrating when the object is placed onto the mounting section.

A conveyance apparatus that is advantageous in terms of productivity is provided. The conveyance apparatus includes a holding unit configured to hold and convey a substrate, and an outlet unit which is disposed in the holding unit and includes a first outlet port configured to blow a gas in a first direction, which is a direction oblique to a first surface of the substrate held by the holding unit, toward the first surface.

An apparatus for containing a substrate and a method of manufacturing the apparatus are provided. The apparatus for containing a substrate includes: a base having a periphery and an upward-facing top horizontal planar surface with a plurality of contact elements, the contact elements being used for engaging the substrate to hold the substrate upon the upward-facing top horizontal planar surface, an upward-facing frame-like support surface extending from the upward-facing top horizontal planar surface and surrounding the contact elements at a position proximate to the periphery of the base; and a cover having a downward-facing frame-like support surface being in large-area contact with the upward-facing frame-like support surface to define a cavity for containing the substrate between the base and the cover. The downward-facing and upward-facing frame-like support surfaces in contact with each other are not at the same level as the upward-facing top horizontal planar surface.