A semiconductor lithography projection exposure apparatus includes a sensor reference including reference elements. The apparatus also includes an optical element, which includes a main body comprising receiving elements receiving the reference elements. The optical element further includes a referential surface that is an optically active surface of the optical element. The reference elements are arranged to determine a position and an orientation of the optical element. A method includes aligning a sensor reference with respect to a referential surface in a semiconductor lithography projection exposure apparatus.

An interface plate for mounting an apparatus or an assembly of an apparatus to a floor or floor plate is described, the interface plate comprising: an install block having an install surface configured to receive an interface surface of the apparatus or assembly; an adjustment mechanism configured to adjust a position or orientation of the install block relative to the floor or floor plate; and a mounting mechanism configured to rigidly mount the install block to the floor or floor plate.

The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.

The invention provides a support with first and second end portions. The second end portion is on the side opposite to the first end portion in a longitudinal direction of the support. A coil spring is arranged between the first and second end portions. The coil spring comprises a first spiral member that extends between the first and second end portions in a circumferential direction of the support, and a second spiral member that extends between the first and second end portions in a circumferential direction of the support. The first and second spiral members extend in the longitudinal direction around a longitudinal axis of the support, wherein the first spiral member of the coil spring and the second spiral member of the coil spring are moveable relative to each other, and wherein the support further comprises a damper device that is attached to the first spiral member.

A method includes: a) measuring individual parts K1-KN of an optical system to provide measurement data, N being greater than one; b) using the measurement data to virtualize the individual parts K1-KN and using the virtualized individual parts K1-KN to generate an actual assembly model by geometrically stringing together a plurality of the virtualized individual parts K1-KN, the actual assembly model comprising virtual actual positions of the virtualized individual parts K1-KN in a virtually assembled state; c) using the actual assembly model and a target assembly model to determine a correction measure, the target assembly model comprising virtual target positions of one or more of the virtualized individual parts K1-KN in the virtually assembled state; and d) using the correction measure, assembling the individual parts K1-KN to form the optical system.

An arrangement for use in a microlithographic optical imaging device includes an optical unit and a supporting structure for supporting the optical unit. The optical unit includes an optical element, a carrier structure for carrying the optical element, and an active actuating device. The optical element is supported on the carrier structure via of the active actuating device. The active actuating device is configured to adjust the optical element during normal operation of the optical imaging device in a maximum movement range, which is predefined by the normal operation of the optical imaging device, with respect to a first reference assigned to the imaging device. The active actuating device is configured so that the maximum movement range is completely covered by actuating movements of the active actuating device with an actuating accuracy predefined by the normal operation of the optical imaging device.

A method adjusts a first element of a lithography apparatus toward a second element of the lithography apparatus via a tunable spacer which is arranged between the first element and the second element. The method includes: determining an actual location of the first element; determining a nominal location of the first element; unloading the tunable spacer; adjusting a height of the tunable spacer to bring the first element from the actual location to the nominal location; and loading the tunable spacer.

A movable body apparatus has: a substrate holder holding a substrate and can move in the X and Y-axes directions; a Y coarse movement stage movable in the Y-axis direction; a first measurement system acquiring position information on the substrate holder by heads on the substrate holder and a scale on the Y coarse movement stage; a second measurement system acquiring position information on the Y coarse movement stage by heads on the Y coarse movement stage and a scale; and a control system controlling the position of the substrate holder based on position information acquired by the first and second measurement systems. The first measurement system irradiates a measurement beam while moving the heads in the X-axis direction with respect to the scale, and the second measurement system irradiates a measurement beam while moving the heads in the Y-axis direction with respect to the scale.

A stage device includes a stage capable of moving in a first direction and a second direction orthogonal to each other, a scale arranged in the stage so as to extend in the first direction, an optical assembly arranged so as to face the scale in at least a part of a movable range of the stage and extending in the second direction, and an interferometer configured to transmit measurement light and reference light to the optical assembly, and receive the measurement light and the reference light returning from the optical assembly. The optical assembly is configured to apply the measurement light from the interferometer to the scale, and return the measurement light returning from the scale and the reference light to the interferometer.

A microlithographic arrangement, for example using light in the extreme UV range, includes a supporting structure for supporting an optical unit, the mass of which can be 4 t to 14 t. The supporting structure includes a number of separate supporting units for supporting the optical unit. Each of the supporting units includes an air bearing unit by way of which a supporting force which counteracts the weight of the optical unit can be generated. The number of supporting units is at least four, at least two of the supporting units being coupled via a coupling device to form a supporting unit pair in such a way that the coupling device counteracts a deviation from a predeterminable ratio of the supporting forces of the two supporting units of the supporting unit pair.