Patent classifications
G03F7/709
Lithographic apparatus and device manufacturing method
A lithographic apparatus including: a projection system to project radiation onto a substrate supported on a substrate stage, during an exposure phase; a sensing system to sense a property of the substrate on the stage during a sensing phase; and a positioning system to determine a position of the stage relative to a reference system via a radiation path between the stage and the reference system, wherein the apparatus is configured to control stage movement relative to the reference system in the sensing phase and to control other movement relative to the reference system during the exposure phase; the stage or reference system having an outlet to provide a gas curtain to reduce ingress of ambient gas into the path; and the apparatus is operative such that a characteristic of the gas curtain is different in at least part of the sensing phase compared to in the exposure phase.
LITHOGRAPHIC APPARATUS AND DEVICE MANUFACTURING METHOD
A lithographic apparatus is described, the apparatus comprising: a projection system configured to project a patterned beam of radiation onto a substrate; the projection system comprising a plurality of optical elements; a sensor frame; a first position measurement system configured to measure a position of the plurality of optical elements relative to the sensor frame; wherein the sensor frame comprises: N sub-frames, N being an integer >1, a coupling system coupling the N sub-frames and a second position measurement system configured to determine a relative position of the N sub-frames.
PROJECTION EXPOSURE APPARATUS FOR SEMICONDUCTOR LITHOGRAPHY
A projection exposure apparatus for semiconductor lithography includes component having a fluid channel and a device for providing a fluid for flowing through the fluid channel. The fluid channel is connected to the device via a supply line and an outgoing line. The supply line and the outgoing line are connected to one another in parallel with the fluid channel via a short circuit.
Method for improved semiconductor processing equipment tool pedestal / pad vibration isolation and reduction
The present disclosure provides a method, system, and fabrication facility that eliminates or substantially reduces process-limiting vibrations within a high-precision device manufacturing facility, wherein an elevated structure supports high-precision device manufacturing equipment and provides vibration reduction spacing between a floor and an upper surface of said elevated structure.
Vibration damping apparatus, lithography apparatus, and method of manufacturing article
The present invention provides a vibration damping apparatus that performs vibration damping of a first optical element among a plurality of optical elements arranged in a barrel, comprising: a holding member connected to the barrel and configured to hold the first optical element; and a mass body supported by the holding member via a damper element, wherein the mass body includes a second optical element different from the first optical element among the plurality of optical elements.
OPTICAL ARRANGEMENT, IN PARTICULAR LITHOGRAPHY SYSTEM, WITH A TRANSPORT LOCK
An optical arrangement, for example a lithography system, includes: a first component, in particular a carrying frame; a second component, in particular a mirror, which is movable in relation to the first component; and at least one stop with at least one stop face for limiting the movement of the second component in relation to the first component. The optical arrangement, preferably the stop, can have a fixing device for fixing the second component. The fixing device can have a fixing element that is movable in relation to the stop face of the stop. Further aspects of the device likewise relate to an optical arrangement with a fixing device or with a transport lock.
EXTREME ULTRAVIOLET LIGHT GENERATION APPARATUS AND ELECTRONIC DEVICE MANUFACTURING METHOD
An extreme ultraviolet light generation apparatus includes a target supply unit, a target passage detection device, a delay circuit, a laser device, a target image capturing device, and a processor. Here, the processor controls the vibrating element to provide irregular intervals between droplet targets adjacent to each other; generates integrated image data by integrating plural pieces of image data imaged at different times; specifies a position, in the integrated image data, of the droplet target most emphasized in the integrated image data; and sets a delay time based on a distance from a position of the most emphasized droplet target to a second detection position.
Vibration isolation system with one or more magnetic actuators
An active vibration isolation system with a magnetic actuator where the magnetic actuator includes a coil carrier with at least one coil which engages in a magnetic actuator without touching it so that it takes the form of a linear motor. The magnetic actuator has a magnetic shield with an opening through which the coil carrier extends into the magnet carrier.
Lithographic apparatus and device manufacturing method
- Bob Streefkerk ,
- Johannes Jacobus Matheus Baselmans ,
- Henrikus Herman Marie Cox ,
- Antonius Theodorus Anna Maria Derksen ,
- Sjoerd Nicolaas Lambertus Donders ,
- Christiaan Alexander Hoogendam ,
- Joeri Lof ,
- Erik Roelof Loopstra ,
- Jeroen Johannes Sophia Maria Mertens ,
- Frits Van Der Meulen ,
- Johannes Catharinus Hubertus Mulkens ,
- Gerardus Petrus Matthijs Van Nunen ,
- Klaus Simon ,
- Bernardus Antonius Slaghekke ,
- Alexander Straaijer ,
- Jan-Gerard Cornelis Van Der Toorn ,
- Martijn Houkes
In a lithographic apparatus, a localized area of the substrate surface under a projection system is immersed in liquid. The height of a liquid supply system above the surface of the substrate can be varied using actuators. A control system uses feedforward or feedback control with input of the surface height of the substrate to maintain the liquid supply system at a predetermined height above the surface of the substrate.
Projection exposure apparatus for semiconductor lithography with increased thermal robustness
A projection exposure apparatus for semiconductor lithography includes: a light source for generating optical used radiation by which structures arranged on a reticle can be imaged onto a wafer; a plurality of optical elements for guiding and manipulating the used radiation; and a plurality of position sensors for determining the position of at least some of the optical elements. At least some of the position sensors are arranged on a measurement structure that is at least partially decoupled mechanically and/or thermally from the further components of the projection exposure apparatus. The measurement structure has at least two mechanically decoupled substructures. The first substructure has a lower coefficient of thermal expansion than the second substructure. The second substructure has a greater stiffness than the first substructure.