An exposure method for projecting a pattern on an exposure mask onto a work by an exposure control of an exposure light including calculating an exposure position on the work from a relative positional relationship of the exposure mask and the work, setting a range acceptable for projecting the pattern even when the exposure position is off a target exposure position on the work as an exposure position range, and (3) executing an exposure control that irradiates the exposure light to the exposure mask when the exposure position is in the exposure position range, and that stops the exposure light when the exposure position is out of the exposure position range.

A lithography apparatus includes: a projection system configured to project a desired image onto a substrate; an active module that generates a time-varying heat load; a temperature conditioning system configured to maintain a component of the lithography apparatus at a predetermined target temperature; and a heat buffer including a phase change material in thermal contact with the active module, the phase change material having a phase change temperature such that the phase change material is caused to undergo a phase change by the time-varying heat load, and wherein the phase change material is stationary relative to the projection system during critical operations of the lithography apparatus.

An optical lens stack includes an inner ring of a mounting structure containing axially spaced circumferential lens mounting surfaces on an inside diameter of the inner ring. The inner ring further includes a groove over a fixed axial length on the outer diameter. An outer ring formed to fit over the inner ring contains a groove on the inner diameter of the outer ring that corresponds to the groove on the inner ring and forms a circumferential cavity when the outer ring is mounted on the inner ring. The resulting cavity is filled with an energy absorbing material and serves as a vibration isolator for the lens stack.

A protective apparatus for lines between two components of a projection exposure apparatus for semiconductor lithography is firmly connected to the two components. the protective apparatus includes first and second partial regions which are configured to protect against mechanical damage to the lines. The first partial region is at least temporarily configured to mechanically decouple the first component from the second component.

A fluid handling system that includes a liquid confinement structure configured to confine immersion liquid to a space between at least a part of the liquid confinement structure and a surface of a substrate. The fluid handling system also includes a mechanism configured to vibrate a vibration component in contact with the immersion liquid.

A magnet array for a displacement device for a displacement system, the magnet array comprising a two dimensional pattern of magnets of a first type and magnets of a second type, whereby magnets of the first type and magnets of the second type have parallel but opposing magnetizing direction and are alternatingly arranged at regular intervals in both a first and a second direction, wherein the first and second directions are not perpendicular to each other; a distance between two adjacent magnets of the same type in a third direction is unequal to a distance between two adjacent magnets of the same type in a fourth direction; and, the third and fourth direction are perpendicular to each other.

An exposure apparatus includes a projection system having an optical element; a substrate stage which has a holder configured to hold a substrate and which is movable below the projection system; a first nozzle member having a liquid supply port; a second nozzle member having a liquid recovery port which is arranged such that the liquid recovery port faces an upper surface of the substrate during exposure; and a driving system having a motor, which moves the second nozzle member in a direction substantially perpendicular to an optical axis of the optical element. The second nozzle member is moved based on a movement condition of the substrate stage. The substrate is exposed via liquid covering a portion of the upper surface of the substrate. The liquid supply via the liquid supply port is performed parallel to the liquid recovery via the liquid recovery port.

Disclosed is a system configured to project a beam of radiation onto a target portion of a substrate within a lithographic apparatus. The system comprises a mirror (510) having an actuator (500) for positioning the mirror and/or configuring the shape of the mirror, the actuator also providing active damping to the mirror, and a controller (515a, 515b) for generating actuator control signals for control of said actuator(s). A first coordinate system is used for control of said actuator(s) when positioning said mirror and/or configuring the shape of said mirror and a second coordinate system is used for control of said actuator(s) when providing active damping to said mirror.

An exposure method sequentially exposes a plurality of shot areas of a substrate. The method includes: (i) holding the substrate on a substrate holder such that a gap is formed along an edge of the substrate; (ii) exposing one of the shot areas, located near a center of the substrate, through a liquid of a liquid immersion area which covers only a portion of a surface of the substrate, while moving the substrate at a first scanning speed; and (iii) exposing an other one of the shot areas through the liquid of the liquid immersion area, while moving the substrate at a second scanning speed lower than the first scanning speed. The other one of the shot areas is located near the edge of the substrate and the gap is included in the liquid immersion area during the exposure of the other one of the shot areas.

A lithographic apparatus comprising: a positioning stage (WT); an isolation frame (300); a projection system (PS), comprising a first frame (210); a second frame (220); a supporting frame (10) for supporting the positioning stage; a first vibration isolation system (250) and a second vibration isolation system (270), wherein the supporting frame and the first frame are coupled via the first vibration isolation system; a stage position measurement system (400) to determine directly the position of a stage reference of an element of the positioning stage in one or more degrees of freedom with respect to an isolation frame reference of an element of the isolation frame; and wherein the first frame and the isolation frame are coupled via the second vibration isolation system.