A measurement system to be used in a micro-device manufacturing line is equipped with: a plurality of measurement devices which performs measurement processing on each substrate; and a controller that can control the plurality of measurement devices, and the plurality of measurement devices includes at least one first measurement device which acquires position information of a plurality of marks formed on a substrate.

The invention relates to an alignment apparatus for aligning a substrate, and a substrate processing system comprising such alignment apparatus. The alignment apparatus comprises an alignment base for supporting said substrate and/or a substrate support member, and a force generating device for applying a contact force on said substrate.

The force generating device comprises: an arm comprising a rigid proximal end a rigid distal end provided with a contact section for contacting an edge of said substrate, and an elastically deformable arm section extending between the rigid proximal and distal ends, a connection part connecting said rigid proximal end to said alignment base, said arm being movable with respect to said alignment base via said connection part, and an actuator for acting on and causing a displacement of said rigid proximal end, whereby said contact force, defined by said elastically deformable arm section, is applied to said substrate by said contact section.

A method for determining an offset between a center of a substrate and a center of a depression in a chuck includes providing a test substrate to the depression, the test substrate having a dimension smaller than a dimension of the depression, measuring a position of an alignment mark of the test substrate while in the depression, and determining the offset between the center of the substrate and the center of the depression from the position of the alignment mark.

A substrate handling system for handling a substrate, the substrate handling system including a holder for holding the substrate, a rotation device for rotating the holder around an axis perpendicular to a plane, and a mover for moving the holder along a path in the plane relative to the axis. Further, there is provided a lithographic apparatus including the substrate handling system. The substrate handling system may include a coupling device arranged to couple the holder to the mover or the rotation device in a first situation. The coupling device may be arranged to decouple the holder from the mover or rotation device in a second situation.

In a method of controlling a lithographic apparatus, historical performance measurements are used to calculate a process model relating to a lithographic process. Current positions of a plurality of alignment marks provided on a current substrate are measured and used to calculate a substrate model relating to a current substrate. Additionally, historical position measurements obtained at the time of processing the prior substrates are used with the historical performance measurements to calculate a model mapping. The model mapping is applied to modify the substrate model. The lithographic apparatus is controlled using the process model and the modified substrate model together. Overlay performance is improved by avoiding over- or under-correction of correlated components of the process model and the substrate model. The model mapping may be a subspace mapping, and dimensionality of the model mapping may be reduced, before it is used.

An optical system for producing lithographic structures is disclosed. Also disclosed is a method for determining relative coordinates of a position of a writing field relative to a position of a preview field in such an optical system, and a method for producing lithographic structures using such an optical system.

Reticle pods include inner pods where motion limiting features restrict translational motion of the cover and the baseplate relative to one another. The motion limiting features are in addition to gross alignment features included in the inner pod. The motion limiting features resist the translational motion before the gross alignment features would resist the motion. Motion limiting features can include elastic bodies providing friction against contact surfaces, or pins received on elastic contact surfaces or in diaphragms or motion limiting cups.

The present invention provides a lithography apparatus that forms patterns on substrates including a first substrate and a second substrate following the first substrate, the apparatus including a decision unit configured to obtain a first layout of a plurality of shot regions on a first substrate from detection values of marks in sample shot regions included in each of a plurality of different combinations each constituted by at least two sample shot regions, of sample shot regions where a detection unit has detected the marks in fine alignment with respect to the first substrate and decide sample shot regions included in one of the plurality of combinations as sample shot regions where the detection unit detects the marks in pre-alignment with respect to a second substrate based on the first layout.

A lithographic process includes clamping a substrate onto a substrate support, measuring positions across the clamped substrate, and applying a pattern to the clamped substrate using the positions measured. A correction is applied to the positioning of the applied pattern in localized regions of the substrate, based on recognition of a warp-induced characteristic in the positions measured across the substrate. The correction may be generated by inferring one or more shape characteristics of the warped substrate using the measured positions and other information. Based on the one or more inferred shape characteristics, a clamping model is applied to simulate deformation of the warped substrate in response to clamping. A correction is calculated based on the simulated deformation.

An exposure method and apparatus expose a substrate with illumination light via a projection optical system and a liquid of a liquid immersion area formed under the projection optical system. A second stage on which the substrate is held and a third stage are relatively moved, based on outer periphery positional information of the second stage, in order to cause the second stage to come close, from one side in a first direction, to the third stage that faces the projection optical system. The second and third stages that have come close together are moved from the one side to an other side in the first direction with respect to the projection optical system to place the second stage to face the projection optical system instead of the third stage while substantially maintaining the liquid immersion area under the projection optical system.