An imprinting method in which alignment control of a mold and a substrate is effected and a pattern formed on the mold is transferred onto a pattern forming layer provided on the substrate. The imprinting method includes a step in which the mold and the substrate are brought near to each other while effecting the alignment control, after the alignment control is started, to bring the mold and the pattern forming layer into contact with each other, and then, the pattern forming layer is cured, and a step in which the gap between the mold and the substrate is increased, after the pattern forming layer is cured. Further, the alignment control is stopped after the alignment control is started, and at least one of before and after the mold contacts the pattern forming layer.

A method for correcting an exposure pattern on a substrate includes obtaining, based on the exposure pattern, displacement adjustment parameters for adjusting displacements of a worktable supporting the substrate in each of a first direction and a second direction, a rotation angle adjustment parameter for adjusting a rotation angle of the worktable in a rotation direction, and a gap adjustment parameter for adjusting a gap between the worktable and a mask plate. The first direction and the second direction are perpendicular to each other in a horizontal plane. The rotation direction is a direction in which the worktable rotates around a central axis of a base table supporting the mask plate. The method further includes moving the worktable based on the displacement adjustment parameters, the rotation angle adjustment parameter and the gap adjustment parameter.

A deposition apparatus includes a substrate, a mask disposed on a first surface of the substrate and including a mask frame supporting an edge area of the substrate, a through-hole formed in the mask frame along the edge area of the substrate, a measurement member disposed between the substrate and the mask frame at a position corresponding to the through-hole and including a measurement hole connected to the through-hole and a measurement camera disposed on a first surface of the mask frame at the position corresponding to the through-hole, wherein the measurement camera measures a first distance to the measurement member exposed through the through-hole and a second distance to the substrate exposed through the measurement hole.

A gap inspection system is configured to inspect global gap data between mask and substrate, comprising: support frame; mask frame comprising autofocus module for real-time monitoring gap data between mask and substrate; wafer stage module comprising wafer chuck for adjusting position and orientation of substrate; front-side surface topography inspection module, mounted on upper substrate of support frame for inspecting the substrate, to acquire primary surface topography parameters; folding surface topography inspection module, switchable between inspection position and retract position for inspecting mask, to acquire secondary surface topography parameters; and control system, configured to acquire position parameters of mask and substrate and calibration parameters of front-side surface topography inspection module and folding surface topography inspection module, and configured to calculate global gap data between mask and substrate in conjunction with position parameters, calibration parameters, primary surface topography parameters, and secondary surface topography parameters after measuring tilt angle between mask and substrate.