A method of determining topographical variation across a substrate on which one or more patterns have been applied. The method includes obtaining measured topography data representing a topographical variation across a substrate on which one or more patterns have been applied by a lithographic process; and combining the measured topography data with knowledge relating to intra-die topology to obtain derived topography data having a resolution greater than the resolution of the measured topography data. Also disclosed is a corresponding level sensor apparatus and lithographic apparatus having such a level sensor apparatus, and a more general method of determining variation of a physical parameter from first measurement data of variation of the physical parameter across the substrate and intra-die measurement data of higher resolution than the first measurement data and combining these.

The present invention provides a method to obtain a height map of a substrate having alignment marks, the method comprising the steps: determining a height of one or more locations or areas of the substrate, and determining the height map of the substrate on the basis of the determined height of the one or more locations or areas of the substrate and a shape model of the substrate.

Optical components and methods of manufacture thereof. A first optical component has a hollow-core photonic crystal fiber includes internal capillaries for guiding radiation and an outer capillary sheathing the internal capillaries; and at least an output end section having a larger inner cross-sectional dimension over at least a portion of the output end section than an inner cross-sectional dimension of the outer capillary along a central portion of the hollow-core photonic crystal fiber prior to the output end section. A second optical component includes a hollow-core photonic crystal fiber and a sleeve arrangement.

A broadband radiation source device configured for generating a broadband output radiation upon receiving pump radiation, the device including: a hollow-core photonic crystal fiber (HC-PCF) including at least one structurally varied portion having at least one structural parameter of the HC-PCF varied with respect to one or more main portions of the HC-PCF, wherein the at least one structurally varied portion includes at least a structurally varied portion located downstream of a position along the length of the HC-PCF where the pump radiation will be spectrally expanded by a modulation instability dominated nonlinear optical process, and wherein the at least one structurally varied portion is configured and located such that the broadband output radiation includes wavelengths in the ultraviolet region.

An apparatus and method to determine a property of a substrate by measuring, in the pupil plane of a high numerical aperture lens, an angle-resolved spectrum as a result of radiation being reflected off the substrate. The property may be angle and wavelength dependent and may include the intensity of TM- and TE-polarized radiation and their relative phase difference.

Measurement system comprising a radiation source configured to generate a measurement radiation beam, a polarizer and a grating to receive the measurement radiation beam and provide a polarized measurement radiation beam patterned by the grating, optics to form an image of the grating at a target location on a substrate. The image comprises a first part having a first polarization and a second part having a second polarization, detection optics to receive radiation from the target location of the substrate and form an image of the grating image at a second grating, and a detector to receive radiation transmitted through the second grating and produce a two output signal indicative of the intensity of the transmitted radiation for the first and second parts of the grating image respectively. Topography of the substrate can be determined from the signals.

Combination of a stage and a level sensor configured to sense a height level at a target location on an object is described, the stage comprising an object table configured to hold the object and a positioning device for displacing the object table relative to the level sensor in a first direction, the level sensor comprising a projection system configured to project a measurement beam onto a measurement area of the object, the measurement area having a measurement area length in the first direction, a detector system configured to receive different portions of the measurement beam after being reflected off different sub-areas within the measurement area, the different sub-areas being arranged in the first direction, and to supply output signals representative of the different portions received, a signal processing system configured to process the output signals from the detector system.

The invention provides a level sensor to measure a position of a surface of a substrate, comprising a projection unit arranged to direct a beam of radiation to the surface of the substrate and a detection unit. The detection unit comprises a detection grating arranged to receive the beam of radiation reflected on the surface of the substrate, one or more detectors, one or more optical elements to direct the beam of radiation from the detection grating to the one or more detectors, and a processing unit to determine the position of the surface of the substrate on the basis of the beam of radiation received by the one or more detectors. The detection grating and the one or more optical elements are integrated in a single integrated optical element.

Embodiments herein beneficially enable simultaneous processing of a plurality of substrates in a digital direct write lithography processing system. In one embodiment a method of processing a plurality of substrate includes positioning a plurality of substrates on a substrate carrier of a processing system, positioning the substrate carrier under the plurality of optical modules, independently leveling each of the plurality of substrates, determining offset information for each of the plurality of substrates, generating patterning instructions based on the offset information for each of the plurality of substrates, and patterning each of the plurality of substrates using the plurality of optical modules. The processing system comprises a base, a motion stage disposed on the base, the substrate carrier disposed on the motion stage, a bridge disposed above a surface of the base and separated therefrom, and a plurality of optical modules disposed on the bridge.

The present disclosure provides a method of leveling a wafer in an exposure process. The wafer includes a plurality of regions. The wafer is loaded to an exposure system. The exposure system includes a control unit and a leveling module. The control unit of the exposure system obtains layout information of the reticle. The control unit of the exposure system assigns critical regions and non-critical regions to the regions on the wafer according to the layout information of the reticle.