Described herein are improvements to bioprinting technology that facilitate automation of tissue and organ fabrication processes.

Described herein are improvements to bioprinting technology that facilitate automation of tissue and organ fabrication processes.

To provide a microchip-type optical measuring apparatus which is able to automatically perform position adjustment of a microchip with respect to an optical axis of laser with high accuracy. A microchip-type optical measuring apparatus includes an irradiation detection unit which detects light generated by irradiating a microchip with laser, a position adjustment unit which changes a relative position of the microchip with respect to the irradiation detection unit, and a control unit which outputs a movement signal for a position in which an integrated value or an average value of a detected intensity of the light in a preset region becomes high to the position adjustment unit.

To provide a microchip-type optical measuring apparatus which is able to automatically perform position adjustment of a microchip with respect to an optical axis of laser with high accuracy. A microchip-type optical measuring apparatus includes an irradiation detection unit which detects light generated by irradiating a microchip with laser, a position adjustment unit which changes a relative position of the microchip with respect to the irradiation detection unit, and a control unit which outputs a movement signal for a position in which an integrated value or an average value of a detected intensity of the light in a preset region becomes high to the position adjustment unit.

A control system for monitoring operation of an industrial machine includes a processor and a tangible, non-transitory, computer-readable memory communicating with the processor. The tangible, non-transitory computer-readable memory includes instructions that, in response to execution by the processor, cause the processor to perform operations including: receiving image data from an imaging device that monitors an image zone around the industrial machine, analyzing the image data, generating, based upon the analyzing, operational data associated with the industrial machine, and transmitting the operational data to a display that is communicatively coupled to the control system.

A control system for monitoring operation of an industrial machine includes a processor and a tangible, non-transitory, computer-readable memory communicating with the processor. The tangible, non-transitory computer-readable memory includes instructions that, in response to execution by the processor, cause the processor to perform operations including: receiving image data from an imaging device that monitors an image zone around the industrial machine, analyzing the image data, generating, based upon the analyzing, operational data associated with the industrial machine, and transmitting the operational data to a display that is communicatively coupled to the control system.

A machining system (10) comprising a machine comprising: real tool (12); actuators (14) for moving the real tool (12); sensors (15) for generating positioning data (16) for the real tool (12); a memory (17) for storing shape correction data (20) for the real tool (12); and a physical controller (18) for executing a machining program (19) and for controlling the actuators (14) as a function of the shape correction data (20), so as to move the real tool (12) relative to the real blank (13). On the basis of said data (22) representative of the positions of the real tool (12) and of the real blank (13), image display means (24) generate a reconstituted image (25) representative: of the shape of the real blank (13); and of the position of the real tool (12) at a given instant.

A machining system (10) comprising a machine comprising: real tool (12); actuators (14) for moving the real tool (12); sensors (15) for generating positioning data (16) for the real tool (12); a memory (17) for storing shape correction data (20) for the real tool (12); and a physical controller (18) for executing a machining program (19) and for controlling the actuators (14) as a function of the shape correction data (20), so as to move the real tool (12) relative to the real blank (13). On the basis of said data (22) representative of the positions of the real tool (12) and of the real blank (13), image display means (24) generate a reconstituted image (25) representative: of the shape of the real blank (13); and of the position of the real tool (12) at a given instant.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.

A wafer processing system includes a laser processing apparatus, a grinding apparatus, a tape sticking apparatus, a first cassette placement part, a second cassette placement part, a conveying unit that conveys a wafer, and a controller that controls the respective constituent elements. The controller includes a first processing program instructing section that conveys a wafer unloaded from a first cassette in order of the laser processing apparatus, the grinding apparatus, the tape sticking apparatus, and a second cassette and sequentially carries out processing by each apparatus for the one wafer, and a second processing program instructing section that conveys the wafer unloaded from the first cassette in order of the grinding apparatus, the laser processing apparatus, the tape sticking apparatus, and the second cassette and sequentially carries out processing by each apparatus for the one wafer.