G05B19/40937

PROCESSING PROGRAM CREATION DEVICE AND PROCESSING PROGRAM CREATION METHOD
20220299978 · 2022-09-22 ·

A topology database generates topology data of a plurality of parts. The topology database acquires processing information including a tool name of a use tool and a processing order from a bending processing program of each part, and stores the processing information in association with the topology data. A processing information acquisition unit searches for a similar part with the same topology data as topology data of a processing target part, and acquires the processing information of the similar part. A tool determination unit calculates a range of a tool length which is able to bend each bending line using a tool with a tool name included in the processing information and which does not interfere with the part, and determines the tool with the tool name and a tool length within a range of the tool length as the use tool.

NC PROGRAM GENERATION SYSTEM AND NC PROGRAM GENERATION METHOD
20220258296 · 2022-08-18 · ·

The present invention provides a technology for generating an NC program which can secure appropriate machining accuracy. Provided is a conversion computer 10 which includes a CPU 11 and generates an NC program for a turning process for a workpiece on a lathe, wherein the CPU 11 is configured to generate an NC program such that displacements caused for a workpiece to be processed on a plurality of machining positions at a time of a turning process are calculated, on the basis of the displacements caused for the workpiece on the plurality of machining positions, a movement path of a tool to be used at the time of the turning process is decided, and the tool is moved through the decided movement path.

CONTROL FOR LASER CUTTING HEAD MOVEMENT IN A CUTTING PROCESS
20220244705 · 2022-08-04 ·

In one aspect the invention relates to a method for calculating control instructions (CI) for controlling a cutting head (H) of a laser machine (L) for cutting a set of contours in a workpiece. The method comprises reading (S71) an encoded cutting plan (P), and continuously determining a state (S73) relating to the processing of the workpiece by the laser machine (L) by means of a set of sensor signals (sens). Further, the method provides a computer-implemented decision agent (DA), which dynamically calculates an action (a) for the machining head (H) to be taken next and based thereon providing control instructions (CI) for executing the processing plan (P) by accessing a trained model with the encoded cutting plan (P) and with the determined state (s).

JOINT AMOUNT CONTROL DEVICE, JOINT AMOUNT CONTROL METHOD, JOINT AMOUNT CONTROL PROGRAM, AND LASER PROCESSING MACHINE
20220212290 · 2022-07-07 ·

A processing program analyzer analyzes a processing program and extracts first and second codes included in the processing program and indicating a joint-constituting pair of a first endpoint of a cutting path on a laser cutting start side and a second endpoint of a cutting path on a laser cutting end side. A joint information adder adds joint information indicating the position of at least one of the first code and the second code to the processing program. A joint compensation amount generator generates a joint compensation amount to be set for a joint to be increased or decreased in a joint amount. A transmitter transmits to an NC device the processing program to which the joint information has been added and the joint compensation amount associated with information indicating the joint to be increased or decreased in the joint amount.

Robotic Systems And Methods For Tool Path Generation And Control Based on Bone Density

A surgical robotic system and method involve a manipulator including a plurality of links and joints and a tool coupled to the manipulator. Controller(s) generate a first tool path to remove a first portion of material from the bone and control the manipulator to position the tool for movement along the first tool path to remove the first portion. The controller(s) sense interaction between the tool and the bone during movement of the tool along the first tool path and generate a second tool path to remove a second portion of material from the bone. Generation of the second tool path is based, at least in part, on the sensed interaction between the tool and the bone during movement along the first tool path. The controller(s) control the manipulator to position the tool for movement along the second tool path to remove the second portion.

Robotic systems and methods for controlling a tool removing material from a workpiece

A method of operating a robotic system to efficiently remove material from a workpiece based on a density distribution of the material of the workpiece. The density distribution of the material of the workpiece is determined from a three-dimensional representation and evaluated by classifying the plurality of points or voxels into a first density classification and a second density classification. A navigation computer generates a first tool path and a second tool path for the tool based on the evaluated density distribution. The first tool path is associated with the first density classification, and the second tool path is associated with the second density classification. The position of the tool relative to the workpiece is tracked with a navigation computer and controlled with a manipulator controller based on the generated tool path to remove material along the first tool path, and remove material along the second tool path.

MACHINING CONDITION SEARCH DEVICE AND MACHINING CONDITION SEARCH METHOD

A machining condition search device according to the disclosure includes a machining condition generation unit, a practical machining command unit, a machining evaluation unit, a prediction unit, an optimum machining condition calculation unit. The machining condition generation unit generates a machining condition defined by one or more control parameters settable on a machining apparatus. The practical machining command unit causes the machining apparatus to perform machining based on a generated machining condition. The machining evaluation unit generates an evaluation value of performed machining, on the basis of information indicating a machining result of the performed machining. The prediction unit predicts an evaluation value corresponding to a machining condition under which machining is not performed, on the basis of the evaluation value and the machining condition corresponding to the evaluation value. The optimum machining condition calculation unit obtains an optimum machining condition on the basis of a prediction value predicted by the prediction unit and an evaluation value generated by the machining evaluation unit. The optimum machining condition is a machining condition under which an evaluation value is equal to or greater than a threshold and a tolerance is maximum.

PROCESS FOR GENERATING A CAM DATASET
20220079721 · 2022-03-17 ·

The present invention relates to a process for generating a CAM dataset, having the steps of providing (S201) a digital CAD dataset for a dental prosthesis having first reference data for a first spatial reference geometry; providing (S202) a digital CAM dataset having second reference data for a second spatial reference geometry; and integrating (S203) the CAD dataset in the CAM dataset by aligning the first spatial reference geometry of the CAD dataset with the second spatial reference geometry of the CAM dataset.

METHOD AND DEVICE FOR PROCESSING WAFER DETECTION TASKS, SYSTEM, AND STORAGE MEDIUM
20220083024 · 2022-03-17 ·

A method and device for processing wafer detection tasks, a system, and a storage medium. The method includes that: the resource manager node receives the wafer detection task from the storage server, selects the target work node from the plurality of work nodes according to weight values of the work nodes connected to the resource manager node, and allocates the wafer detection task to the target work node. The target work node selects the idle GPU from the resource pool and allocates the wafer detection task to the idle GPU for execution. The GPU preprocesses the wafer map in the wafer detection task and inputs the processed wafer map into the wafer detection model to obtain the detection result.

WORKPIECE MACHINING METHOD AND WORKPIECE MACHINING DEVICE
20220063040 · 2022-03-03 · ·

A workpiece machining device includes a positional deviation correction unit configured to correct a positional deviation of a radius end mill by detecting a positional deviation between a real contour line and an ideal contour line of the radius end mill. The positional deviation correction unit calculates a first correction value configured to make a center of a first arc section formed into an arc shape at a corner portion of the ideal contour line and a center of a second arc section formed into an arc shape at a corner portion of the real contour line to be identical to each other in a plane perpendicular to the rotational axis, and corrects a machining point by the radius end mill using the first correction value.