Patent classifications
G05D23/1931
Electric heating device, corresponding heating circuit and method for managing the temperature
The invention relates to an electric fluid heating device (1) comprising: at least one fluid inlet (7), at least one fluid outlet (11), at least one heating element (13), at least one first temperature sensor (21) for measuring the temperature of said at least one heating element (13), and a control module (15) of the at least one heating element (13). According to the invention, the device (1) comprises at least a second temperature sensor (23) for measuring the temperature of the fluid at the at least one outlet (11), and the control module (15) comprises at least one processing means (17, 19, 35) for: using the temperature information (T.sub.21, T.sub.23) from the temperature sensors (21, 24), and for generating a command for the at least one heating element (13) according to the temperature information (T.sub.21, T.sub.23). The invention also relates to an associated heating circuit and method for managing the temperature.
METHOD OF DYNAMIC THERMAL MANAGEMENT OF ELECTRONIC DEVICE
To dynamically manage a temperature of an electronic device, a local temperature is provided by measuring a temperature of a local spot in the electronic device and a reference temperature is provided by measuring a temperature of a reference spot in the electronic device where the reference spot and the local spot are thermally coupled. A target temperature corresponding to a limit value of the reference temperature is adjusted based on the local temperature and a power level of the electronic device is controlled based on the same target temperature. The target temperature may be set to a relatively high value to secure performance of the electronic device when the local temperature is relatively low. Alternatively, the target temperature may be set to a relatively low value to pursue stability of the electronic device when the local temperature is relatively high.
CHAMBER TEMPERATURE CONTROL
A system (2) is provided with a temperature controlled chamber (4) having a wall (6) extending about a space (8) to receive a three-dimensional printed job. A plurality of temperature control elements (10,12) are mounted to the wall, wherein each of the temperature control elements is operable separately from each other of the temperature control elements. A controller (14) operates the plurality of temperature control elements, each of which is selectively operable by the controller in dependence upon parameters of a three-dimensional printed job to be temperature controlled within the chamber.
SYSTEM AND METHOD FOR COMMISSIONING FRESH AIR INTAKE CONTROL
There is described a mobile device and method for commissioning air intake control of an environmental control system. A communication component receives multiple air measurements from an air flow sensor, in which the air flow sensor is positioned in a duct compartment of the environmental control system. The processor generates multiple air flow tables based on the multiple air measurements, multiple fan speeds associated with the environmental control system, and multiple damper positions associated with the environmental control system. The communication component transmits the multiple air flow tables to an air intake controller of the environmental control system.
TEMPERATURE CONTROL SYSTEM, DETECTION SYSTEM AND TEMPERATURE CONTROL METHOD FOR MICRO-FLUIDIC CHIP
Provided are a temperature control system, a detection system and a temperature control method for a micro-fluidic chip. The temperature control system includes a circuit structure in a functional layer of the micro-fluidic chip, corresponding to a reaction zone of the micro-fluidic chip, and including at least two thermistors and an input port and an output port, wherein the input port and the output port are electrically coupled through the thermistors to form an application circuit; and a controller electrically coupled to each port and configured to select a first input port and a first output port, such that the circuit structure is configured to form a first application circuit as a heating device, and to select a second input port and a second output port, such that the circuit structure is configured to form a second application circuit as a temperature sensor.
Tankless water heater, a facility management system, a method for controlling a tankless water heater and a method for operating a facility management system
A tankless water heater, comprising: a flow channel with a cold-water inlet pipe, a heating unit with an heating element configured to heat water flowing through the heating unit and a hot-water outlet pipe, and a control unit configured to control the tankless water heater, wherein the control unit is configured to receive a power limitation signal of an external facility management system and to control a heating output of the heating element depending on the power limitation signal.
Temperature detecting device, temperature detecting system and temperature detecting method
Embodiments of the present disclosure discloses a temperature detecting device, a temperature detecting system and a temperature detecting method. The temperature detecting device includes: a bearing support, a first end of the bearing support being fixed; a temperature detector, provided on a second end of the bearing support; a moving component, configured to be connected with the bearing support, wherein the second end of the bearing support is movable with respect to the first end under driving of the moving component.
Baking equipment for use in display panel manufacturing process
The present application provides a baking equipment applied in a display panel manufacturing process. In the present application, the first and second pipes are communicated with each other and evenly distributed inside the baking plate, so that the heating liquid injected from the head end of the first pipe heats the baking plate evenly during flowing through the first and second pipes, which improves the uniformity of the baking temperature of the TFT array substrate to be baked by the baking plate, thereby ensuring the stability of the baking process of the TFT array substrate.
CONTROLLING SPEED OF COOLING ELEMENTS
Examples of devices and methods for controlling speed of cooling elements are discussed. The device comprises a first temperature reader to measure an ambient temperature in the vicinity of the device. The device further comprises a processor to control a speed of a cooling element of the device based on a comparison of the ambient temperature with a first threshold temperature.
DUAL COOKING APPLIANCE
A cooking appliance is adapted to perform either as a single large fan-forced convection oven capable of cooking a larger food, or as smaller independently-operable fan-forced convection ovens each capable of cooking smaller foods. Features of the cooking element arrangement provide faster, more efficient, and higher quality results regardless of the size and amount of food being cooked.