Implementations claimed and described herein provide system and methods for controlling griddle temperature. In one implementation, a temperature measurement of a region of a griddle top is obtained. The temperature measurement is captured using one or more sensors. A set temperature range is obtained for the region of the griddle top. The temperature measurement is compared to the set temperature range. One or more burners are adjusted based on whether the temperature measurement is within the set temperature range. The temperature of the region of the griddle top is maintained within the set temperature range using the one or more burners.

An arrangement for monitoring an aseptic manufacturing process includes product condition sensors capable of making closely spaced measurements of a product condition such as temperature or humidity. The measurements are made using closely spaced sensors arranged in a linear array on a single probe, which may be used to take measurements at multiple levels within the product. Data from the sensors is transmitted to a data collection point via short range wireless digital communications. The sensors may be used to measure temperature and humidity at a single point. For example, when the sensors are used in pharmaceutical freeze drying, the location of a sublimation front may be calculated for each vial, and the freeze drying process may be controlled using the data.

A temperature control system and method are provided. The temperature control system includes: a bearing platform including a central platform and multiple edge platforms arranged around same; multiple temperature control modules each connected to a respective edge platform and configured to regulate temperature of a corresponding region of a wafer on the edge platform; a parameter acquisition module configured to acquire temperatures of the wafer; and a processing module configured to acquire a temperature abnormal region of the wafer and regulate a temperature of the temperature control module corresponding to the temperature abnormal region. The parameter acquisition module is used to acquire the temperatures of the wafer on the bearing platform, to acquire the temperature abnormal region of the wafer. Then, the processing module acquires the corresponding temperature control module based on the position of the temperature abnormal region. The temperatures at specific positions of a wafer are accurately controlled.

A heating, ventilation, or air conditioning (HVAC) system for a building includes airside HVAC equipment configured to provide heating or cooling to one or more building spaces and one or more controllers. The one or more controllers are configured to generate airside energy targets for the one or more building spaces using a heat transfer model that defines a relationship between the airside energy targets, a temperature of the one or more building spaces, and a thermal capacitance of the one or more building spaces. The one or more controllers are configured to control the airside HVAC equipment in accordance with the airside energy targets.

Controller technology, in which data specifying a user preference relating to an environmental parameter for a property is received. Based on data collected by a monitoring system, a location of one or more users within the property is identified. Environmental condition data for the property is accessed, the environmental condition data including environmental condition data for the location of the users within the property and other unoccupied locations within the property. The environmental condition data for the property is analyzed with respect to the preference relating to the environmental parameter for the property. Based on the analysis of the environmental condition data for the property with respect to the preference relating to the environmental parameter for the property, a setting for at least one component of an HVAC system is determined. The at least one component of the HVAC system is controlled according to the determined setting.

An integrated circuit that controls distributed temperature sensors in a semiconductor die is described. This integrated circuit may include: memory; a controller (such as a PTAT controller) coupled to the memory; temperature sensors distributed at measurement locations in the semiconductor die (such as remote locations from the controller), where a given temperature sensor includes building blocks (or components) that are common to the temperature sensors; and routing between the controller and the building blocks over an addressable bus, where signal lines for analog signals in the addressable bus are reused when communicating between the controller and different temperature sensors.

The present disclosure includes systems and methods for controlling temperature in an electronic device. An electronic device includes a number of heat-emitting components, a plurality of compartments, and a processor. The processor is configured to identify a temperature in one of the compartments of the electronic device, determine whether the identified temperature in the one compartment exceeds a threshold for the one compartment, and in response to determining that the identified temperature for the one compartment exceeds the threshold, modify, based on the identified temperature, operation of a component of the number of heat-emitting components that is located in the one compartment to reduce the temperature in the one compartment.

Controller technology, in which data specifying a user preference relating to an environmental parameter for a property is received. Based on data collected by a monitoring system, a location of one or more users within the property is identified. Environmental condition data for the property is accessed, the environmental condition data including environmental condition data for the location of the users within the property and other unoccupied locations within the property. The environmental condition data for the property is analyzed with respect to the preference relating to the environmental parameter for the property. Based on the analysis of the environmental condition data for the property with respect to the preference relating to the environmental parameter for the property, a setting for at least one component of an HVAC system is determined. The at least one component of the HVAC system is controlled according to the determined setting.

Techniques for group control using service data objects (SDO) are disclosed. A device controller is configured to perform operations including: receiving, from device controllers that are configured to control devices so that the devices operate based on a shared set point, SDO messages using an SDO protocol; determining that the device controller is a master device controller for the device controllers, based at least on the SDO messages; and sending a setpoint update message including a modified value of the shared set point, using the SDO protocol, to slave device controllers in the device controllers, wherein a slave device controller in the slave device controllers is configured to adjust operation of at least one slave device in the devices, based at least on the setpoint update message.

A testing apparatus includes multiple testing units arrayed in a first axial direction in plan view, the multiple testing units being configured to respectively press probes against electronic devices on chucks to test the electronic devices, multiple gas circulating units respectively disposed in areas each corresponding to one or more testing units among the multiple testing units, the multiple gas circulating units respectively including first fans configured to circulate a gas in the areas along a second axial direction in plan view, multiple temperature detecting units configured to respectively detect temperatures of the chucks, and a controller configured to control drive of the first fans of the multiple gas circulating units based on the detected temperatures of the chucks.