A riser assembly and an electronic device. Riser assembly configured to install expansion card on chassis and electrically connected to motherboard. The riser assembly includes first mounting frame and riser card. First mounting frame is configured to be mounted on chassis. Riser card includes plate body, riser card connector and expansion card connector. Plate body includes first surface and second surface that face away from each other. Riser card connector is disposed on first surface of plate body and protrudes from plate body. Expansion card connector is disposed on second surface of plate body and protrudes from plate body. Plate body is fixed to first mounting frame. Riser card connector is configured to be electrically connected to motherboard via cable, and expansion card connector is configured to be electrically connected to expansion card.

A flexible display motherboard includes a carrier substrate, a flexible substrate and a display device disposed on the flexible substrate, where a plurality of heating resistors are arranged between the carrier substrate and the flexible substrate, and a binding force between the heating resistor and the carrier substrate is greater than a binding force between the heating resistor and the flexible substrate; the flexible substrate has an extension portion filled between adjacent heating resistors, and a molecular chain structure of the extension portion forms a hydrogen bond with the molecular chain structure of the carrier substrate; the heating resistor is used for heating the carrier substrate and the flexible substrate, so that heat generated by the heating resistor breaks the hydrogen bond.

A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.

An all-in-one computer including a main body and an electronic assembly is provided. The main body includes a first casing part and a second casing part. The second casing part is movably connected to the first casing part and configured to move between a first position and a second position in relative to the first casing part, and the first casing part has an engaging portion and an electrical connection portion. The electronic assembly is disposed in the second casing part. When the second casing part is located at the first position, the second casing part is engaged with the engaging portion and the electronic assembly is connected to the electrical connection portion, and when the second casing part is located at the second position, the second casing part is departed from the engaging portion and the electronic assembly is departed from the electrical connection portion.

A fluid cooling system for an electronics package having a chassis is disclosed. The system includes an electronics package housed within a chassis, one or more mounting structures attached to the chassis, and a fluid cooling module interfaced with one or more electronics of the electronics package, the fluid cooling module housed within the chassis and mounted to the one or more mounting structures, where circulation of a fluid of the fluid cooling module cools the one or more electronics. A chassis fluid distribution manifold is used to connect with the chassis fluid inlet and outlet and to distribute fluid within the chassis.

A synergistic composition can be used to treat water containing nitrogen compounds and phosphorus compounds. The synergistic composition includes iron filings, clay particles, aluminum particles, and sand particles. The iron filings, clay particles, and aluminum particles act synergistically to remove nitrogen compounds and phosphorus compounds from water. Specifically, the clay particles attract the nitrogen compounds and the phosphorus compounds to be absorbed onto a surface of the iron filings and the clay particles. The aluminum particles react with the nitrogen compounds via an oxidation reaction to form ammonia compounds, and react with the phosphorus compounds to produce aluminum phosphate. As such, the synergistic relationship between the iron filings, clay particles, and aluminum particles remove nitrogen and phosphorus compounds from water and recover the compounds in usable forms, namely, ammonia and aluminum phosphate.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A computer case configured to dispose a motherboard and a graphics card therein is provided. The computer case includes an outer frame and a motherboard carrier. The outer frame includes a side surface. The motherboard carrier is connected to the outer frame and configured to dispose the motherboard thereon. A body of the motherboard carrier and the side surface form a predetermined angle of greater than 0°.

The present disclosure discloses a logic board assembly, a display device, and a liquid crystal display, the logic board assembly comprising a connection cable, a printed circuit board, a connector disposed on the printed circuit board, a timing controller, and a power chip, wherein the connection cable is pluggably connected to the connector, and the connection cable has a first state in good contact with the connector and a second state in abnormal contact therewith; the timing controller includes a detecting device and a control device, the detecting device configured to detect a state of the connector, the control device electrically connected to the power chip of the logic board assembly; when the connection cable is in the first state, the control device controls the power chip to be turned on, and when in the second state, the control device controls the power chip to be turned off.

The disclosure provides including a casing, a mother board, a hard disk drive module, a fan module, and an expansion module. The casing has a hard disk drive accommodation area, a fan accommodation area, and a motherboard accommodation area located between the hard disk drive accommodation area and the fan accommodation area. The motherboard is disposed in the motherboard accommodation area. The hard disk drive module includes hard disk drives. The fan module includes fans. The expansion module is selectively disposed in the hard disk drive accommodation area with the hard disk drives, or disposed in the fan accommodation area with the fans.