Various embodiments provide a direct current (DC)-DC converter circuit. The DC-DC converter circuit includes a control circuit to switch the DC-DC converter circuit between a charge state, a discharge state, and a tri-state mode. As part of a first control loop, the control circuit may switch the DC-DC converter between the charge state and the discharge state based on the output voltage to provide the output voltage with the target voltage level. Additionally, as part of a second control loop, the control circuit may switch the DC-DC converter between the charge state and the discharge state based on the current through an inductor of the DC-DC converter. The second control loop may provide overcurrent protection for the DC-DC converter. Other embodiments may be described and claimed.

A method comprising may include mechanically coupling a first main body to a second main body mechanically via a first mechanical feature such that distance between the first main body and the second main body is variable in a first direction, mechanically coupling a chassis engagement feature to the first main body via a second mechanical feature such that distance between the chassis engagement feature and the first main body is variable in a second direction perpendicular to the first direction, wherein the chassis engagement feature is configured to mechanically engage with a chassis when the information handling resource is engaged within the chassis, and mechanically coupling a card engagement feature to the first main body via a third mechanical feature such that distance between the card engagement feature and the first main body is variable in a third direction perpendicular to the first direction and the second direction, wherein the card management feature is configured to mechanically engage with the information handling resource at an edge of the information handling resource opposite of an edge connector of the information handling resource, such that when the information handling resource is engaged within the chassis, the adapter mechanically constrains movement of the information handling resource relative to the chassis.

A computing system including a housing assembly having a front and a rear, a CPU module positioned towards the front of the housing assembly and including a plurality of I/O connectors, and a plurality of I/O modules positioned towards the rear of the housing assembly, where each I/O module includes a second I/O connector. The computing system also includes a plurality of riser cards each having a PCB with opposing side surfaces, a front edge, a rear edge, a top edge, a bottom edge, a third I/O connector coupled to the bottom edge and a fourth I/O connector coupled to the rear edge. The third I/O connector on each riser card is connected to one of the first I/O connectors and the fourth I/O connector on each riser card is connected to one of the second I/O connectors so that the riser cards are oriented in parallel with each other.

A cable socket connector assembly for an electronic system includes a socket assembly having a socket substrate including socket substrate conductors. The socket assembly has socket contacts extending between terminating ends and mating ends with the terminating ends terminated to corresponding socket substrate conductors and the mating ends configured to be terminated to corresponding package contacts of an electronic package of the electronic system. The cable socket connector assembly includes a cable assembly terminated to the socket assembly having an array of cables each having a cable conductor terminated to a corresponding socket substrate conductor. The socket contacts and the corresponding socket substrate conductors define electrical paths between the cable conductors of the cables and the package conductors of the electronic package.

A processor unit module comprises an integrated circuit component attached to a top side of a printed circuit board and one or more electronic components (e.g., voltage regulator FETs, inductors) attached to a bottom side of the board. The printed circuit board is located between a top stiffener plate and a bottom stiffener frame and the three components are secured together by fasteners that connect the top stiffener plate to the bottom stiffener frame. Flexible thermal straps connect the top stiffener plate to one or more slugs located between the printed circuit board and the bottom stiffener frame. The slugs touch the bottom side of the board and are held in place by the bottom stiffener frame. Heat generated by the bottom side components is transported by the slugs and the thermal straps to a thermal management solution (e.g., heat sink, cold plate) attached to the top side of the module.

In one embodiment, a cooling device for providing liquid cooling to an electronics circuit board includes an upper module having a cooling plate forming an upper surface to receive an external circuit board having one or more electronic devices deposited thereon, the upper module having a first liquid distribution channel embedded therein to extract heat from the electronic devices of the circuit board through the cooling plate using a cooling liquid flowing in the first liquid distribution channel. The cooling device further includes a lower module having a second liquid distribution channel embedded therein to receive the cooling liquid from an external cooling liquid source, and the cooling device includes a plurality of tube channels positioned between the upper module and the lower module to receive the cooling liquid from the lower module and to supply the cooling liquid upwardly to the upper module.

A display motherboard and a manufacturing method thereof are provided. The display motherboard includes a first substrate and a second substrate that are assembled, a plurality of mutually independent display devices located between the first substrate and the second substrate, a first seal, and a second seal. The first seal is provided in a peripheral area of the display motherboard, the second seal is provided in a cutting area of the display motherboard, the cutting area is located around each of the display devices, and the second seal surrounds at least one of the display devices.

A socket connector includes a socket assembly having a socket frame, a socket substrate coupled to the socket frame and socket contacts terminated to the socket substrate. The socket substrate has first and second upper mating areas including first and second socket substrate conductors for mating with an electronic package and an electrical component, respectively. The socket contacts define an interface with the electronic package. The socket assembly is configured to electrically connect the electronic package with both a host circuit board and the electrical component.

A motherboard for a computer box having internal circuitry and communication ports comprises a portable motherboard having a connector for connection to an externally accessible connector of said computer box; wherein, connection of said portable motherboard connector to said externally accessible computer box connector enables said computer box to perform computing operations. The inventive motherboard is portably configured to serve one or more computers, preferably a personal computer or laptop. The portable motherboard provides a computer box with a brain. Alternatively, where a computer with a brain is slow, the portable motherboard may be used to boost the brainpower of the slow computer. Whether the portable motherboard brings life to a computer box or boosts the microprocessor power of a computer containing an internal microprocessor, the portable motherboard is a powerful invention that makes microprocessor power more efficient and ubiquitous.

A method comprising may include mechanically coupling a first main body to a second main body mechanically via a first mechanical feature such that distance between the first main body and the second main body is variable in a first direction, mechanically coupling a chassis engagement feature to the first main body via a second mechanical feature such that distance between the chassis engagement feature and the first main body is variable in a second direction perpendicular to the first direction, wherein the chassis engagement feature is configured to mechanically engage with a chassis when the information handling resource is engaged within the chassis, and mechanically coupling a card engagement feature to the first main body via a third mechanical feature such that distance between the card engagement feature and the first main body is variable in a third direction perpendicular to the first direction and the second direction, wherein the card management feature is configured to mechanically engage with the information handling resource at an edge of the information handling resource opposite of an edge connector of the information handling resource, such that when the information handling resource is engaged within the chassis, the adapter mechanically constrains movement of the information handling resource relative to the chassis.