A socket connector includes a socket assembly having a socket substrate and socket contacts. The socket substrate has first and second upper mating areas and a first lower mating area. The socket substrate has first and second socket substrate conductors at the first and second upper mating areas, respectively, and third socket substrate conductors at the first lower mating area electrically connected to corresponding first socket substrate conductors. The first socket substrate conductors are electrically connected to an electronic package, the second socket substrate conductors are electrically connected to an electrical component and the third socket substrate conductors are electrically connected to a host circuit board. The socket assembly is configured to electrically connect the electronic package with both the host circuit board and the electrical component. The socket contacts have a terminating end terminated to corresponding first socket substrate conductors and a mating end mated to package contacts.

A converter board, comprising: a printed circuit board, wherein the printed circuit board includes a cutout to form two opposing sides and an end; a guiderail attached to each opposing end, the guiderails to accept an option card; an end connector attached to the end, the end connector to connect to the option card when the option card is fully inserted into the cutout; and an edge connector to connect the converter board to a system, wherein the edge connector is connected to the end connector.

According to an example, a server may include a housing including a bottom portion, a first node defined by first and second printed circuit assemblies, and a second node defined by third and fourth printed circuit assemblies.

A chassis structure including a box body and a plurality of assembling components is provided. The box body includes a main plate and a plurality of side plates, wherein the side plates surround a periphery of the main plate and define an accommodating space. The assembling components are bonded to the main plate and are located in the accommodating space.

The present disclosure provides a display substrate, a method for preparing the same, and a display motherboard. The display substrate comprises: a plurality of display areas spaced apart from each other, each of which is provided with a plurality of spacers; and a blank area between any two adjacent display areas of the plurality of display areas, and provided with a plurality of supporters having the same material and height as the spacers. Since the blank area is provided with the supporters in the display substrate of this disclosure, the problem with uneven cell gap between the blank area and the display area under an action of atmospheric pressure is effectively avoided, thereby preventing the phenomenon that the display motherboard at a place with a greater cell gap presents a yellow color when displaying.

A Printed Circuit Board (PCB) mounting structure having an improved structure for improving assemblability of a product, and a display apparatus including the PCB mounting structure. The PCB mounting structure includes a mounting member provided on the PCB and a mounting portion provided on a chassis for mounting the PCB to the chassis without using screws.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

An information handling system motherboard integrates components through integrated wirelines, including at least some components coupled to the motherboard on opposite sides of a narrow region, such as formed by an opening that accepts a cooling fan. A bridge circuit board couples to contacts of the motherboard on opposing sides of the narrow region so that wirelines integrated in the bridge circuit board interface motherboard wirelines, thus offering greater communication density across the narrow region.

A high-density server includes a plurality of server enclosures, each of which includes an enclosure housing with a pair of module insertion/extraction parts, a pair of power source units, a plurality of cooling fans, and two pairs of server modules. Cooling fans are linearly aligned in a crosswise direction and positioned in proximity to the rear opening of the enclosure housing with upper rear openings and lower rear openings, while server modules are installed in module insertion/extraction parts inside the enclosure housing in an insertable/removable manner. Server modules have module trays for mounting electronic components and interface units. Interface units are retractively inserted into upper rear openings or lower rear openings in connection with power source units when server modules are moved in a lengthwise direction along module insertion/extraction parts inside the enclosure housing. The server enclosure is equipped with a redundant power transmitter establishing redundant multipoint-to-multipoint connections between power source units and server modules.