The embodiments described herein describe technologies for memory systems. One implementation of a memory system includes a motherboard substrate with multiple module sockets, at least one of which is populated with a memory module. A first set of data lines is disposed on the motherboard substrate and coupled to the module sockets. The first set of data lines includes a first subset of point-to-point data lines coupled between a memory controller and a first socket and a second subset of point-to-point data lines coupled between the memory controller and a second socket. A second set of data lines is disposed on the motherboard substrate and coupled between the first socket and the second socket. The first and second sets of data lines can make up a memory channel.

The present disclosure discloses a logic board assembly, a display device, and a liquid crystal display, the logic board assembly comprising a connection cable, a printed circuit board, a connector disposed on the printed circuit board, a timing controller, and a power chip, wherein the connection cable is pluggably connected to the connector, and the connection cable has a first state in good contact with the connector and a second state in abnormal contact therewith; the timing controller includes a detecting device and a control device, the detecting device configured to detect a state of the connector, the control device electrically connected to the power chip of the logic board assembly; when the connection cable is in the first state, the control device controls the power chip to be turned on, and when in the second state, the control device controls the power chip to be turned off.

Connector receptacles and device enclosures that can provide proper grounding, improved ventilation, and an aesthetically pleasing appearance. An example can include a device enclosure including an enclosure wall and sleeves for a number of connector receptacles. Each sleeve can electrically contact a shield of a corresponding connector receptacle via a conductive structure, such as a conductive gasket, to provide a good ground path. The sleeves can be narrow at the enclosure wall for improved ventilation and an aesthetically pleasing appearance.

A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.

A computing device for cooling an electronic component is provided. The computing device includes a chassis with a first end and a second end; fan modules located at the first end of the chassis; and a Peripheral Component Interconnect Express (PCIe) baseboard located at a front side of the chassis. The PCIe baseboard is configured to support placement thereof in the chassis in a first position and a second position. The second position of the PCIe baseboard is a 180-degree rotation from the first position. The PCIe baseboard includes GPU slots for installing a plurality of graphic processing units (GPUs), the GPUs including fan modules.

An electronic device includes: a casing; and an electronic circuit board housed within the casing. The electronic device further includes a protector which is provided on a surface of the electronic circuit board that faces the casing. The height of the protector is larger than the height of an electronic component mounted on the surface of the electronic circuit board that faces the casing. In a state that the electronic circuit board is housed within the casing, the protector abuts on a surface of the casing that faces the electronic circuit board.

A fan expansion card includes a first circuit board and at least one first fan. The first circuit board has at least one through-hole. The first circuit board includes a first connection port having a PCI-E interface. Each of the first fans is disposed at a position on the first circuit board corresponding to the through-hole. The first fan is electrically connected to the first circuit board, wherein an airflow generated by each of the first fans passes through the corresponding through-hole. A motherboard module having the above fan expansion card is further provided.

An electronic device with a magnetically attached electronic component is described herein. An electronic device includes a housing and an electronic component. The electronic component is positioned within the housing and magnetically attached to an internal surface of the housing via a magnetic force between the electronic component and the internal surface of the housing. During manufacturing, the electronic component can be magnetically attached to the internal surface of the housing by aligning one or more magnetic attachment points of the electronic component within magnetic proximity to one or more corresponding magnetic attachment points of the internal surface of the housing of the electronic device to magnetically attach the electronic component to the internal surface of the housing.

A bracket for mounting a processor and a support structure for receiving bracket-supported processors for cluster computing are provided. In some embodiments, a bracket may be configured to receive a processor and fasten the processor to the bracket. The bracket may be configured to mount the processor to a support structure. The support structure may be configured to receive an array of brackets. The support structure may be configured to be stacked in combination with additional support structures.